דרושים » ייצור ותעשייה » Senior Mechanical Designer

As an R&D Mechanical Engineer at Augury, you will own the design of new parts and assemblies, design parts for machining and injection molding, perform analytical calculations and V&V tests.

Youll work closely with mechanical, hardware, V&V, sustain, manufacturing, and external sub contractors, to deliver innovative, reliable, and scalable IoT devices.

A Day In Your Life
Design mechanical parts and mechanisms, for highly challenging environments, from initial concepts, through all design phases, until transfer to production.
Master 3D CAD models and drawings for mechanical components, assemblies, jigs, and fixtures (including release management and GD&T).
Design for plastics: mostly parts for injection molding, compression and other classical manufacturing methods.
Run prototype validation: mechanical inspection, stress testing, sealing, field testing and support high level system validation procedures.
Cooperate with multidisciplinary teams (HW, V&V, FW, Algo), utilizing analytical thinking and strong theoretical background.
Transfer parts for production, in collaboration with the engineering team, and following product lifecycle methodologies.
Work with subcontractors and vendors in Israel and internationally.

we are looking for a Senior Mechanical Engineer.
In this role, you will lead all mechanical aspects of the product in R&D projects, taking it from concept to full scale development while working with multidisciplinary teams that include system engineering, physics, electronics, software, project managers, and others. You will serve as a technical focal point for mechanical design decisions, balancing performance, manufacturability, reliability, and cost.
Your role:
Lead the mechanical design including 3D models, drawings, prototype manufacturing, and production transfer.
Provide solutions that optimize performance, service, manufacturability, and cost.
Perform required analysis, testing, troubleshooting, and documentation.
Work with local and global teams inside and outside Philips to answer design, service, and production challenges.
Own mechanical risk identification, mitigation plans, and design reviews
Operate in a multidisciplinary environment under conflicting constraints of performance, reliability, cost, and development schedule.

We are looking for a Mechanical Design Engineer to join our Electronic Warfare R&D team and work on mechanical development of advanced counter-UAV detection and jamming systems.

Key Responsibilities
Lead full-cycle mechanical design of electronic and RF system assemblies - from initial architectural concept, thermal and structural analysis, and PCB integration to volume serial production
Perform structural, thermal, and modal analyses.
Select suitable materials, components, and manufacturing technologies.
Manage development and engineering processes end-to-end: from concept, through prototyping, to full production implementation, ensuring quality and supply chain standards.
Prepare drawings, production files, and BOMs according to ISO standards.
Develop mechanical solutions for multidisciplinary systems (mechanics, RF, electronics, aeronautics).
Define and design cable assemblies, including cable routing and integration within the system
Conduct verification and validation testing.
Work with advanced CAD tools: SolidWorks for design and PDM for production document management.

This position refers to leading the design of parts and assemblies for the company imaging systems (PET, SPECT). The position includes working inside an NPI project or supporting the systems in the field (Install Base). The mechanical design of parts and assemblies includes working with multi-disciplinary teams including electronics, system engineering, service engineering and involves transfer of designs to production, support of high-level-assembly lines, etc. This position involves the writing of safety files, planning and execution of V&V tests, engineering calculations and FEA simulations, writing specifications and failure analysis.
Job Description
Essential responsibilities:
Mechanical design derived from specifications (as well as writing specifications), as part of a multi-disciplinary team of parts and assemblies while using off-the-shelf components, using 3D CREO CAD design package. Presenting the design in technical design reviews at the levels of concept and detail design is a part of this position,
Developing creative design solutions in response to the product requirements of functionality, reliability, cost, manufacturability, etc.,
Support of company products at hospital and customer sites via the Service Teams as needed,
Building safety files for products, including strength calculations, failure modes analysis (FMEA), compliance with safety and medical industrial standards as well as internal company standards,
Supporting transfer to production, defining basic assembly and service instructions, working with parts suppliers,
Defining verification and validation test procedure, tests execution and report writing.
Essential qualifications /requirements:
Mandatory: 1st degree in mechanical engineering
Mandatory: Good personal, teamwork and communication skills, enthusiasm from study, self-motivated, results oriented,
Work experience of 2 years in mechanical design, with experience in at least 2 of the following: design of motion systems, large welded or cast structures and frames, mechanisms, electronic packaging, large sculptured FRP covers, electrical design support (DXF, cables routing),
Experience in machining and sheet metal technologies,
Experience in prototype building (hands on), testing execution per test plan and failures troubleshooting
Fluent English at presentation level in technical design reviews, Zoom/Teams calls and in writing.
Desired Characteristics by priority:
Leading tasks from requirements to engineering change finalization,
System level understanding in multi-disciplinary project environment,
Definition of testing and report writing,
Experience in design for cost, reliability, serviceability and for manufacturability.
Ability to perform finite-element analysis and Excel level technical calculations,
we are a leading global medical technology and digital solutions innovator. Our mission is to improve lives in the moments that matter. Unlock your ambition, turn ideas into world-changing realities, and join an organization where every voice makes a difference, and every difference builds a healthier world.

We are looking for a highly skilled Senior Thermal-Mechanical Engineer to join our mechanical engineering team as a key player in the development of next-generation high-performance compute platforms for autonomous driving systems.
This key position includes leading the thermal-mechanical design and cooling architecture of advanced electronic systems throughout all lifecycle stages-from concept to mass production-while working closely with hardware, PCB layout, mechanical, validation, manufacturing, suppliers, and customers.
What will your job look like?
Lead the thermal-mechanical design process from concept through validation, NPI, and production.
Define cooling architectures and optimize air- and liquid-cooling solutions for high-power electronic systems.
Perform thermal simulations and analyses using tools such as Icepak, FloTHERM, Fluent, or equivalent.
Perform mechanical simulations and analyses using tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Correlate simulation results with lab measurements and drive solutions that meet system requirements.
Lead thermal validation, prototyping, environmental testing, and reliability activities.
Collaborate closely with cross-functional teams, suppliers, subcontractors, and customers.
Support mechanical design and serve as a technical focal point for complex thermal-mechanical challenges.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.

Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.