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לפני 15 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking a highly driven, hands-on Operations Production Engineer to join our Operations & Manufacturing team. In this role, you will serve as the primary operational link to our Contract Manufacturers (CMs), drive the end-to-end NPI handoff process into steady-state production, manage legacy product lines, and streamline the production-side RMA pipeline.
If you thrive in a high-growth, fast-paced hardware environment, love diagnosing complex manufacturing challenges, and are passionate about continuous improvement, this is the role for you.
Key Responsibilities:
Contract Manufacturer (CM) Management & Line Ownership:
CM Operations & Execution: Drive day-to-day operational and technical alignment with external CMs to ensure high build execution, product yield, and strict adherence to quality and schedule targets.
Manufacturing Bottlenecks: Identify and resolve yield drops, component shortages/substitutions, or assembly issues directly with vendor engineering teams.
ECO/ECN Release: Oversee engineering change implementation across active production runs at the CM, maintaining clear configuration control.
NPI Composition Handoff & Legacy Product Support:
NPI to Production Handoff: Lead the operational composition and transfer of new product introductions (NPI) from R&D into scalable volume manufacturing at the CM level.
Legacy Product Management: Maintain operational health, sustaining engineering, and end-of-life (EOL) management for legacy product lines to ensure ongoing delivery stability.
Process Documentation: Define standard operating procedures (SOPs), assembly routing, build packages, and work instructions for incoming product variants.
Production RMA Process:
RMA Pipeline Management: Take ownership of the production side of the Return Merchandise Authorization (RMA) process, ensuring rapid triage, dispositioning, and turnaround times.
Feedback Loop: Feed critical quality, design, and manufacturing insights back to R&D and Quality teams to drive design-for-manufacturability (DFM) improvements.
Continuous Improvement:
Yield & Efficiency Optimization: Track key operational metrics (First Pass Yield, Scrap, Cycle Time) and implement engineering fixes to minimize waste and reduce lead times.
Tooling & Fixturing: Coordinate with suppliers to design, validate, or upgrade assembly fixtures, jigs, and test setups.
Requirements:
Must-Have
Education: B.Sc. in Industrial Engineering,g Mechanical Engineering, Electrical Engineering, or a related technical discipline.
Experience: 3-5+ years of experience as a Production, Manufacturing, or NPI Engineer in a fast-paced, multi-disciplinary hardware environment.
Domain Expertise: Proven background working with high-precision electronics, RF systems, or advanced scientific control equipment.
CM Oversight: Hands-on experience managing external Contract Manufacturers (assembly lines, technical alignment, yield tracking, and performance reviews).
NPI & Legacy Management: Demonstrated ability to manage NPI handoff composition into volume production, as well as sustaining/legacy product management.
RMA Management: Proven track record running and dispositioning production-side RMA workflows.
Systems & Processes: Strong working knowledge of PLM/ERP/MES systems (e.g., Agile, Jira, Priority, NetSuite, SAP).
Communication: Excellent verbal and written English skills for effective cross-functional collaboration with R&D, Supply Chain, and external vendor leadership.
Nice-to-Have:
Lean Six Sigma: Lean Six Sigma certification (Green/Black Belt) or practical experience with Lean manufacturing tools and continuous improvement methodologies.
Soft Skills:
High degree of ownership and accountability
Strong communication and cross-functional collaboration skills
Detail-oriented and structured and creative approach to problem-solving
Ability to manage multiple tasks in a fast-paced environment.
This position is open to all candidates.
 
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לפני 15 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
Required Director of Manufacturing Engineering
Description
The Director of Manufacturing Engineering will lead the Manufacturing Engineering organization, driving the successful transition of new products from development into volume production while ensuring manufacturing excellence across all Contract Manufacturing sites. This role is responsible for leading the NPI Engineering and Infrastructure Engineering teams, establishing scalable manufacturing processes, and ensuring manufacturing readiness for both products and manufacturing test infrastructure. The position requires close collaboration with R&D, Product Engineering, Operations, Supply Chain, Quality, and Contract Manufacturing partners.
Responsibilities:
Leadership
Lead and mentor the Manufacturing Engineering organization, including the NPI Engineering and Infrastructure Engineering teams.
Build and develop a high-performing engineering organization focused on execution, ownership, innovation, and continuous improvement.
Define engineering priorities aligned with company objectives and manufacturing strategy.
Collaborate closely with R&D, Product Engineering, Operations, Supply Chain, Quality, and Contract Manufacturing Partners.
New Product Introduction (NPI)
Own the end-to-end NPI process from product design transfer through production ramp-up.
Lead Manufacturing Readiness Reviews and production release activities.
Ensure successful execution of Alpha, Beta, Pilot, and Production builds.
Drive Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Testability (DFT) reviews.
Establish scalable manufacturing processes for new products and support production readiness across multiple manufacturing sites.
Manufacturing Transfer
Lead manufacturing transfer activities between R&D and Contract Manufacturers.
Ensure production documentation, BOMs, work instructions, manufacturing packages, and ECO implementation are production-ready.
Manufacturing Test Infrastructure
Lead the Infrastructure Engineering team responsible for manufacturing test stations and production infrastructure.
Ensure deployment, replication, lifecycle management, and continuous improvement of manufacturing test equipment.
Drive manufacturing readiness of ATE and production infrastructure.
Partner with Product Engineering to transition new test platforms into production.
Ensure manufacturing test capacity supports business growth and production demand.
Contract Manufacturing
Build strong partnerships with global Contract Manufacturers.
Support successful execution of NPI products through Contract Manufacturing partners.
Drive manufacturing process improvements, yield improvement initiatives, and production scalability.
Cross-Functional Leadership
דרישות:
Required Experience
B.Sc. in Mechanical Engineering, Industrial Engineering, or a related engineering discipline.
10+ years of Manufacturing Engineering experience within a high-tech hardware company.
Proven experience leading New Product Introduction (NPI) activities from development through mass production.
Proven experience managing Manufacturing Engineering and NPI Engineering.
Hands-on experience working with global Contract Manufacturing environments.
Strong experience establishing manufacturing processes for complex multidisciplinary systems.
Deep understanding of manufacturing documentation, BOM management, ECO processes, manufacturing readiness, and production release.
Experience working with PLM and ERP systems (e.g., Agile, Oracle, SAP).
Preferred Experience:
Experience with complex electronics, RF systems, semiconductor equipment, medical devices, or quantum computing products.
Experience leading Manufacturing Test Infrastructure or Infrastructure Engineering organizations.
Strong project management, leadership, and cross-functional communication skills.
Demonstrated ability to lead multiple NPI programs in parallel while המשרה מיועדת לנשים ולגברים כאחד.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Test Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high-volume manufacturing at wafer fabrications and Outsourced Semiconductor Assembly and Tests (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next-generation of chips. You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will need to have a strong understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Develop and implement high-volume manufacturing strategies for SoC products, optimizing ATE/SLT test coverage, reduce Defective parts per million (DPPM) and test costs, and manage product data integration.
Accelerate mass production via test program releases, data analytics, lot disposition, test time reduction, yield improvement, and return merchandise authorization (RMA) handling.
Partner with cross-functional teams (Test, Quality, Packaging, Operations) to deploy and maintain high-volume manufacturing (HVM) screening solutions.
Manage database integration for wafersort, final test, SLT, and burn-in, while overseeing test program integration, production release, binning, manufacturing flow definition, NPI material handling, and foundry process optimization.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in product engineering or test engineering.
1 year of experience in people management, developing employees.
Experience with product engineering, supply chain data analytics or diagnostics for manufacturing or New Product Introduction (NPI).
Preferred qualifications:
Experience with industry standards, design tools, and design for testing (DFT) best practices, including at-speed transition delay fault (TDF), automatic test pattern generation (ATPG), memory built-in self-test (MBIST), memory repair, diagnostic tools, and yield improvement.
Experience with product engineering, supply chain data analytics and diagnostics for High Volume Manufacturing and NPI.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues, Statistical analysis (e.g., JMP), Yield Management Systems (e.g., Exensio, YieldExplorer, JMP), and Python for data analytics.
Understanding of skew lot definition, data collection, characterization, data analysis and report.
This position is open to all candidates.
 
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC Product Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Develop and implement strategies for high volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, DPPM reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive interactions with wafer fab and OSATs, own and drive checkpoints for key quality metrics.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and RMA handling.
Support setup and maintenance of test, diagnosis, and yield analysis infrastructure, including Return Merchandise Authorization (RMA) support.
Collaborate with cross functional teams across the globe including ATE and SLT Test Engineering, Quality and Reliability (Q&R), Packaging, Supplier Management and Operations to build, deploy, and maintain a high volume manufacturing screening solution.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
8 years of experience in product engineering or test engineering.
Experience developing on Advantest 93K or Teradyne UltraFlex ATE platforms.
Experience with product engineering, supply chain data analytics, or diagnostics for High Volume Manufacturing (HVM) or NPI.
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, memory repair, diagnostic tools, and yield improvement.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues.
Experience delivering HVM screening solutions for high performance computing chips in advanced technology nodes with low Defective Parts Per Million (DPPM).
Knowledge of statistical analysis (e.g. JMP), Yield Management Systems (e.g. Exensio, YieldExplorer, JMP), or Python for data analytics.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
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24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.
Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.
Requirements:
Bachelor's degree in Computer Science, Electrical Engineering, or a related technical field
8+ years of experience in ASIC development and 3+ years in Program or Product Management or Technical/Engineering management
Proven leadership skills, with the ability to manage projects from technical details to the big picture
Experience in managing ASIC design flow, RTL, synthesis, functional verification, and physical layout
Experience in pre-silicon testing (Emulation, FPGA) and post-silicon validation is preferred
Excel in interpersonal communication, relationship building, and collaboration within cross-functional teams
Excellent organizational and leadership skills, and are capable of multitasking in a fast-paced environment
Preferred Qualifications
Familiarity with Networking technologies and concepts
Excellent strategic planning and communication skills, with a self-motivated focus on execution.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8708953
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Test Engineer Lead, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and Outsourced Semiconductor Assembly and Tests (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You'll help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will need to have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Responsibilities
Develop and implement strategies for high volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, defective parts per million reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and return merchandise authorization handling.
Drive product leadership for silicon engineering organization from architectural definition to global availability.
Collaborate with cross-functional teams across the globe including ATE and SLT test engineering, quality and reliability, packaging, supplier management and operations to build, deploy, and maintain a high volume manufacturing screening solution.
Manage database integration and advanced usage for wafersort, final test, SLT and burn-in, test program integration, optimization, release to production, binning handling upon need.
דרישות:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in product engineering or test engineering.
3 years of experience in people management, developing employees.
Experience with product engineering, supply chain data analytics or diagnostics for manufacturing or New Product Introduction (NPI).
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, Memory Repair, diagnostic tools, yield improvement.
Experience with product engineering, supply chain data analytics and diagnostics for High Volume Manufacturing and NPI.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues, Statistical analysis (e.g., JMP), Yield Management Systems (e.g., Exensio, YieldExplorer, JMP), and Python for data analytics.
Understanding of skew lot definition, data collection, characterization, data analysis and המשרה מיועדת לנשים ולגברים כאחד.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
24/06/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities
DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies
Lead DFT planning, specification, and quality tracking across the project lifecycle
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout
Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels
Own end-to-end DFT activities from specification through silicon bring-up and production support
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements
Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or related technical field (Masters preferred)
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs
Proven experience in leading DFT activities across full chip development cycles
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent)
Solid experience with DFT verification methodologies and coverage analysis
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development
Preferred Qualifications
Experience with advanced process nodes (7nm and below)
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar)
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems
Knowledge of silicon bring-up, production test flows, and yield optimization
Familiarity with STA, low-power design, and CDC as it relates to DFT integration
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
The Customer Engineer serves as the technical bridge between Koi engineering and Palo Alto's customer-facing teams, enabling Domain Consultants and support teams to successfully run POVs, deploy Koi, and support customers at Job Description
We are looking for a highly technical and customer-focused Customer Engineer to join the Koi team. This role operates at the intersection of engineering, support, and pre-sales solutions, and is critical to scaling Koi across Palo Alto Networks.
As a Customer Engineer, you will sit closely with the Koi engineering team and develop deep expertise in Koi's architecture, capabilities, and roadmap. You will enable Domain Consultants (DCs) to effectively run Proof of Value (POV) engagements, and empower support teams to deliver high-quality service to customers using Koi. In this role, Customer Engineers translate live customer issues into actionable engineering fixes, taking full ownership of the bug-resolution lifecycle and the safe deployment of updates directly to customers.
Key Responsibilities
Act as a technical bridge between Koi engineering and Palo Alto customer-facing teams
Own the end-to-end resolution of technical issues, from diagnosing complex bugs to managing their seamless deployment to customer environments.
Develop deep expertise in Koi's product, architecture, and internal systems
Enable Domain Consultants (DCs) to successfully run POVs, including deployment, troubleshooting, and demonstrating value to customers
Support Palo Alto support teams in diagnosing and resolving customer issues
Build internal tools and systems that allow DCs and support teams to answer questions and perform initial triage independently
Improve scalability by reducing dependency on engineering for routine support and POV-related issues
Own or lead triage of the most complex and high-impact customer issues
Partner with engineering to identify root causes and drive long-term fixes
Identify recurring friction points in POVs and customer deployments, and work to eliminate them
Contribute to internal documentation, troubleshooting guides, and playbooks
Impact:
Provide the team with seamless technical resolutions to unblock customer issues
Increase success rate and quality of POVs led by Domain Consultants
Improve customer onboarding and time-to-value for Koi
Reduce escalation load on engineering teams
Improve overall customer experience and product reliability.
Requirements:
Education: B.Sc. in Computer Science, Industrial Engineering, Software Engineering, or a related technical discipline (or equivalent practical experience).
Technical Experience: Strong software engineering background with a deep, system-level understanding of software architectures, network, and infrastructure. + For Junior
Domain Expertise: Experience working within the cybersecurity sector or at a cyber-focused technology company is a strong advantage.
Troubleshooting: Proven experience diagnosing, debugging, and resolving complex technical issues within real-world, production customer environments.
Adaptability: Demonstrated ability to quickly master new system architectures and independently debug unfamiliar, legacy, or proprietary codebases.
Cross-Functional Collaboration: Experience partnering closely with pre-sales, field engineering, or customer success teams to support the technical teams and retention lifecycle.
Communication: Exceptional communication and presentation skills in English, with a proven ability to guide and translate technical concepts for both highly technical and semi-technical stakeholders.
Mindset: A strong "builder" mentality, with a track record of developing scalable tools, automation scripts, and repeatable processes rather than relying on one-off fixes.
Preferred Qualification
A foundational background in software engineering, with a practical understanding of software architectures, network, and infrastructure.
This position is open to all candidates.
 
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7 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
Required Chip Test Engineer
About The Position
The Chip Test Engineer plays a crucial role in designing, developing, and implementing automated test for IC chips and systems for Automotive industry. The Test Engineer is responsible to define and develop tests, design test features, program test scripts, and analyze test results to ensure the quality and functionality of products. The Test Engineer collaborates with cross-functional teams to troubleshoot issues, improve test processes, and support product development efforts.
Responsibilities:
Develop and implement test strategies, plans, and procedures for ATE systems to ensure comprehensive testing of ICs.
Design and develop test features, test programs, and test scripts for automated test environment (ATE) based on product specifications and requirements.
Collaborate with design engineers, product manager, production vendors and manufacturing teams to understand product functionality, performance requirements, and testability considerations.
Conduct feasibility studies and risk assessments to identify potential challenges and develop mitigation strategies for test development and implementation.
Develop test program based on code languages C++ ,Java and Python.
Debug, troubleshoot, and resolve issues with ATE hardware, software, and test scripts to ensure reliable and accurate test results.
Analyze test data and results to identify trends, anomalies, and potential defects, and provide feedback to design and development teams for product improvement.
Develop and maintain documentation for test procedures, specifications, and configurations.
Collaborate with vendors and suppliers to evaluate and select ATE equipment, components, and software tools that meet project requirements and performance standards.
Stay abreast of industry trends, advancements in test technologies, and best practices in automated testing to drive continuous improvement in test processes and methodologies.
Requirements:
Bachelor's degree in electrical engineering, computer engineering, or a related field.
Proven 5+ years of experience in automated test development, preferably in the semiconductor or electronics industry.
Experience in programming languages such as C/C++/JAVA/Python.
knowledge of ATE hardware platforms (e.g., Advantest or Teradyne) and test methodologies (e.g., parametric testing, functional testing).
Familiarity with electronic measurement instruments (e.g., oscilloscopes, multimeters, signal generators) and test techniques for analog and digital circuits. Advantage RF test.
Excellent problem-solving skills and the ability to troubleshoot complex issues with ATE systems and test setups.
Strong communication and interpersonal skills, with the ability to work effectively in cross-functional teams.
Detail-oriented with a focus on quality, accuracy, and efficiency in test development and execution.
Ability to work independently, prioritize tasks, and manage multiple projects simultaneously in a fast-paced environment.
Preferred Qualifications
Experience in Mix-signals, high-speed interfaces testing fields.
Experience with test data analysis tools (e.g JMP, Spotfire, Yield HUB, Silicon Dash).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8754477
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
20/07/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a NPI Configuration Engineer to join our team. The NPI Configuration Engineer will be responsible for leading new product introduction projects and ensuring a successful transition from development to manufacturing.

Your Day to Day
Own all engineering documentation: drawings, BOMs, work instructions, PNs
Manage engineering change processes (ECOs, MCOs, product revisions) end-to-end
Maintain data integrity in PDM/PLM and ERP systems (Priority, SolidPDM- advantage)
Drive new product introduction (NPI) from design to small-scale and mass production (including DFM/DFA/DFT, vendor support, and configuration control)
Participate in design reviews and support risk mitigation during development
Identify opportunities and lead cost reduction initiatives
Requirements:
NPI and configuration control in optics, lasers, electronics, and mechanics, with at least 4 years of experience
Hands-on experience in production transfer and working with CMs
Strong project ownership, communication, and problem-solving skills
Technical background across mechanics, optics, and embedded systems
Bachelor's degree in engineering- advantage
Experience working in a startup environment- advantage
Fluent in English, both verbal and written
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8746476
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
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שליחה
סגור
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
You will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis is expected. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible.
Responsibilities
Lead the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Establish and direct the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge and latch-up (ESD/LU), and biased highly accelerated stress test (b/HAST)) and conduct in-depth failure analysis to resolve quality issues.
Analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical quality and reliability models (e.g., early life failure (ELF), time-dependent dielectric breakdown (TDDB), or negative bias temperature instability (NBTI)) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
4 years of experience in Integrated Circuit (IC) silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JMP Scripting Language (JSL).
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8717555
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שירות זה פתוח ללקוחות VIP בלבד