דרושים » תוכנה » Power and Signal Integrity Engineer, PhD Graduate

Required Power and Signal Integrity Engineer
About the job
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

Required Staff Architect, Digital Signal Processing, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Engineer on the Digital Signal Processing team, you will be a technical leader responsible for architecting and developing the core algorithms that power our next-generation data center interconnects. You will leverage your expertise in communication theory, forward error correction (FEC), and modulation to design novel, low-complexity solutions that push the boundaries of speed and reliability.
This is an executive role where you will not only define the technical direction for critical projects but also mentor other engineers and collaborate across hardware and software teams to bring your goal to life in silicon.
Responsibilities
Lead the architecture, design, and implementation of digital signal processing (DSP) algorithms for high-speed optical communication systems. Drive the long-term technical roadmap for our signal processing and communication architectures by staying current with academic and industry trends.
Develop and analyze novel forward error correction (FEC) and modulation schemes to optimize for performance, power, and complexity tradeoffs.
Create comprehensive system-level models using tools like Matlab, Python, or C++ to simulate and validate algorithm performance.
Collaborate closely with logic design, verification, and software teams to ensure the successful implementation, integration, and bring-up of algorithms in custom silicon.
Provide technical leadership and mentorship to a team of DSP and communication systems engineers, fostering innovation and engineering excellence.

Required RTL Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing etc. You will develop/define design options for performance, power and area.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.

Required Staff Analog Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Analog Design Engineer, you will design and integrate analog sub-systems. You will be responsible for ensuring the analog front-end (AFE) communicates with the digital signal processor (DSP), the package and silicon are a single electrical entity. Your work will bridge the analog and digital worlds to enable industry-leading performance.
The ML, Systems, & Cloud AI (MSCA) organization, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.).
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Own the architecture and implementation of a major sub-component, such as the entire receiver AFE or the clocking/phase-locked loop (PLL) distribution network.
Design the critical suspension system (e.g., equalization/continuous-time linear equalizer (CTLE), analog-to-digital converter (ADC) that allows the digital core to function perfectly despite a noisy, high-loss channel.
Lead the definition and design of test chips to prove out novel topologies and circuit techniques in next-generation gate-all-around (GAA) nodes.
Work with DSP, firmware, and system architects to define hardware/software partitioning and interface specifications.
Provide technical guidance and mentorship to engineers on the team.

Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Cloud customers, and billions of users worldwide.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.

Required Senior Emulation Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Plan and execute the verification of digital design blocks by understanding specifications and working with design engineers to define key verification scenarios.
Develop, execute, and debug full-chip/system on a chip (SoC) tests on emulation platforms.
Collaborate with design engineers to debug tests and ensure functional correctness of design blocks.
Define and implement various coverage measures to capture stimulus and corner-case scenarios. Work with software and post-silicon validation teams to reproduce failures on emulation.
Drive coverage analysis to identify verification gaps and demonstrate progress towards tape-out. Explore new verification and emulation methodologies and implement them.

Required SoC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a System on a Chip (SoC) Design for Test (DFT) Engineer, you will be responsible for defining, implementing, and deploying advanced DFT methodologies for digital or mixed-signal chips. You will define silicon test strategies, DFT architecture, and create DFT specifications for next generation SoCs. You will design and verify the DFT logic and prepare for post silicon and co-work/debug with test engineers.
Responsibilities
Develop DFT strategy and architecture (e.g., Memory Built-In Self Test (MBIST), Automatic Test Pattern Generation (ATPG), hierarchical DFT).
Complete all Test Design Rule Checks (TDRC) and design changes to fix TDRC violations to achieve high-test quality.
Insert DFT logic, boundary scan, scan chains, DFT Compression, Logic Built-In Self Test, Test Access Point (TAP) controller, clock control block, and other DFT IP blocks.
Insert MBIST logic including test collar around memories, MBIST controllers, eFuse logic, and connect to core and TAP interfaces.
Document DFT architecture, test sequences, and boot-up sequences associated with test pins.

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

Required SoC Vision Architect, Silicon, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a SoC Vision Architect in our Silicon team, you will be at the heart of defining the hardware that powers the next-generation of our products. You will bridge the gap between Artificial Intelligence (AI) research and physical silicon, architecting the Image Signal Processor (ISP), CODECS and the pixel data path. You will deliver unparalleled image quality while staying within the tight Power, Performance, and Area (PPA) constraints. You will participate in the concept, architecture, documentation, and implementation of a new product.
Responsibilities
Define a flexible imaging pipeline hardware architecture, from the sensor interface (e.g., Mobile Industry Processor Interface (MIPI)) through the ISP, the encoder/decoder, scaling and memory output.
Partner with our research to transform advanced computational imaging algorithms into high-efficiency hardware logic.
Conduct trade-off analyses between power, performance, and silicon area to meet thermal envelopes and current limitations.
Influence external executive vendor roadmaps, ensuring deep co-optimization between their future products and our custom silicon.
Lead collaboration across Architecture, Register-Transfer Level (RTL), Physical Design and Validation teams.