Requirements:
What we need to see:
B.Sc. in Electrical / Mechanical/ Material/ Chemical Engineering, or similar or equivalent experience.
12+ years of experience in the Hardware design development or testing arena or as Process Engineer.
Preferable 5+ years in the field of quality.
Experience in manufacturing process or test engineering, board design/assembly or semiconductors knowledge and previous experience.
Background with hardware qualification, reliability processes, quality procedures and tools.
Familiarity with quality methods Risk assessment failure analysis and FMEA.

Requirements:
What we need to see:
B.Sc. / M.Sc or PhD degree in Electrical Engineering or Computer science.
15+ years of experience in relevant industries and roles.
Significant experience in hardware product development, product engineering, development quality, reliability, or related technical quality leadership.
Strong understanding of product development lifecycles, NPI, validation, manufacturing transfer, and field-quality feedback loops.
Experience leading structured problem solving, root-cause investigations, CAPA, and risk-management methods such as FMEA.
Ability to work across design, engineering, validation, operations, and manufacturing organizations.
Experience defining quality metrics, review mechanisms, and governance processes.
Strong communication, influence, and stakeholder-management skills.
Ability to drive alignment in a matrix organization.

Ways to stand out from the crowd:
Proven background in complex hardware systems and manufacturing-oriented engineering environments, including test boards, testers, and validation platforms.
Experience bridging engineering and operations quality, with the ability to scale methodology across multiple teams or organizations.
Track record of building learning systems from FA, RMA, validation, and production feedback.

Requirements:
What we need to see:

BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.

2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.

Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

High awareness for quality, robustness, and manufacturability.

High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

Curious and creative problem solver, well organized and multi-tasker.


Ways to stand out of the crowd:

Hands-on FEA mechanical simulation experience - Advantage.

Team / Group / Project management - Advantage.

Experience with manufacturing environment and manufacturing statistics tools.

Background in engineering semiconductor manufacturing processes.

Requirements:
What We Need To See:

B.Sc. in Material Engineering, Chemical Engineering or equivalent.

At least 3+ years of proven experience.

Strong background in statistics and data analysis (JMP).

Good understanding of manufacturing line.

Basic knowledge in optics and microelectronics.

Excellent presentation and interpersonal skills.

Proven problem-solving and prioritization abilities.

Effective communication skills with complementary teams and functional groups.


Ways to stand out from the crowd:

Hands on experience working with AI tools.

Experience in PCB assembly processes.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering / Physics / Material Engineering or higher, with 5+ years of experience in opto-mechanical and electro-mechanical product development, including PCB/PCBA design.

Strong understanding of failure analysis methodologies, root cause investigation, reliability engineering principles, and physics-of-failure analysis.

Hands-on experience debugging complex opto-electro-mechanical systems and identifying thermal, mechanical, assembly, manufacturing, and reliability-related failure mechanisms.

Experience leading complex technical investigations, including DOE execution, 8D methodology, and preparation of detailed investigation and failure analysis reports.

Strong background in mechanical simulations for components and assemblies as part of product design and failure analysis activities.

Hands-on experience with laboratory and analytical tools such as microscopy, X-ray, CT scanning, thermal imaging, strain/stress measurements, and optical lab equipment in clean room environments.

Knowledge of optical manufacturing processes, inspection methods, optical modules, fiber-optic interconnects, and multidisciplinary system integration.

Excellent hands-on experience with 3D CAD tools; Creo is an advantage. Strong understanding of manufacturability, GD&T, CTF dimensioning, and statistical tolerance analysis techniques.

Self-motivated team player with strong verbal and written communication skills in both English and Hebrew.


Ways to stand out from the crowd:

Active involvement in the development of opto-mechanical telecommunication devices.

Exposure development of advanced thermal solutions such as heat-pipes, vapor chambers and liquid cooling.

Experience working in high-volume manufacturing environments with a strong focus on reliability, yield improvement, and design for manufacturability (DFM).

Experience with mechanical stress simulation tools such as ANSYS Mechanical.

Record of working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Requirements:
What we need to see:

B.Sc. in Electrical Engineering.

4+ years of relevant experience in product engineering, failure analysis/debug, or HW/test design.

Proven hands-on experience in HW debugging.

Strong problem-solving abilities with a diligent approach.

Outstanding interpersonal and communication skills in English.

Ability to thrive in a collaborative and dynamic environment.



Ways to stand out from the crowd:

Background with test design and HW lab equipment.

Experience with data/yield analysis.

Background with JMP and/or other data analysis tools.

Experience working with a manufacturing environment.

Basic programming knowledge (C, Perl, Python) in Linux environment.

Requirements:
What we need to see: 

BSc/MSc or equivalent engineering degree in Computer Science, Electrical Engineering, or a related field.

4+ years of related experience in software development and design.

4+ years of proven experience in Python or similar platform.

Excellent knowledge of a version control system (preferably GIT).

Linux based development.

Experience with Software/Hardware products integration.

Excellent communication skills with hands-on experience collaborating with global teams.

Strong teamwork skills, with the ability to collaborate effectively across cross-functional teams.


Ways to stand out from the crowd: 

Excellent programming, debugging, performance analysis, and test design skills.

Familiarity with product manufacturing flows and processes.

Exposure and knowledge around application development, configuration management and automation.

Experience in tools/services development. Creativity - find solutions for challenging requirements.

Strong leadership skills to drive a project from definition through mass production.

Requirements:
What We Need to See:

B.Sc. in Electrical Engineering, Materials Engineering, or equivalent.

5+ years of relevant industry experience.

Strong background in statistics and big data analysis (JMP, Python, Power BI, SQL).

Solid understanding of electronic circuits.

Strong software and scripting skills.

Excellent presentation and communication skills.

Proven problem solving and prioritization abilities.

Ability to communicate effectively across diverse teams and functions.


Ways to Stand Out from the crowd:

Experience with optical networking technologies.

Physical Layer (PHY / Layer 1) networking verification experience.

Demonstrated proficiency in AI-driven data analysis and decision support.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering.

2+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Excellent knowledge & experience with 3D software for mechanical design (Inventor/Creo).

Knowledge with some of the following various production technologies: PCB design, Sheet metal, Electronic Liquid cooling, Metal die casting, Machining (Milling), Extrusion, Plastic injection molding.

Producing of manufacturing documentation (Drawing, Specs).

Computers & software: PDP (Advantage), Office.

Self-motivated with a sharp learning curve.

Ability to manage multiple tasks while being very well organized (know how to work in Multitasking mode and priorities the tasks).

Multi- disciplinary abilities.

Strong communication skills, English & Hebrew, written and verbal. strong Interpersonal relationship.

Team player. ability to work independently and as a member of a team as well.

High Service oriented.



Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering or higher degree.

8+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Self-motivated with a sharp learning curve and able to work independently and as a teammate.

Excellent hands-on experience with 3D CAD.

Strong background in design of components for high-volume manufacturing technologies, such as: stamping, die casting, extrusion, and injection.

Experience in developing fixtures/jigs for product assembly/testing.

High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and geometric tolerancing.

Experience in defining and executing DOE (design of experiment)

Strong verbal and written communication skills in both English and Hebrew.


Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.