דרושים » הנדסה » Senior Board Design Engineer

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

we are a global leader in the development and manufacturing of advanced infrared detectors and electro-optical solutions for defense and commercial applications.
We are seeking a skilled board designer with extensive experience in high-speed digital design to join our Board Design R&D Team. In this role, you will define system and hardware requirements, design FPGA-based hardware platforms, and validate high-speed interfaces such as DDR4, USB3, Ethernet, MIPI, and Camera Link. You will work closely with firmware, software, and mechanical engineers to deliver robust, production-ready Embedded systems for advanced electro-optical products.
Key Responsibilities
Define hardware requirements and prepare detailed design documentation for FPGA-based boards, including power architecture, configuration, and peripheral circuitry.
Develop schematics and oversee PCB layout for complex, high-speed multilayer boards.
Perform hardware simulations and signal analysis using tools such as LTspice and Cadence.
Design and validate high-speed interfaces including DDR4, USB3, Ethernet, MIPI, and Camera Link.
Define and manage PCB stack-ups, impedance control, differential pair routing, and high-speed layout constraints.
Conduct Signal Integrity (SI) and Power Integrity (PI) analysis to ensure performance, robustness, and reliability.
Lead prototype bring-up, testing, and debugging using lab equipment (oscilloscopes, logic analyzers, VNAs).
Collaborate with firmware, software, and mechanical teams to ensure full system integration.
Participate in design reviews, DFM/DFT processes, and continuous design improvements.
Support production and NPI activities, and resolve hardware-related manufacturing issues.

Senior Board Design Engineer Own the hardware. Drive the innovation. Shape the system. We are looking for a Senior Board Design Engineer to take a leading role in designing and developing complex electronic boards for advanced defense systems. This is a high-impact, hands-on technical leadership role within a hardware team-ideal for someone who thrives on ownership, influences architecture decisions, and enjoys working across multidisciplinary environments. What Youll Do
- Lead end-to-end board design - from concept to production
- Own hardware architecture and drive key technical decisions
- Deliver across the full lifecycle: schematics, layout guidance, bring-up, validation & production
- Act as a technical focal point across hardware and cross-functional teams
- Collaborate closely with software, mechanical, and system engineers
- Work with suppliers, subcontractors, and manufacturing partners
- Perform deep debugging, analysis, and root-cause investigations
- Take part in design reviews, EMC testing, system validation & field trials
- Support manufacturing transition, including documentation and yield improvement

We are looking for a motivated Hardware Engineer to join our Hardware team in Raanana.

You will have the chance to develop your own skills in a flexible and energetic work atmosphere with friendly and experienced colleagues. You will have helpful supervision, opportunity to learn, modern tools and flexible work culture.

If you want to be a part of our growing company that is driven by innovation and is focused on building a future together with our employees, consider applying.

Principle duties and responsibilities:

Design hardware modules, subsystems and systems for synchronization products.

Develop schematics and guide PCB layout (high-speed, mixed-signal, power).

Select and evaluate components (ICs, power devices, oscillators, interfaces).

Design high-speed interfaces (e.g., 10G/25G Ethernet) with signal integrity considerations.

Contribute to hardware design specifications (HDS) and documentation.

Support system-level integration (HW, FPGA, SW).

Define and execute validation and integration test plans.

Debug complex board and system-level issues (mixed-signal, high-speed).

Perform lab bring-up, measurements, and performance characterization.

Support product transfer to manufacturing (NPI).

Collaborate with manufacturing and test teams for production readiness.

Investigate and resolve issues during production and field operation.

Ensure product reliability, quality, and compliance with applicable standards.

Functional Collaboration.

Work closely with FPGA, software, system, SIT/SVT and mechanical teams.

Participate in design reviews and technical discussions.

Interface with suppliers and external partners as required.

Evaluate and introduce new technologies and components.

Drive improvements in performance, power efficiency, and cost.

Contribute to system architecture discussions and design trade-offs.

Rק/וןרקג Power and Signal Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

Required Power and Signal Integrity Engineer
About the job
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Required Senior Board Designer
Role Summary:
Serve as a key contributor within a hardware design team developing advanced ultrasound systems.
Lead and execute high‑quality PCB design with a focus on performance, reliability, manufacturability, and cost.
Collaborate with internal engineering groups and external partners to develop complex system modules.
Provide ongoing support, maintenance, and continuous improvement for legacy hardware platforms.
Job Responsibilities:
Drive the design and development of digital and analog circuitry across the full product lifecycle - from concept and prototyping through mass production.
Perform circuit analysis, simulations, and signal integrity verification for both analog and high‑speed digital designs.
Apply critical thinking and problem‑solving skills to identify issues, propose solutions, and communicate findings clearly.
Utilize Cadence/OrCAD tools for schematic capture and PCB layout.
Work effectively with cross‑functional teams, including mechanical, firmware, manufacturing, and external ODM partners.
Lead electrical design activities with external teams, ensuring technical alignment and high‑quality delivery of system sub‑modules.
Produce clear, thorough engineering documentation and communicate design decisions effectively.

A leading semiconductor company, developing cutting-edge chips for accelerating analytical computing, is seeking a motivated Junior to Mid-Level Electrical Engineer to join our growing hardware team.
If you are passionate about electronics, eager to learn, and excited to work on cutting-edge technologies, this is the opportunity for you.
What You will be doing?
Design schematics for high-speed hardware boards. Support the full flow of PCB development
Collaborate with layout, manufacturing, and assembly teams
Perform lab testing, debugging, and system integration activities
Conduct soldering and rework on fine-pitch components as part of board bring-up
Document validation results and support design optimization for high-performance, small-footprint and reliability

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews