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לפני 2 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking an experienced Team Leader to lead our Failure Analysis engineering group within the Product Engineering team. You will be responsible for controlling and improving the quality of our hardware products through technical leadership, data-driven insights, and global production support. This role requires deep expertise in electronics systems, failure methodologies, production process control, and proven leadership capabilities across multiple geographies.



Key Responsibilities

Lead, mentor, and develop a team of failure analysis engineers while providing technical guidance on complex hardware issues.
Drive continuous improvement of quality KPIs through root cause analysis (RCA), statistical analysis, and yield optimization across all products.
Establish and implement standardized failure analysis methodologies, debug protocols, and quality control processes across global production sites.
Serve as the technical focal point for product design and functionality, supporting the team across RF, embedded, FPGA, high-speed communication, and mixed-signal systems.
Collaborate across Design, Manufacturing, Supply Chain, and Sales teams to resolve critical issues and prevent yield impact.
Manage vendor/supplier escalations and conduct design DFT/DFM (Design for Test/Manufacturability) analyses.
Lead investigation of production crises and manage critical path issues under time pressure.
Requirements:
6+ years in hardware design and failure analysis; minimum 2 years in a leadership role- Must.
Deep understanding of electronics production processes, DFT principles, and manufacturing constraints- Must.
Strong hands-on lab expertise: proficiency with oscilloscopes, logic analyzers, VNA, and automated test equipment-Must.
Demonstrated experience with production testing workflows, yield analysis, and statistical process control.
Proven ability to conduct systematic root cause analysis and communicate findings to senior management.
Excellent cross-functional collaboration and technical communication skills.
Bachelor's degree in Electronics Engineering or equivalent.
This position is open to all candidates.
 
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08/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
We are seeking an experienced HW Team Leader to drive the engineering efforts behind our electronic systems. This role will focus on enhancing the testability, production efficiency, and quality of our products by defining Design for Testability (DFT) strategies, developing production test solutions, and leading failures investigation and correction.
What You'll Do:
Lead and mentor a team of highly skilled hardware engineers.
Drive execution in a fast-paced, multi-project environment.
Own and evolve our Design for Testability (DFT) strategy and guidelines.
Lead end-to-end development of production test solutions and test facilities.
Drive root-cause investigations, failure analysis, and product improvement initiatives.
Collaborate closely with R&D, manufacturing, and quality teams to ensure product reliability and production readiness.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Electronics Engineering, or a related field. - Must
5+ years of leadership experience in Hardware Engineering, System Design, or Product Engineering.-Must
Strong experience with board design and complex multidisciplinary systems.- Must
Deep understanding of DFT methodologies and production test strategies.
Hands-on experience with debugging, failure analysis, and lab equipment.
Strong leadership, communication, and problem-solving skills.
Ways to stand out:
Experience with automated test equipment (ATE).
Scripting and automation experience (Python, LabVIEW, etc.).
Knowledge in FPGA Design and Verilog coding.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. This is an opportunity to create silicon and follow it into the field (and back!) to drive improvements for the next-generations of chips.
In this role, you will understand Integrated circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure robust silicon and package verification.
Execute comprehensive silicon and package qualification programs (including HTOL, ELFR, ESD/LU, b/HAST, etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze large-scale data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through manufacturing.
Experience with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience in statistical data analysis using tools such as JMP, Python, or JSL.
Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques.
Knowledge of Design-for-Reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the SoCs that power these data centers by driving quality and reliability processes from the integrated circuit perspective. You will create silicon and follow it into the field (and back) to drive improvements for the next generations of chips.
You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.

Responsibilities
Drive the strategic definition and development of design-for-reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge/latch-up (ESD/LU), biased highly accelerated stress test (b/HAST), etc.) and conduct failure analysis to resolve quality issues.
Extract and analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability lifecycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.

Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JSL.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
You will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis is expected. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Establish and direct the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge and latch-up (ESD/LU), and biased highly accelerated stress test (b/HAST)) and conduct in-depth failure analysis to resolve quality issues.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
4 years of experience in Integrated Circuit (IC) silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JMP Scripting Language (JSL).
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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03/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are looking for an experienced Electronics Engineer to join our growing R&D Hardware team and lead and deliver Hardware projects.
A day in the life and how youll make an impact:
Design & Build: Architect and develop electrical modules from concept through production, including PCB design for new systems and continuous improvement of existing ones.
Integrate & Innovate: Bring new components and sensors into our companys product line, working across power supply, communication protocols (I2C, Ethernet, UART), and supporting modules.
Troubleshoot & Lead: Serve as the go-to expert for diagnosing and resolving complex electrical faults - you set the standard for root-cause problem-solving.
Collaborate Cross-Functionally: Partner closely with systems engineers, mechanical engineers, and software teams to shape next-generation features and products from the ground up.
Own Vendor Relationships: Manage subcontractor relationships for end-to-end module delivery, ensuring quality and timelines stay on track.
Requirements:
BSc in Electrical Engineering or equivalent.
5+ years of experience as an Electrical engineer in a multidisciplinary company.
Proficiency in electronic circuit board design and development.
Proven experience in integrating new components into the system, including
power supply, communication (I2C, Ethernet, UART), and other supporting modules.
Experience in end-to-end module ownership, including work with subcontractors.
Experience working with programmable logic array modules.
Experience with development SW. (Altium advantage)
Experience with experiments and jig design
Highly motivated, determined, and a team player.
Able to own lead and deliver with a proactive approach.
Readiness to work in a challenging startup environment.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
8 years of experience in technical leadership.
Experience in one of the following areas: arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Experience developing RTL for ASIC subsystems.
Preferred qualifications:
Experience working with design networking like: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in TCP, IP, Ethernet, PCIE and DRAM including Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
Experience architecting networking switches, end points, and hardware offloads.
Understanding of packet classification, processing, queuing, scheduling, switching, routing, traffic conditioning, and telemetry.
This position is open to all candidates.
 
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25/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an experienced Senior System Integration Engineer to join our team.

The role involves planning and executing system integration activities across multiple subsystems, from development through production. You will work with complex systems combining software, computing, IP networks, communications, RF, navigation & control, algorithms, and computer vision.

Responsibilities
System operation and troubleshooting, planning and executing integration processes, writing integration test specifications, preparing performance validation tests, and analyzing system behavior and performance.
Requirements:
Requirements
Practical Engineer / B.Sc. in Electrical & Electronics Engineering, Systems Engineering, Software Engineering, Computer Science, or equivalent technological military background.
3+ years of hands-on experience in system integration and/or testing of complex multidisciplinary systems.
Hands-on experience with communication interfaces and protocols such as TCP/IP, UDP, RS-422, SNMP, WebSocket, REST API, or MIL-STD-1553.
Experience with network monitoring/sniffer tools, troubleshooting, traffic analysis, and system performance investigation.
Ability to plan and execute integration processes, analyze system-level issues, and work with complex test environments.
Good understanding of complex system development lifecycles.
Strong interpersonal skills, independent learning abilities, and a proactive approach.
Good English- reading and writing.

Advantages
Experience in RF, communications, radar, EW, or SIGINT, including RF test equipment.
Experience developing or working with test equipment.
Familiarity with switches, routers, and networking equipment.
Experience with production transfer processes.
Scripting experience with Python, MATLAB, C#, C, Bash, Perl, or similar.
Linux experience and familiarity with JIRA/TFS.
Experience using AI tools.
This position is open to all candidates.
 
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08/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.
This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for control systems.
Responsibilities:
Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.
Requirements:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
Advantages:
Experience with Versal architecture, including NoC design and integration.
Background in ASIC design or verification.
Familiarity with FPGA backend flows and static timing analysis (STA).
Scripting experience (Python, TCL, Makefile) and/or C/C++ knowledge
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC Hardware Quality and Reliability Engineer
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Own technical specifications, architectural definitions, and physical power-on of custom qualification vehicles (HTOL load boards, ESD fixtures, latch-up rigs). Drive external layout vendors to achieve seamless electrical correlation with ATE environments.
Govern execution quality of applied stresses, define electrical, thermal, and telemetry parameters on test vehicles to ensure uniform, valid stress profiles without unintended overstress or setup artifacts.
Lead the end-to-end engineering delivery lifecycle for qualification hardware, map and drive critical cross-functional dependencies across internal validation and product engineering teams to ensure on-time readiness.
Serve as the primary technical interface for external PCB layout houses, fabrication shops, and component suppliers; manage design reviews, track lead times, and enforce delivery schedules.
Lead laboratory troubleshooting for qualification hardware anomalies; isolate setup/socket faults from true silicon failures and drive supplier corrective actions (CAPA) when board excursions occur.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, related fields, or equivalent practical experience.
8 years of experience in hardware engineering, with a focus on authoring technical specifications, reviewing electrical layouts, and driving verification of semiconductor tests or validation platforms.
Experience driving deliverables and managing quality standards with external layout vendors, board design houses, or hardware component suppliers across multiple global geographies.
Experience working within specialized semiconductor reliability or test laboratories including configuring component Burn-In ovens, high-power stress load boards, ESD simulators, and Latch-Up test setups.
Experience managing engineering hardware delivery schedules, tracking cross-functional milestones, and meeting New Product Introduction (NPI) timelines.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience managing the design execution cycle of complex multi-layer test vehicles through third-party design houses or layout vendors from concept sign-off to laboratory delivery.
Experience defining and verifying electrical correlation baselines between environmental stress setups and High-Volume Manufacturing (HVM) ATE environments.
Deep familiarity with JEDEC silicon qualification hardware standards and how they dictate physical board testing constraints.
Strong background analyzing the quality of stress factors, including power distribution networks (PDN), signal integrity degradation across extended thermal loops, and transient load behavior during reliability cycles.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783531
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לפני 2 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.

This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for quantum control systems.

Responsibilities

Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.
Requirements:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8826212
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