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לפני 8 שעות
חברה חסויה
Location: Haifa
Job Type: Full Time
we are looking for a Senior Mechanical Engineer.
In this role, you will lead all mechanical aspects of the product in R&D projects, taking it from concept to full scale development while working with multidisciplinary teams that include system engineering, physics, electronics, software, project managers, and others. You will serve as a technical focal point for mechanical design decisions, balancing performance, manufacturability, reliability, and cost.
Your role:
Lead the mechanical design including 3D models, drawings, prototype manufacturing, and production transfer.
Provide solutions that optimize performance, service, manufacturability, and cost.
Perform required analysis, testing, troubleshooting, and documentation.
Work with local and global teams inside and outside Philips to answer design, service, and production challenges.
Own mechanical risk identification, mitigation plans, and design reviews
Operate in a multidisciplinary environment under conflicting constraints of performance, reliability, cost, and development schedule.
Requirements:
B.Sc. in Mechanical Engineering
5+ years of experience in mechanical design as part of multi-disciplinary systems or products
Experience with CREO / Pro E or equivalent professional CAD systems
Experience with design of metal components and assemblies including manufacturing of high precision casted and machined parts and tolerance analysis
Experience with high standard documentation - specification documents, mechanical design documents & test protocols
Demonstrated ability to independently drive technical decisions
Highly motivated and self-driven team player
Fluent English
Advantages:
M.Sc. in Mechanical Engineering
Experience working on mechanical design of electronic components including heat transfer considerations
FEA capabilities with ANSYS Workbench Mechanical
Medical industry background
Knowledge of IDEAS
This position is open to all candidates.
 
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Location: Haifa
Job Type: Full Time
We are looking for a highly skilled Senior Thermal-Mechanical Engineer to join our mechanical engineering team as a key player in the development of next-generation high-performance compute platforms for autonomous driving systems.
This key position includes leading the thermal-mechanical design and cooling architecture of advanced electronic systems throughout all lifecycle stages-from concept to mass production-while working closely with hardware, PCB layout, mechanical, validation, manufacturing, suppliers, and customers.
What will your job look like?
Lead the thermal-mechanical design process from concept through validation, NPI, and production.
Define cooling architectures and optimize air- and liquid-cooling solutions for high-power electronic systems.
Perform thermal simulations and analyses using tools such as Icepak, FloTHERM, Fluent, or equivalent.
Perform mechanical simulations and analyses using tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Correlate simulation results with lab measurements and drive solutions that meet system requirements.
Lead thermal validation, prototyping, environmental testing, and reliability activities.
Collaborate closely with cross-functional teams, suppliers, subcontractors, and customers.
Support mechanical design and serve as a technical focal point for complex thermal-mechanical challenges.
Requirements:
B.Sc. / M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
8+ years of experience in thermal-mechanical design of electronic systems.
Strong expertise in air- and liquid-cooling solutions for high-power electronics.
Experience with thermal simulation tools such as Icepak, FloTHERM, Fluent, or equivalent.
Strong understanding of heat transfer, fluid dynamics, electronics packaging, and thermal management.
Experience with mechanical simulation tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Experience taking products from development through production.
Excellent communication skills in Hebrew and English.
Nice to have:
Experience with both air- and liquid-cooling solutions.
Advanced PCB/package thermal modeling experience.
Experience with thermal-mechanical reliability analyses.
Experience working with Tier-1/OEM customers.
Experience with automotive products, ECUs, or autonomous driving systems.
This position is open to all candidates.
 
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29/09/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
As an R&D Mechanical Engineer at Augury, you will own the design of new parts and assemblies, design parts for machining and injection molding, perform analytical calculations and V&V tests.

Youll work closely with mechanical, hardware, V&V, sustain, manufacturing, and external sub contractors, to deliver innovative, reliable, and scalable IoT devices.

A Day In Your Life
Design mechanical parts and mechanisms, for highly challenging environments, from initial concepts, through all design phases, until transfer to production.
Master 3D CAD models and drawings for mechanical components, assemblies, jigs, and fixtures (including release management and GD&T).
Design for plastics: mostly parts for injection molding, compression and other classical manufacturing methods.
Run prototype validation: mechanical inspection, stress testing, sealing, field testing and support high level system validation procedures.
Cooperate with multidisciplinary teams (HW, V&V, FW, Algo), utilizing analytical thinking and strong theoretical background.
Transfer parts for production, in collaboration with the engineering team, and following product lifecycle methodologies.
Work with subcontractors and vendors in Israel and internationally.
Requirements:
BSc Mechanical Engineering.
3-5 years of experience as a Mechanical engineer in R&D, with hands-on experience.
Experience in classic machine design: Parts, assemblies, and mechanisms.
Proven knowledge in manufacturing methods: Machining, injection molding, coatings, materials (aluminium, stainless steel, polymers), and geometric tolerances.
Familiarity with NPI processes, DFM, DFX, and transfer to production.
High proficiency in 3D CAD (Onshape, SolidWorks).
Ability to independently lead initiatives and navigate ambiguous environments with changing priorities.
Analytical thinking skills and a data-driven, structured engineering approach.
This position is open to all candidates.
 
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02/09/2026
Location: Haifa
Job Type: Full Time
we are an agile defense-tech startup tackling the most complex challenges in counter-drone and uncrewed defense. With hundreds of combat-proven systems deployed by the IDF and global partners, we are now engineering the next generation of C-UxS (Counter-Uncrewed Systems). We leverage advanced electronic warfare and kinetic measures to detect and neutralize hostile threats. If you want to push technological boundaries while safeguarding Israel and our allies, join us at this pivotal stage of our growth.
This is a unique opportunity to join a company at a pivotal growth stage and help shape its products, culture, and future.
We are looking for a Mechanical Design Team Leader to lead the mechanical engineering activities within our kinetic interception team, where we use racer drones for C-UAS interception. This is a hands-on leadership role at the heart of the practical R&D of our drones and their supporting platforms. The Team Leader will combine direct engineering contribution with technical mentoring, work planning, and responsibility for the quality and timely delivery of the team's mechanical designs.
Key Responsibilities
Lead, mentor, and develop the mechanical team (recruiting, onboarding, feedback), while planning work and allocating resources to match program milestones and priorities.
Drive the mechanical architecture and technical direction of autonomous racer drones, launchers, and platforms, remaining hands-on in design, prototyping, integration, and testing.
Lead design reviews (meeting performance, reliability, safety, cost) and establish strict engineering practices including CAD standards, GD&T, BOMs, ECOs, and PLM workflows.
Oversee the mechanical integration of electronics, harnesses, and electromechanical components; coordinate structural analysis, design validation, prototype builds, and translate test results into improvements.
Identify and mitigate technical/schedule risks, and collaborate closely with systems, software, manufacturing, suppliers, operations, and leadership.
Requirements:
8+ years of hands-on mechanical design experience, with a strong background in defense or aerospace industries
2+ years of experience leading or technically mentoring mechanical engineers, including work planning and task prioritization
Proven track record of delivering complex multidisciplinary products from concept to production readiness, specifically with UAVs/drones (racer/high-performance platforms are a strong advantage).
Advanced SolidWorks expertise (complex assemblies, drawings, PDM/PLM), strong command of CAD reviews, GD&T, and engineering documentation (BOMs, product trees, ECOs).
Extensive experience building, troubleshooting, and testing prototypes in a lab/workshop, overseeing mechanical integration of electronics, harnesses, and embedded hardware (launchers/deployment mechanisms are an advantage).
Ability to perform/coordinate structural analysis and design validation (FEA is a plus), backed by strong communication skills to provide clear technical direction and collaborate cross-functionלי (multidisciplinary work).
This position is open to all candidates.
 
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חברה חסויה
Location: More than one
Job Type: Full Time
We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.
Requirements:
M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
5+ years of relevant experience in thermal engineering for electronic systems, semiconductor packages, ECUs, or high-performance computing.
Strong expertise in heat transfer, fluid mechanics, thermal management, and thermal/CFD simulation using dedicated thermal simulation tools such as Celsius EC, Icepak, FloTHERM or equivalent.
Proven experience developing and validating air and/or liquid-cooling solutions for high-power electronics, with demonstrated experience taking products through qualification, NPI, and mass production.
Demonstrated ability to independently lead complex technical activities across multiple engineering disciplines.
Excellent technical communication skills in English.
Nice to have:
Experience in semiconductor package thermal design and characterization.
Background in automotive ECUs, high-performance compute platforms, and automotive qualification.
Hands-on experience with advanced cooling technologies, including heat pipes, vapor chambers, and cold plates.
Experience working with Tier-1 suppliers, OEMs, packaging houses, and thermal solution vendors.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: More than one
Job Type: Full Time
We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.
Requirements:
M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
5+ years of relevant experience in thermal engineering for electronic systems, semiconductor packages, ECUs, or high-performance computing.
Strong expertise in heat transfer, fluid mechanics, thermal management, and thermal/CFD simulation using dedicated thermal simulation tools such as Celsius EC, Icepak, FloTHERM or equivalent.
Proven experience developing and validating air and/or liquid-cooling solutions for high-power electronics, with demonstrated experience taking products through qualification, NPI, and mass production.
Demonstrated ability to independently lead complex technical activities across multiple engineering disciplines.
Excellent technical communication skills in English.
Nice to have:
Experience in semiconductor package thermal design and characterization.
Background in automotive ECUs, high-performance compute platforms, and automotive qualification.
Hands-on experience with advanced cooling technologies, including heat pipes, vapor chambers, and cold plates.
Experience working with Tier-1 suppliers, OEMs, packaging houses, and thermal solution vendors.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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דיווח על תוכן לא הולם או מפלה
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סגור
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: More than one
Job Type: Full Time
We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.
Requirements:
M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
5+ years of relevant experience in thermal engineering for electronic systems, semiconductor packages, ECUs, or high-performance computing.
Strong expertise in heat transfer, fluid mechanics, thermal management, and thermal/CFD simulation using dedicated thermal simulation tools such as Celsius EC, Icepak, FloTHERM or equivalent.
Proven experience developing and validating air and/or liquid-cooling solutions for high-power electronics, with demonstrated experience taking products through qualification, NPI, and mass production.
Demonstrated ability to independently lead complex technical activities across multiple engineering disciplines.
Excellent technical communication skills in English.
Nice to have:
Experience in semiconductor package thermal design and characterization.
Background in automotive ECUs, high-performance compute platforms, and automotive qualification.
Hands-on experience with advanced cooling technologies, including heat pipes, vapor chambers, and cold plates.
Experience working with Tier-1 suppliers, OEMs, packaging houses, and thermal solution vendors.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Lead Service Integrator (LSI)
Job Description Summary
The Lead Service Integrator is responsible for activities relating to enhancing services technology for Molecular Imaging systems integrating customer data, or capturing products reliability, availability, maintenance, safety, and other performance parameters.
Service activities for Molecular Imaging products (MI, PET and SPECT) include service-related system conceptual design, requirements development, FMEA, service features integration, and providing support to field engineers.
Duties include (but are not limited to):
The Service Engineer position is responsible for ensuring on-time delivery of service product features, technical publications, training, global parts availability, and service process validation. The position provides exposure to the entire system and requires communication with all functions in the organization and will be involved in the full life cycle of the product from definition to verification/validation and installed base support.
Development of service design concepts and features based on MI user needs and allocate to subsystems based on design concept decomposition and trade off studies.
Specifying CTQs and requirements, documenting service design, and participating in service-related verification activities.
Ensuring that MI systems, subsystems, or component designs meet service requirements, from install, troubleshooting, repair, to preventive and proactive maintenance.
Setting FRU strategies and interfacing with external organizations such as GPRS and Service Operations
Working with customers, field engineers and engineering to solve field issues.
Analyzing maintenance related aspects from the field and delivering and incorporating feedback results into new hardware, software, and service specifications.
Driving service metrics analyzing, reporting and improvements (I&W, spare part consumption, etc.)
Preparing all service documentation.
Requirements:
Required Qualifications:
BSc in Mechanical/ Electrical/ Biomedical Engineering, or Physics.
at least 3 years work experience in the Engineering/Technology & Service Engineering
Advantage - experience in more than one engineering position, either in a single or multiple workplaces
Experience in medical systems and independent by nature and Self-learner - advantages.
Desired Characteristics:
Strong oral and written communication skills. Demonstrated ability to analyze and resolve problems. Ability to document, plan, market, and execute programs.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
5 years of experience in signal or power integrity or hardware design.
Preferred qualifications:
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Proficiency in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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27/09/2026
Location: Haifa
Job Type: Full Time
We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.
Requirements:
Basic Qualifications
- Bachelor's degree in Electrical Engineering or a related field.
- Master's degree in Mechanical or Electrical Engineering or a related field.

Preferred Qualifications
- Knowledge of SoC architecture.
- Experience with microelectronic packaging.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Verification Engineer
Job Description Summary
Responsible for running various verification activities on PET medical products that covers multi-disciplinary aspects from SW/HW, electronics, mechanics, physics, image quality and radiation - which is safety for users and monitored by a tag all the time.
Job Description:
Responsible for planning and implementing verification methodologies and ensuring proper fulfillment of system and sub-system requirements.
Responsible for reviewing various product designs, verifying its functionality in agile testing methods.
Responsible to determine the testing environments and tools.
Analyze and debug system failures and issue found during testing, while delivering detailed reports identifying these issues for further investigation.
Work closely with development teams
Non-hybrid, full-time position on site
Flexible on working hour, including 2-3 evening shifts (14:00-23:00) per week as needed
Working on global programs that required tight collaboration with global and Israel teams.
Requirements:
B.Sc. in Bio-Medical / Mechanical / Electronic Engineering / Or Equivalent Experience.
+3 years of experience in multi-disciplinary medical products manual/automation testing, with strong knowledge of software QA processes
Good documentation skills of test design and scripts for complete coverage of detailed system requirements
Quality focus, willingness to learn, versatility and adaptability.
Good organizational skills and strong written and verbal communication.
Excellent English communication skills, both written and verbal.
Advantages:
Experience >5 years as verification engineer in medical device (PET/SPECT) companies
Experience with Agile methodology
Experience with Linux and MATLAB
Experience with Python & automation development
Experience with test tools and frameworks (such as: ALM, Rally, Doors & Compass).
This position is open to all candidates.
 
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