Were looking for an Experienced Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner from RTL to GDS with horizontal ownership.
Floorplan exploration and collaboration with front-end and architecture teams.
Synthesis exploration and final synthesis including: SDC definition, Scan insertion, Lint, LEC, UPF-LP & Spyglass verification.
Place & Route: from Synthesis to final layout and signoff verification on all tools and floors, with target to achieve best PPA.
STA: timing analysis, working with Sub System and Full Chip owners to manage block and top level constraints for synthesis, P&R and signoff.
Signoff : on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.

Were looking for an Experienced Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS.
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).
Signoff : on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.

Were looking for a Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS.
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).
Signoff: on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.

Were expanding our teams and looking for an Experienced Physical Design Engineer who is ready to make a massive impact
NOTE: By applying for this position, you will have the opportunity to indicate your preferred work location: Haifa or Petach Tikva.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS .
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).

As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

We are looking for a Seinor Logic Design Engineer to join the ride as we spearhead the next revolution in electronics!.

Our Logic Design team builds the on-chip monitoring IP at the heart of the product - digital blocks that ship inside some of the most advanced chips in the industry. Were growing the team and looking for a Logic Design Engineer to take ownership of that logic, working alongside circuit, verification, physical design, EDA, and AE engineers. A strong fit if you enjoy hard digital design problems in a collaborative, technically demanding environment.

Responsibilities
Define and implement digital logic micro-architecture - in plain English, diagrams, and SystemVerilog.
Verify design quality against industry standards using static analysis tools (Lint, CDC, RDC).
Work with Circuit Engineers to turn low-level circuit designs into the well-behaved, insightful agents at the core of the solution.
Work with Verification Engineers to simulate and debug the digital logic.
Work with Physical Design Engineers to ensure correct implementation of our special circuits.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.

As we expand our presence in Israel, we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation
Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging.
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies.
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market.

System-Level Debug & Validation
Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs.
Ensure rapid cycles from RTL to functional stability through systematic debug approaches.
Own technical blocks and drive them to completion independently.

Cross-Functional Collaboration
Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios.
Ensure seamless hardware-software integration for AI infrastructure connectivity.
Collaborate with Design and Verification teams to optimize emulation strategies.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.