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חברה חסויה
Location: Haifa and Tel Aviv-Yafo
Job Type: Full Time
This is a highly visible role where you will own the physical design cycle at the partition, IP, and Chip levels-enabling us to produce fully functional "first silicon" designs. Do you love working on challenges that no one has solved yet? If you are ready to join the world's leading engineers and work with state-of-the-art design flows, come join our group.
Responsibilities
You will be responsible for all phases of pre-silicon development, from initial definition to high-quality tape-out (Netlist to GDSII).
Lead block-level Place & Route (PnR), complex floor-planning, partitioning, and the creation of power domains and grid specifications.
Develop and validate high-performance, low-power clock network guidelines and distribution.
Drive static timing closure (STA), Physical Verification (DRC/LVS), and Electrical/Power analysis (EM, IR-Drop, Xtalk, and Noise).
Participate in establishing CAD and physical design methodologies for "correct-by-construction" designs and assist in flow development for chip integration.
Generate and implement ECOs to fix timing, noise, and EM/IR violations while meeting strict area and power constraints.
Work closely with logic design teams on SoC architecture and HDL (Verilog) to implement timing fixes and design optimizations.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering or Computer Engineering.
3-7 years of Physical Design experience on high-performance, low-power, large-scale SoCs.
Power user of industry-standard PnR and Synthesis tools (Synopsys or Cadence).
Deep understanding of physically aware synthesis, extraction, and STA methodologies.
Strong programming skills in Tcl, Python, Perl, or Shell scripting.
Experience with successful tape-outs in advanced sub-micron process technologies.
This position is open to all candidates.
 
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration
Requirements:
B.Sc. or M.Sc. in Electrical Engineering
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below)
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus)
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration
This position is open to all candidates.
 
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
This position is open to all candidates.
 
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10/05/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.
What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part in flows development.
Requirements:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent work experience.
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
Great teammate.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
In this role, you can lead our teams to deliver fully functional "first silicon" IP designs, from defining initial constraints through high-quality tape-out. You will have the rare and rewarding privilege of crafting upcoming products that will delight and inspire millions of customers every single day.
Responsibilities
Own the entire IP-level netlist generation and timing convergence journey, from synthesis and UPF power intent to final sign-off.
Architect and manage complex timing constraints (SDC) for both standard and custom designs, ensuring sign-off quality from day one.
Drive Full Chip and block-level timing/noise convergence, including hierarchical timing flows and power optimizations.
Collaborate closely with RTL designers to understand clock architecture, DFT teams on mode constraints, and PNR teams to achieve flawless physical convergence.
Develop and support automated block and chip-level sign-off flows, working with CAD teams to shape cutting-edge methodologies that eliminate pessimism and accelerate convergence.
Perform deep-dive signal integrity (SI) and noise analysis, drive custom IP integration, and generate block-level budgets to ensure correlation with the Full Chip.
Requirements:
B.Sc / M.Sc in Electrical Engineering.
5+ years of experience in the field, with at least 2-4 years specifically focused on ASIC timing constraints and Static Timing Analysis (STA).
Expertise in commercial STA tools (e.g., PrimeTime) and flow generation.
Deep understanding of the ASIC design flow, including hierarchical top-down design, timing closure, and backend sign-off.
Solid understanding of AC timing (from specs to implementation) and DFT modes.
Strong communication skills and a team-player mindset, with the ability to learn new flows and methods quickly.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Automation and Signoff to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the backend execution environment and methodologies for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the physical implementation environment. Your primary mission is to develop, optimize, and support automated flows from RTL to manufacturable GDSII tape-out, ensuring a methodical and efficient work environment for the entire PD team.


Key Responsibilities


Develop and maintain automated flows for Synthesis, Place & Route (P&R), and Floor-planning to ensure seamless design transitions
Implement and manage robust environments for Static Timing Analysis (STA), Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write and maintain custom plug-ins and scripts (Tcl/Python) to extend vendor tool capabilities, tailoring them to specific process node constraints
Build automated "dashboards" and feedback loops to track and improve Power, Performance, and Area (PPA) metrics across design iterations
Own the design database structure and version control to ensure team alignment and data integrity
Collaborate directly with EDA vendors (Synopsys, Cadence, Siemens/Mentor) to troubleshoot flow issues and analyze tool results
Provide technical support to the broader PD team, helping them optimize individual blocks for power, performance, and timing
Requirements:
Bachelors degree in Electrical Engineering or a related technical field
5+ years of hands-on professional experience with back-end industrial tool suites (e.g., Synopsys Fusion Compiler or Cadence Genus/Innovus)
Expert-level proficiency in Tcl and Python for high-level flow automation, data parsing, and tool customization
Deep technical understanding of Physical Design concepts, including clock tree synthesis (CTS), routing congestion, timing closure, and signal integrity
Proven experience executing sign-off flows for complex, high-performance designs
Strong communication skills and a collaborative approach to solving complex engineering bottlenecks
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Extraction to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.

Key Responsibilities

Develop, qualify, and maintain automated RC extraction flows for high-performance AI SoCs
Own the setup and validation of foundry technology files (e.g., StarRC/Quantus techfiles, TLU+, ITF) across various process corners
Perform correlation studies between different extraction tools and 3D field solvers (e.g., Raphael, QuickCap) to ensure modeling accuracy
Collaborate closely with the Signal Integrity (SI) and Power Integrity (PI) teams to provide accurate parasitic data for critical high-speed nets and power grids
Implement automated scripts (Tcl/Python) to streamline extraction regressions, data parsing, and PEX-to-STA (Static Timing Analysis) handoffs
Analyze the impact of layout effects (LDE) and parasitics on timing and power, providing feedback to the implementation team to optimize PPA
Interface with EDA vendors and foundries to resolve extraction tool bugs and methodology gaps related to advanced nodes (5nm/3nm)
Requirements:
Bachelors degree in Electrical Engineering or a related technical field
5+ years of hands-on experience in Physical Design CAD or Physical Verification with a heavy focus on parasitic extraction
Expert proficiency with industry-standard extraction tools such as Synopsys StarRC, Cadence Quantus (QRC), or Siemens Calibre xACT
Strong scripting skills in Tcl and Python for flow automation and database manipulation
Deep understanding of semiconductor physics, interconnect modeling, and the impact of parasitics on timing, EM (Electromigration), and IR drop
Proven experience in validating tech files and running extraction for complex, multi-million gate designs
This position is open to all candidates.
 
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14/05/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
3+ years of hands-on experience in Physical Design at semiconductor companies
Proven expertise in the full RTL2GDS flow with deep hands-on experience in macro-level implementation, floorplanning, and complex routing
Experience working with advanced process technologies (7nm and below)
Solid experience with signoff tools and flows including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Proficiency in TCL or Python scripting to drive EDA tool flows and automate repetitive tasks
This position is open to all candidates.
 
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11/05/2026
Location: More than one
Job Type: Full Time
We are looking for a dedicated SoC Clocks Design Automation Engineer to join our Networking Silicon team. In this role, youll focus on developing and supporting clock-related design flows and methodologies for SoC and networking chips, ensuring efficient and high-quality design implementation. Youll also chip in to SoC top-level automation and integration activities, building on existing flow infrastructure to improve efficiency and consistency across projects. Introduction
What you'll be doing:
Develop and maintain design automation and methodologies for SoC and networking clock flows.
Collaborate with design, STA, and project teams to ensure timely and high-quality design closure.
Develop and improve SoC top-level automation scripts and flows built upon existing infrastructure and tools.
Support SoC integration and construction flow activities across multiple projects.
Assist in timing, power, and noise analysis to ensure efficient performance.
Requirements:
B.Sc. or M.Sc. in Electrical or Computer Engineering, or relevant professional experience.
At least 2 years of confirmed experience in SoC design, design automation, or methodology development.
Strong programming or scripting skills in at least one language (Python preferred; Perl, Tcl, or Make are advantages).
Understanding of physical design concepts including placement, routing, timing closure, and ECO implementation.
Familiarity with EDA tools for synthesis, place-and-route, and timing analysis (Synopsys or Cadence flows).
Strong analytical, problem-solving, and soft skills.
Way to stand out from the crowd:
Experience developing or maintaining SoC design or automation flows.
Knowledge of timing-related analysis (crosstalk, noise, delay).
Background in power or timing optimization techniques.
Collaborative attitude with the ability to work effectively across multi-functional teams.
Self-motivated and eager to learn while improving existing design flows.
This position is open to all candidates.
 
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14/05/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
3+ years of hands-on experience in DFT roles at semiconductor companies
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent)
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA)
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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