דרושים » הנדסה » CAD Gate-level 3DIC EM/IR Engineer

Imagine what you could do here! In our company, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, hardworking people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all our Hardware products. The same passion for innovation that goes into our products also applies to our practices, strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking our product! As a Physical Electrical Analysis Engineer on our SoC team, you will be driving the electrical analysis and verification of an SoC.

As a member of our physical design team, you will be performing various electrical analyses at the block or chip level, including but not limited to Static/Dynamic IR, EM, Noise, and Signal EM.
You will work with the CAD/technology teams for flow bring-up and validation.
You will also collaborate with the implementation team during the entire chip design cycle to drive sign-off closure for tape-out.
You will handle schedules and support cross-functional engineering efforts.

Required Design and Power Methodology Manager, Servers, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design and Power Methodology Team Manager within the Server Chip Design team, you will be responsible for managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.

Our Physical Design group operates in a dynamic, startup-like environment that values deep technical expertise and high-level execution. Each engineer holds end-to-end responsibility - from initial definition and constraints development to execution and full signoff. You will work closely with Design and Architecture teams on RTL modifications and design reviews to ensure seamless convergence.
Were looking for an Experienced Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS .
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).
Signoff : on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.

As an ASIC STA Engineer, you will have responsibilities spanning all aspects of SoC design in terms of timing.
Key responsibilities include timing sign-off, STA and sign-off flow development, ownership of Full chip, IP, and block level timing constraints both for regular and custom timing requirements from synthesis to sign-off to achieve sign-off quality timing constraints.
You will closely interact with RTL designer to understand design intent and clock structure, with CAD to understand and develop flow, and with Physical design team to close and sign-off timing. You will also come up with ideas and plans to verify your own timing constraints. You will innovate timing constraints and flow to facilitate timing closure and any potential pessimism or fall outs in timing analysis.

Required SOC Quality and Reliability Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
You will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis is expected. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible.
Responsibilities
Lead the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Establish and direct the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge and latch-up (ESD/LU), and biased highly accelerated stress test (b/HAST)) and conduct in-depth failure analysis to resolve quality issues.
Analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical quality and reliability models (e.g., early life failure (ELF), time-dependent dielectric breakdown (TDDB), or negative bias temperature instability (NBTI)) to predict device failure mechanisms and lifetime behaviors.

Required ChipDev CAD Engineer, Hardware, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.
About the job
Our Cloud's software engineers develop the next-generation technologies that change how billions of users connect, explore, and interact with information and one another. We're looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. As a software engineer, you will work on a specific project critical to our Cloud's needs with opportunities to switch teams and projects as you and our fast-paced business grow and evolve. You will anticipate our customer needs and be empowered to act like an owner, take action and innovate. We need our engineers to be versatile, display leadership qualities and be enthusiastic to take on new problems across the full-stack as we continue to push technology forward.
Responsibilities
Manage project priorities, deadlines, and deliverables. Design, develop, test, deploy, maintain, and enhance software solutions.
Create software solutions that improve the hardware design process through automation. Propose, design, and implement software automation that directly addresses bottlenecks in today's ASIC and SoC EDA flow.
Work directly with the hardware team on projects prototype and then deploy tools to make a positive impact on our chip hardware development process. Participate in, or lead design reviews with peers and stakeholders to decide amongst available technologies.
Review code developed by other developers and provide feedback to ensure best practices (e.g., style guidelines, checking code in, accuracy, testability, and efficiency).
Triage product or system issues and debug/track/resolve by analyzing the issues and the impact on hardware and quality.

Required Senior SOC and IP Design Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

Our Physical Design group operates in a dynamic, startup-like environment that values deep technical expertise and high-level execution. Each engineer holds end-to-end responsibility - from initial definition and constraints development to execution and full signoff. You will work closely with Design and Architecture teams on RTL modifications and design reviews to ensure seamless convergence.
Were looking for an Experienced Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner from RTL to GDS with horizontal ownership.
Floorplan exploration and collaboration with front-end and architecture teams.
Synthesis exploration and final synthesis including: SDC definition, Scan insertion, Lint, LEC, UPF-LP & Spyglass verification.
Place & Route: from Synthesis to final layout and signoff verification on all tools and floors, with target to achieve best PPA.
STA: timing analysis, working with Sub System and Full Chip owners to manage block and top level constraints for synthesis, P&R and signoff.
Signoff : on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.

Required Senior SoC Power Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.Our Platforms Infrastructure Engineering team designs and builds the
hardware and software technologies that power all of our services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concept all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers, affecting millions of our users.
Responsibilities
Develop methodology of SoC roll up of power reduction, projection, configuration, test plan and tools.
Work intact with Architecture, Frontend and Backend teams driving power reduction features (both logic and circuit).
Work with power delivery and packaging teams on simulations and scenario definitions.
Work with Architecture and design verification (DV) to define power scenarios and tests, debug, and integrate into the flow. Track whether power goals are met throughout execution.
Lead the power of a project. Own project priorities, and allocation of technical resources within the project, informing and escalating appropriately when external factors impact execution.

Required Physical Design Engineer
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define and drive the implementation of physical design methodologies.
Take ownership of one or more physical design partitions or top level.
Drive to the closure of timing and power consumption of the design.
Contribute to design methodology, libraries, and code review.
Define the physical design related rule sets for the functional design engineers.