דרושים » הנדסה » Junior System Integration Engineer, SPIV team

We are looking for an Experienced HW SERDES Engineer to join Annapurnas SPIV (System Platform Interface validation) team.
As a member of the SPIV team, you will own End-to-end subset of system PCIe SERDES interfaces across range of products through product life cycle:
1. Validation and qualification.
2. Integration.
3. Deployment and post-deployment support.
4. Failure analysis.
5. Pre silicon activities for new technologies.
As owner, you will set the strategy for PCIe SERDES qualification over multiple platforms, ensure the design worked well and drive complex system debugs involving HW and FW components.

You will define NPI practices and engage in pre-silicon efforts to explore new technologies and mitigate integration risks. You will enhance SERDES qualification results with large scale customer performance analysis to discover SERDES life-cycle issues and mitigate them.

This is a fast-paced, intellectually challenging position, and you will work with thought leaders in multiple areas of technology. We are changing industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Approve future products PCIe SERDES technologies.
- Define new products SERDES qualification and validation strategy and lead the execution.
- Engage integrations of Annapurna Labs products with other vendors PCIe HW components.
- Support ongoing integrations of PCIe SERDES in new products.
- Lead triage, PCIe SERDES debug and root cause analysis of systems in AWS data centers.
- Drive and maintain training, quality documentation and collateral to improve in-fleet operation.

We are looking for a System Engineer with Software Engineering background to be part of defining, shaping and integrating solutions to next generation of our cloud platforms.

We are looking for an exceptional engineer to own the development, testing, and monitoring of the manufacturing health of Amazon Graviton server products. You will be part of a team integrating new silicon, hardware, firmware, and software into a revolutionary system architecture.

Key job responsibilities
Lead triage, debugging, and root cause analysis of systems in our data centers.
Enhance troubleshooting capabilities and drive closure of in-fleet problems.
Analyze customer workflows and requirements to provide targeted resolutions.
Collaborate with Annapurna Labs monitoring team and root cause teams to improve product quality and reliability in fleet operations.
Represent the customer voice by providing fleet operation insights and requirements to Annapurna Labs' ASIC design, software development, QA, and architecture teams.
Develop and maintain training materials, quality documentation, and collateral to improve in-fleet operations.
Design and implement tools and scripts to support projects and customize solutions based on requirements.
Travel as needed, approximately 2-4 times per year.

We're looking for a talented SoC Integration Lead to join our Nitro team and help shape what comes next. You will spearhead the SoC integration activities of sophisticated networking chips, collaborating closely with Architecture, RTL Design, Physical Design, Package Design, Verification, Software, DFT, and additional teams in a dynamic, open, and fast-paced environment. As a member of the Nitro project, you will have influence over the device through its entire lifecycle from product definition to mass production. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match, powering hundreds of thousands of businesses across 190 countries.

Key job responsibilities
Take full ownership of SoC integration, including IPs development, partitioning, clock domain crossing (CDC), reset domain crossing (RDC), exploratory synthesis, and design quality verification.
Drive chip-level design implementation by partnering with multiple teams including Architecture, RTL Design, DFT, Verification, System Verification, STA, and Physical Design.
Oversee the creation of SoC-level IP blocks such as fabrics, interfaces, and security modules.
Lead RTL integration activities including micro-architecture definition, RTL coding and debug, synthesis and timing closure, and sign-off.
Address diverse functional and structural challenges, encompassing functional debugging, physical design preparation, emulation, and design quality issue resolution.
Contribute to the creation and implementation of design flows and automated solutions that facilitate efficient SoC development.
Support Verification and Emulation teams through test plan development and coverage review.
Ensure the chip meets quality and reliability standards while delivering to physical design teams, emulation platforms, firmware developers, and other stakeholders.

we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation

Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation

Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration

Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies

we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

We are looking for a HW Lead Engineer to define, shape, and integrate cutting-edge solutions for the next generation of our cloud platforms.

As a HW Lead Engineer on the Nitro team, you'll own the hardware for Annapurna Labs' Network Interface Cards (NICs) used in compute and storage servers. You'll drive development and validation of Nitro cards from concept through mass production, ensuring they're ready to scale.

You'll lead new hardware interface technologies and bring them to large-scale deployment. This fast-paced role puts you at the intersection of technical innovation and customer experience. You'll collaborate with technical experts, senior leaders, and teams across multiple technology areas.

Key job responsibilities
- Design the Nitro Smart Network Interface Card for CMRI vertical use cases.
- Define Nitro card architecture that meets our server integration requirements.
- Partner with design teams and manufacturing sites to enable healthy mass production.
- Review, identify, and qualify second-source electrical components to ensure supply continuity.
- Debug design, manufacturing, and integration issues.
- Assess process capabilities and innovate to simplify processes, reduce costs, and shorten development cycles.
- Collaborate with cross-functional teams to improve product design, processes, and quality.
- Work with customers to optimize the value stream and create joint processes that reduce time and cost.
- Travel internationally 1-2 times per year for week-long trips.

We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match - powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
- Micro-architecture definition.
- RTL coding and debug.
- Synthesis and timing closure.
- Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

We are looking for a SoC / IP Architect to shape the next revolution in electronics!
Responsibilities
Define and design architecture: Create the overall SoC/IP architecture based on product and customer requirements and define detailed technical specifications.
Collaborate with cross-functional teams: Work with a variety of teams, including logic design, verification, firmware architecture and development teams, and physical design, to ensure successful execution.
Lead technical discussions and architectural reviews, guiding design and verification teams to deliver scalable, high-quality implementations.
System-level integration: Ensure seamless hardware-software co-design by working on aspects like control paths, interrupt schemes, and debug infrastructure.
Drive architectural decisions that optimize scalability, and future readiness for next-generation applications.