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Required Senior System Engineer
Job Description Summary
As a Senior System Engineer, you will play a critical role in the design, development, integration, and verification of complex medical imaging systems. You will be responsible for translating clinical needs into technical requirements, ensuring the robust performance, safety, and regulatory compliance of our innovative healthcare solutions.
Job Responsibilities
Lead and participate in the full product lifecycle, from concept and requirements definition through design, development, testing, and deployment of medical imaging systems.
Translate high-level clinical and user requirements into detailed system and subsystem specifications, ensuring traceability and comprehensive coverage.
Perform complex system analysis, modeling, and simulation to optimize system performance, identify potential risks, and propose innovative solutions.
Collaborate closely with cross-functional teams including hardware, software, clinical, quality assurance, regulatory, and manufacturing engineers to ensure seamless integration and successful product delivery.
Define and execute system verification and validation plans, including test protocols, data analysis, and reporting, to ensure compliance with medical device regulations (e.g., FDA, CE).
Conduct root cause analysis for system-level issues, propose effective corrective actions, and drive their implementation.
Contribute to the continuous improvement of system engineering processes, tools, and methodologies within the organization.
Mentor junior engineers and provide technical guidance on complex system engineering challenges.
Stay abreast of industry trends, emerging technologies, and regulatory changes relevant to medical imaging systems.

We are looking for a SoC / IP Architect to shape the next revolution in electronics!
Responsibilities
Define and design architecture: Create the overall SoC/IP architecture based on product and customer requirements and define detailed technical specifications.
Collaborate with cross-functional teams: Work with a variety of teams, including logic design, verification, firmware architecture and development teams, and physical design, to ensure successful execution.
Lead technical discussions and architectural reviews, guiding design and verification teams to deliver scalable, high-quality implementations.
System-level integration: Ensure seamless hardware-software co-design by working on aspects like control paths, interrupt schemes, and debug infrastructure.
Drive architectural decisions that optimize scalability, and future readiness for next-generation applications.

We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match - powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
- Micro-architecture definition.
- RTL coding and debug.
- Synthesis and timing closure.
- Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.

we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation

Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation

Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration

Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies

We are seeking talented, creative and disciplined engineers to join the best-in-class team that plays a significant part in the development of new silicon for our eco-systems by engaging in a dynamic, highly collaborative environment. As a Wireless MAC System Architect, you will be a core member of our highly innovative and visible Wireless System-on-Chip (SoC) design team that defines modem architectures, develops MAC-layer algorithms, and invents embedded DSP algorithms for chips enabling exciting new wireless applications. You will be responsible for developing state-of-the-art wireless SoC products that are enjoyed by millions of our customers. Application areas include ultra-wideband sensing and specialized wireless audio; products enabled or improved by our teams SoCs include specialized audio headsets (such as AirPods), watches and iPhones.

In this role you will be responsible for the architecture of the Connectivity IP with focus on the MAC sub-system: - Define, document and Spec Connectivity MAC architecture and performance requirements.
- Analyze & simulate the performance of the Connectivity IP in real-life use-cases, achieving benchmarking performances in several metrics, including Throughput, Robustness, Co-existence with other Wireless IPs and more.
- Working closely with other architects (PHY, Power Management, FW and SW) to introduce best in class Connectivity IP solution.
- Develop innovative system architectures and protocols to deliver best-in-class performance for the MAC subsystem of custom wireless silicon solutions.
- Introduce cross-domain features where opportunities exist for innovation to achieve enhanced performance.
- Produce MAC architecture, specifications and corresponding performance/reference modeling in support of digital HW and FW design and verification efforts.
- Develop and maintain a MAC systems infrastructure applying the best methodologies for system-level simulation, pre-silicon prototyping (including emulation and FPGA prototyping), FW QA, regression and MTBF testing, and system verification to ensure first-time design success.
- Support the delivery of new wireless technologies to the Product Systems teams.

We're looking for a talented SoC Integration Lead to join our Nitro team and help shape what comes next. You will spearhead the SoC integration activities of sophisticated networking chips, collaborating closely with Architecture, RTL Design, Physical Design, Package Design, Verification, Software, DFT, and additional teams in a dynamic, open, and fast-paced environment. As a member of the Nitro project, you will have influence over the device through its entire lifecycle from product definition to mass production. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match, powering hundreds of thousands of businesses across 190 countries.

Key job responsibilities
Take full ownership of SoC integration, including IPs development, partitioning, clock domain crossing (CDC), reset domain crossing (RDC), exploratory synthesis, and design quality verification.
Drive chip-level design implementation by partnering with multiple teams including Architecture, RTL Design, DFT, Verification, System Verification, STA, and Physical Design.
Oversee the creation of SoC-level IP blocks such as fabrics, interfaces, and security modules.
Lead RTL integration activities including micro-architecture definition, RTL coding and debug, synthesis and timing closure, and sign-off.
Address diverse functional and structural challenges, encompassing functional debugging, physical design preparation, emulation, and design quality issue resolution.
Contribute to the creation and implementation of design flows and automated solutions that facilitate efficient SoC development.
Support Verification and Emulation teams through test plan development and coverage review.
Ensure the chip meets quality and reliability standards while delivering to physical design teams, emulation platforms, firmware developers, and other stakeholders.

we are looking for an Emulation Engineer to join our Radar VLSI team and drive the development of next-generation ASIC Sensors.
We are developing best-in-class automotive radar solutions to complement our companys autonomous driving platform. Joining our expert team, you will leverage our companys unique assets to work on cutting-edge technology in a dynamic and challenging environment.
What will your job look like?
In this role, you will build high-end Emulation environments based on new designs. The position involves building and integrating complex components, working with cross-functional engineering teams, and developing systems that will change the way we drive.
We are looking for an engineer who thrives on challenges and is committed to engineering excellence while navigating complex constraints.
Lead Emulation development for the VLSI team.
Work closely with SW, Logic, and Verification engineers.
Serve as an expert matter for your domain, with full responsibility for driving and implementing improvements and new ideas.

we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews