We are seeking an experienced and visionary Head of Hardware Group to lead a multi-disciplinary hardware team (Digital, Mechanical, and RF). The role requires a strong technical background, proven leadership skills, and the ability to drive innovative, high-quality hardware solutions from concept to production. This position combines hands-on involvement with strategic management, ensuring the successful delivery of complex products in dynamic and demanding environments.
Principle Duties and Responsibilities:
Lead and manage a multi-disciplinary hardware group (Digital, Mechanical, and RF), including recruitment, mentoring, performance evaluation, and career development.
Define group strategy, methodologies, and KPIs to align with company goals.
Provide technical leadership in system architecture, design reviews, and troubleshooting complex challenges across domains.
Oversee the end-to-end product lifecycle: concept definition, system architecture, schematic design, PCB layout, mechanical design, integration, validation, and transition to production.
Drive innovation and adoption of new technologies, tools, and design methodologies.
Manage schedules, resources, and priorities to ensure timely delivery and budget compliance.
Build strong collaboration with FPGA, software, system engineering, validation, and operations teams.
Ensure compliance with product certifications and regulatory standards (CE, FCC, Mil-461, etc.).
Represent the HW group in executive management forums and in front of customers, partners, and subcontractors.
Establish a culture of ownership, accountability, and continuous improvement within the group.
Requirements: BSc in Electrical Engineering from a leading university MUST (MSc or higher Advantage).
10+ years of hardware engineering experience in multi-disciplinary environments MUST.
5+ years of experience in managing hardware teams, including direct management of Digital, Mechanical, and RF engineers MUST.
Proven track record in high-speed digital design, schematic/PCB layout, and integration of complex systems.
Hands-on familiarity with mechanical design processes and working with subcontracted manufacturing.
Experience in RF design and integration Advantage.
Strong background in SI/PI analysis, power distribution, and EMI/EMC considerations.
Experience in DFx methodologies (Design for Manufacturability, Testability, Reliability).
Knowledge in defense/military applications Advantage.
Familiarity with certification and compliance processes (CE, FCC, Mil-461, etc.).
Strong project management skills: planning, prioritization, resource allocation, risk management.
Excellent interpersonal and communication skills, with the ability to inspire and motivate a diverse team.
Entrepreneurial mindset with system-level thinking and problem-solving orientation.
Fluent English (spoken and written).
Personal Attributes:
Natural leader with high emotional intelligence and the ability to manage across disciplines.
Strategic thinker with hands-on execution abilities.
Strong decision-making skills, especially under uncertainty or tight schedules.
Ability to balance innovation with pragmatism in delivering working solutions.
High accountability, ownership, and drive for excellence.
This position is open to all candidates.