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08/02/2026
Location: Ra'anana and Yokne`am
Job Type: Full Time
The team leads the development of networking infrastructure for our next-generation data centers, focusing on accelerated performance while enabling optimized end-to-end GPU connectivity, focusing on datacenter-level optimized solutions for AI.

As a leader of our CPO switch Hardware Engineering team, you'll guide, encourage, and drive a team of highly skilled hardware engineers, providing them with stimulating and ambitious assignments and enabling them to stay creative and motivated while delivering products on schedule.

What You'll Be Doing:
Build the best team to design and execute high-performance CPO (Co Package Optics) switch system from concept to mass production.
Be a key member of the technical leadership team developing world-class CPO switch designs.
This position is hands-on and will require a deep understanding of all technical/engineering aspects of the project with intimate familiarity with the entire development flow. From a technical standpoint, you will lead and support engineering teams in the following areas: specification definition, electrical schematics, opto-mechanical design, component selection, layout guidance, hands-on lab testing, production processes, qualification workflows, micro-architecture development, verification, characterization, design for testability, cost optimization, reliability, and more.
Collaborate with and integrate all HW project disciplines: Board Design, Assembly Process, Mechanics, Thermal, PCB Layout, Process, Production Engineering, Software/Firmware, Procurement, NPI, and more.
Plan and oversee your teams work on multiple simultaneous development projects in coordination with the broader leadership team. Manage direct reports, set goals, provide coaching, conduct performance appraisals, plan careers, and make compensation recommendations.
Collect, examine, and filter requirements from internal customers such as marketing, software, and systems engineering to assemble a comprehensive plan of record for next-generation switches while planning resource allocation for projects and assign team members effectively.
Schedule projects, create realistic outcome estimates, and drive timely, successful execution for high-volume manufacturing.
Requirements:
What We Need to See:
A Bachelor's or Master's degree in Electrical Engineering.
12+ overall years of industry experience in architecture, design, and methodology for cutting-edge board design development.
6+ years of technical design management experience.
Proven experience in leading multi-disciplinary projects, multi-layer, high density PCB design.
A deep understanding of broadband high-speed ICs.
The ability to provide insight and guidance on trade-offs between power, performance, manufacturability, thermals, cost to meet product requirements.
Proven experience with leading execution of highly complex and innovative designs in tight schedule with risk mitigations and detailed planning for first time success.
Strong interpersonal and communication skills, with the ability to quickly build relationships, prioritize conflicting needs, and align teams effectively.

Ways to Stand Out From the Crowd:
Experience in designing data-center networking products for high-volume manufacturing.
Experience with optoelectronics and optical communication systems.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8535733
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08/02/2026
Job Type: Full Time
This role combines hands-on technical leadership with team ownership, guiding complex electronic board development from early concept through production, while working closely with multidisciplinary engineering teams.
We are looking for an experienced hardware engineer who is strongly connected to the work itself, values teamwork, takes ownership of outcomes, and is driven by delivering reliable systems for real operational use.
Job Description:
Team Leadership: Lead and mentor a team of hardware engineers, supporting professional growth and promoting a collaborative, hands-on working environment.
Technical Responsibility: Serve as the focal point for hardware design, from system architecture and key design decisions through bring-up, validation, and production.
Project Execution: Plan and manage hardware development cycles, including task prioritization, resource coordination, and meeting project milestones.
Multidisciplinary Collaboration: Work closely with System, Software, Mechanical, and Integration teams to achieve robust, well-integrated system solutions.
Design & Quality: Lead design reviews and ensure compliance with reliability, EMC/EMI, and defense-related standards.
Suppliers & Manufacturing: Interface with PCB manufacturers, component suppliers, and subcontractors, supporting NPI and production readiness.
Hands-on Engineering: Take an active role in hardware bring-up, deep debugging, root-cause analysis, and system-level troubleshooting, both in the lab and in the field.
Requirements:
B.Sc. or higher degree in Electrical Engineering from a recognized institution.
10+ years of hands-on experience in board-level hardware design, analog and digital.
4-5 years of experience in a technical leadership or team lead role.
Proven experience across the full product lifecycle: schematics, layout guidance, bring-up, and validation.
Strong understanding of Signal Integrity, Analog, Digital, Power Integrity, and EMC/EMI in high-speed systems.
Experience working in multidisciplinary engineering environments.
Clear, effective communication skills in both English and Hebrew.
Advantages:
Experience in the defense industry and working with MIL-STD requirements.
Hands-on experience with STM32 microcontrollers and NVIDIA Jetson or similar SOM platforms.
Background in transitioning products from R&D to mass production.
Willingness to travel internationally for field trials or operational support.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8535459
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