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22/07/2026
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סוג משרה: משרה מלאה
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16/08/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for
we are looking for a Board Design Engineer for our Haifa site within the Aerospace Division. Join a leading global technology company developing advanced mission-critical systems and cutting-edge solutions across a wide range of defense applications. As part of our multidisciplinary engineering teams, you will take part in the development of advanced hardware platforms while working with cutting-edge technologies and complex engineering challenges
In this role you will
Support the development lifecycle of printed circuit boards (PCBs), from requirements capture and board-level architecture definition through design, integration, and testing of advanced digital hardware systems
Work closely with Software, FPGA, Mechanical, and Environmental Engineering teams throughout the development process
Lead PCB layout reviews, high-speed design activities, and signal integrity considerations
Perform debugging, validation, and engineering problem-solving activities during development and integration phases
Collaborate across teams and contribute to technical discussions and engineering solutions.
Requirements:
Bachelor's degree in electrical engineering
At least 3 years of experience in digital electronic board design
Experience with requirements capture and top-level architecture
Understanding of PCB layout methodologies and high-speed PCB design concepts
Experience working with signal integrity simulation tools such as Hyperlynx, Ansys, or similar tools
Experience with PCB design tools such as Altium Designer, Mentor Expedition, or Cadence
Experience in Voltage Regulated Modules DC/DC (VRM) design - Advantage
Background in retimers and redrivers - Advantage
Experience in Analog Circuit Design (amplifiers, filters, etc.) - Advantage
Problem-solving skills, teamwork abilities, and effective communication skills.
This position is open to all candidates.
 
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חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for a talented Hardware Board Designer to join our multidisciplinary R&D team. This is an exciting opportunity to take part in the design and development of advanced electronic systems, working alongside hardware, firmware, software, and system engineers from concept through integration.
We are looking for a creative, hands-on engineer with a passion for hardware design and a desire to work on cutting-edge technologies.
Responsibilities:
Design and develop complex electronic boards from concept to production.
Perform hands-on schematic design and component selection.
Support and guide PCB layout activities.
Prepare and present design reviews.
Collaborate closely with firmware, software, RF, and system engineering teams to ensure successful system integration.
Develop advanced multidisciplinary systems incorporating:
CPUs / SoCs
FPGA-based designs
Analog and mixed-signal circuits
High-speed interfaces (DDR, PCIe, Ethernet, LVDS, etc.)
RF transmit and receive chains
Filters and amplifier circuits
Power supply and power management circuits
Support board bring-up, debugging, validation, and troubleshooting.
Requirements:
B.Sc. in Electrical Engineering or a related field.
5+ years with proven experience in board-level hardware design.
Experience with schematic design and PCB development.
Experience designing digital and analog circuits, including high-speed interfaces (DDR, PCIe, Ethernet, LVDS, etc.).
Experience working with processors and FPGA-based systems.
Familiarity with RF circuits and power supply design - an advantage.
Strong analytical skills, a hands-on approach, and the ability to work in a multidisciplinary environment.
This position is open to all candidates.
 
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20/08/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for an experienced Board Design Engineer to support the design and development of complex mixed-signal and high-speed digital boards for advanced medical systems. You will join our multidisciplinary team in CT organization.


Your role :
Design and develop multi-layer high-speed PCBs and define layout constraints.
Perform component selection and schematic design.
Design power management circuits (including DC-DC converters and power distribution).
Design and support analog circuits and boards.
Support EMC/EMI tests.
Lead board bring-up, validation, and lab debugging. Troubleshoot system-level HW/FW issues.
Support high-speed interfaces such as DDR4/DDR5, PCIe, and Ethernet.
Support Install Base (IB) activities , field investigations, and NPI activities.
Support Lifecycle Management (LCM) tasks, including EOL handling.
Work with PCBA vendors on production, manufacturing issues, and yield improvements.
Search for component alternatives, test and approve replacements.
Work with PLM (Product lifecycle Management) system and support ECO creation and release.
Requirements:
You're the right fit if:
Bachelor's degree in Electrical Engineering.
7+ years of experience in board design working on multidisciplinary products.
Experience in board design tools, preferably Siemens EDM / Xpedition.
Deep understanding of Signal Integrity (SI) and Power Integrity (PI).
Experience in digital circuits design, power design, and analog circuit design.
Strong lab debugging & root-cause analysis skills using tools such as oscilloscopes and signal analyzers for problem solving.
Experience with DDR design constraints and validation.
Familiarity with PLM tools, especially Windchill.

Advantages
Experience with FPGA-based systems.
Experience in medical devices or other regulated industries.
Background in thermal design and power optimization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Haifa
Job Type: Full Time
We are looking for a Senior Electrical Engineer to join our Sustaining Engineering team and play a key role in supporting the ongoing evolution of our innovative cancer treatment systems.

In this role, you will lead electrical engineering activities across design transfer and sustaining engineering, ensuring our products successfully transition from development into manufacturing while maintaining the highest standards of quality, reliability, manufacturability, and regulatory compliance.
Working closely with R&D, Manufacturing, Quality, and external suppliers, you will combine hands-on engineering with technical leadership to drive robust product solutions throughout the product lifecycle.


This is an excellent opportunity for an experienced engineer who enjoys solving complex technical challenges, mentoring others, and collaborating across multidisciplinary teams to bring life-changing medical technologies to patients worldwide.

What you will do:
Lead electrical engineering activities for Design Transfer and Sustaining Engineering projects.
Provide technical leadership and mentorship to electrical engineers within the DT & Sustaining Engineering team.
Serve as the company's subject matter expert for electrical design, supporting Design Transfer and Production activities.
Lead the transfer of electrical designs from R&D into manufacturing, ensuring manufacturability, quality, and reliability.
Partner with R&D teams to provide Design for Manufacturing (DFM) recommendations early in the development process.
Maintain and improve PCB and electrical board designs to support product robustness, manufacturability, and cost-effectiveness.
Define electrical project requirements, timelines, and budgets.
Generate and maintain complete production documentation, including PCB documentation, PCBA files, BOMs, assembly drawings, and work instructions.
Work closely with suppliers and manufacturing subcontractors throughout the product lifecycle.
Perform hands-on electrical design, testing, validation, and troubleshooting.
Develop and execute electrical test procedures and generate technical documentation and test reports.
Lead electrical design reviews and provide technical guidance to cross-functional teams.
Requirements:
B.Sc. in Electrical Engineering (required).
M.Sc. in Electrical Engineering (advantage).
Minimum of 5 years of experience in electrical engineering within the medical device industry.
Strong knowledge of medical device standards and electrical safety requirements.
Minimum of 5 years of experience in digital circuit design, with basic knowledge of analog circuit design.
Proven experience leading electrical projects from concept through manufacturing.
Experience working with PCB design and layout tools, including Altium.
Hands-on experience using laboratory test equipment, including oscilloscopes, logic analyzers, spectrum analyzers, and function generators.
Strong technical, analytical, and problem-solving skills.
Excellent communication skills in English, both written and verbal.
Proficiency with Altium and Microsoft Office.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8807266
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1 ימים
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.
Requirements:
Basic Qualifications
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out.
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP).
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership.
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis.
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs.

Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces.
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.).
Experience supporting chiplet-based architectures and heterogeneous integration.
Prior technical leadership or package ownership on high-volume products.
This position is open to all candidates.
 
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לפני 23 שעות
Location: Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary System Validation Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.


Job Description
The mission of this role is to perform system validation for our highly advanced devices, that includes defining strategy, develop tools, innovate, be creative to make sure devices are performing as they should in all aspects, logical, performance, durability, stress and more.

You will be part of the site located at Israel (Haifa - Matam), surrounded with highly experienced and professional engineers who will escort, mentor and support you on your journey in our company.
Requirements:
Basic qualifications
Strong academic and technical background in electrical or computer engineering.
3-5 years experience validating and/or developing complex SoC/silicon products for Networking and/or Server & Storage applications.
Professional attitude with the ability to prioritize a dynamic list of multiple tasks, to plan and work with minimal guidance and supervision.
Entrepreneurial, open-mind behavior and can-do attitude. Think and act with the customer in mind!

Required experience
Hands-on, thorough knowledge of high-speed protocols like Ethernet CXL, PCIe, NVMe.
Silicon/System bring-up, validation, and debug experience, including customers systems.
A Python coding experience.
Familiarity with validation techniques C, C++.
Experience with lab equipment as protocol analyzers, chambers, in-circuit debuggers, and CPU-based tool suites.
Familiarity with lab testing automation techniques.

Preferred experience
Familiarity with devices trees and related debugging techniques.
Familiarity with board system design.
C\C++ for embedded FW and device drivers.
Basic understanding of x86/ARM architecture, UEFI/Linux boot sequence.
Familiarity with CXL compliance standards and ability to follow and be involved in compliance consortiums to adapt the tests to be run from X86/ARM based platforms.
Experience working with DRAM memory vendors on DDR4 or DDR5 to identify issues and working on SoC HW/FW to improve memory calibration and tuning sequences.
Knowledge of memory subsystem compliance from a data integrity and RAS is a plus.
Knowledge of schematic capture and PCB layout tools from Cadence, Altium, etc.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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20/08/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for an experienced FPGA Design Engineer who will play a pivotal role in developing , designing and optimizing FPGA solutions for our cutting-edge projects. Your expertise will drive innovation and excellence in digital design as part of the detection team in CT\AMI.

Your role :
Develop FPGA logic using VHDL / Verilog.
Design and implement high-speed data paths and interfaces such as DDR, PCIe, Ethernet.
Perform simulation, verification, timing closure, and debugging.
Integrate FPGA with soft processors (such as MicroBlaze / Nios), sensors, ADCs/DACs, and other system components.
Support system bring-up, lab validation, and debugging at both board and system level.
Collaborate closely with hardware, firmware, software, and system teams.
Support and participate in architecture discussions and design reviews.
Read and understand board schematics to support integration and troubleshooting.
Perform lab and system-level testing after component changes or design updates.
Document FPGA design, interfaces, and implementation details.
Requirements:
You're the right fit if:
Bachelor's degree in Electrical Engineering
6+ years of hands-on FPGA design experience, in a multidisciplinary industry.
Strong experience in digital logic design and debugging.
Strong knowledge of VHDL / Verilog.
Experience with Xilinx tools, especially Vivado.
Knowledge and experience with high-speed serial interfaces (such as: Ethernet, DDR) and protocols like AXI.
Familiarity with high-speed interfaces and memory systems.
Ability to read and understand system schematics.
Experience with lab debugging and validation.
Ability to document design work clearly and support structured release processes.

Advantages
Experience with UVM or other verification methodologies.
Background in imaging systems or signal processing.
Experience in medical devices or other regulated industries.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC Hardware Quality and Reliability Engineer
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Own technical specifications, architectural definitions, and physical power-on of custom qualification vehicles (HTOL load boards, ESD fixtures, latch-up rigs). Drive external layout vendors to achieve seamless electrical correlation with ATE environments.
Govern execution quality of applied stresses, define electrical, thermal, and telemetry parameters on test vehicles to ensure uniform, valid stress profiles without unintended overstress or setup artifacts.
Lead the end-to-end engineering delivery lifecycle for qualification hardware, map and drive critical cross-functional dependencies across internal validation and product engineering teams to ensure on-time readiness.
Serve as the primary technical interface for external PCB layout houses, fabrication shops, and component suppliers; manage design reviews, track lead times, and enforce delivery schedules.
Lead laboratory troubleshooting for qualification hardware anomalies; isolate setup/socket faults from true silicon failures and drive supplier corrective actions (CAPA) when board excursions occur.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, related fields, or equivalent practical experience.
8 years of experience in hardware engineering, with a focus on authoring technical specifications, reviewing electrical layouts, and driving verification of semiconductor tests or validation platforms.
Experience driving deliverables and managing quality standards with external layout vendors, board design houses, or hardware component suppliers across multiple global geographies.
Experience working within specialized semiconductor reliability or test laboratories including configuring component Burn-In ovens, high-power stress load boards, ESD simulators, and Latch-Up test setups.
Experience managing engineering hardware delivery schedules, tracking cross-functional milestones, and meeting New Product Introduction (NPI) timelines.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience managing the design execution cycle of complex multi-layer test vehicles through third-party design houses or layout vendors from concept sign-off to laboratory delivery.
Experience defining and verifying electrical correlation baselines between environmental stress setups and High-Volume Manufacturing (HVM) ATE environments.
Deep familiarity with JEDEC silicon qualification hardware standards and how they dictate physical board testing constraints.
Strong background analyzing the quality of stress factors, including power distribution networks (PDN), signal integrity degradation across extended thermal loops, and transient load behavior during reliability cycles.
This position is open to all candidates.
 
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Location: Haifa
Job Type: Full Time
Required Senior RTL Design Engineer, Digital Signal Processing
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an RTL Design Engineer, you will be a key contributor to the physical implementation of next-generation TPU technology building ASICs for high-speed communication systems. You will take ownership of complex blocks, translating mathematical models into bit-exact silicon. Your expertise in front-end design flows will be vital in delivering the hardware that powers our advanced AI models and cloud services.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Responsibilities
Design and implement high-speed blocks, taking end-to-end ownership of complex modules within the larger system.
Solve complex implementation issues related to GHz-frequency timing closure and advanced process nodes.
Transform high-level architectural specifications and communication theory models into efficient, bit-exact implementations.
Perform fixed-point analysis and micro-architectural trade-offs. Execute and optimize the front-end design flow for your assigned components to ensure, sign-off quality designs.
Collaborate closely with verification teams to develop bit-exact C++/SystemC models and ensure seamless integration.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
8 years of experience in digital signal processing (DSP) design or high-speed digital logic design.
Experience implementing digital blocks for communication systems or PHY (Physical Layer) e.g., filters, interpolators, or timing recovery.
Experience in MATLAB, Python, or C++
Preferred qualifications:
Master's or PhD degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience taking complex DSP designs through the full front-end flow: Synthesis (Design Compiler/Genus), STA (PrimeTime/Tempus), and CDC/LEC (Spyglass/Conformal).
Experience with advanced FinFET process nodes (5nm, 3nm) and achieving timing closure at GHz frequencies.
Experience with high-speed serial links (SerDes) and FEC (Forward Error Correction) implementation.
Solid understanding of low-power design techniques and dynamic power optimization.
This position is open to all candidates.
 
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1 ימים
Location: Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
3+ years of hands-on experience in Physical Design at semiconductor companies.
Proven expertise in the full RTL2GDS flow with deep hands-on experience in macro-level implementation, floorplanning, and complex routing.
Experience working with advanced process technologies (7nm and below).
Solid experience with signoff tools and flows including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Proficiency in TCL or Python scripting to drive EDA tool flows and automate repetitive tasks.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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