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02/08/2026
Location: Kefar Sava
Job Type: Full Time
We are looking for an experienced Electronics Engineer / Practical Electronics Engineer to join our multidisciplinary R&D team and support the development of advanced electro-optical systems.
In this role, you will be responsible for electronic board bring-up, debugging, repair, testing, calibration, and system integration. You will work closely with electrical, mechanical, and system engineers throughout the product lifecycle, from early prototypes to production and deployment.
This position is ideal for someone who enjoys practical engineering work, solving complex hardware issues, and working on mission-critical technologies in a dynamic development environment.
Responsibilities
Perform bring-up, debugging, validation, and repair of electronic boards for advanced electro-optical systems.
Troubleshoot analog, digital, power, and communication interfaces using oscilloscopes and other laboratory equipment.
Perform board-level modifications, rework, repairs, and validation according to engineering requirements.
Work closely with hardware design engineers to investigate failures, improve designs, and resolve technical issues.
Support PCB manufacturers and assembly partners throughout production, troubleshooting, and quality processes.
Execute and support environmental testing of electronic boards and electro-optical systems.
Collaborate with mechanical engineers on system integration, thermal considerations, cable routing, and assembly optimization.
Develop, document, and perform calibration procedures for electro-optical systems.
Document test results, failure analysis, corrective actions, and engineering activities.
Support continuous improvement of laboratory processes, production readiness, and engineering workflows.
Requirements:
B.Sc. in Electronics Engineering or Certified Practical Electronics Engineer (יג-יד).
At least 5 years of hands-on experience in electronic board bring-up, debugging, testing, repair, and integration.
Strong experience troubleshooting electronic boards and performing board-level modifications and validation.
Proficiency using oscilloscopes and standard electronics laboratory equipment.
Experience with electro-optical systems, embedded electronics, cameras, sensors, or other multidisciplinary systems.
Experience working with PCB designers, manufacturers, and electronic assembly partners.
Familiarity with environmental testing and calibration processes.
Strong analytical and problem-solving skills with excellent attention to detail.
Ability to work independently while collaborating effectively within multidisciplinary engineering teams.
This position is open to all candidates.
 
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30/07/2026
Location: Herzliya
Job Type: Full Time
Power the Future with us! SolarEdge (NASDAQ: SEDG), is a global leader in high-performance smart energy technology, with over 3000 employees, offices in 33 countries, and millions of products installed in over 133 countries. Our diverse product offering comprises intelligent solar inverters, battery storage, backup systems, EV charging, and complete home energy management ecosystems. By leveraging world-class engineering capabilities and with a relentless focus on innovation, we strive to create a world where clean, green energy from the sun is the primary source of power for our homes, businesses, and just about everywhere we thrive. Joining the Analog ASIC group means more than designing components – it’s your chance to shape and influence the entire system through system-level innovation and end-to-end ownership, from specification to real-world implementation. Our Analog ASIC group leads chip development at the core of SolarEdge products. We collaborate closely with system, software, and hardware teams to ensure complete optimization across the entire process. We are seeking a passionate, Analog Engineer to join our team. In this role, you will be responsible for designing and developing complex analog and mixed-signal ICs for SolarEdge’s cutting-edge products in the renewable energy sector. What will you be doing:
* Architecture planning using behavioral models for simulation of analog and mixed-signal circuits.
* Design, implement and verify circuits & systems to meet product requirements including schematic entry, simulation, layout and supervision.
* Verification of analog and mixed-signal sub-systems and the entire design using transistor-level.
* Validation of design by laboratory measurement.
* Support product engineering to meet manufacturing and production needs.

Country:
Israel

City:
Herzliya
Requirements:
* B.Sc./M.Sc. in Electrical Engineering from a recognized university.
* Experience in analog or mixed-signal design, simulation, and characterization of circuits such as operational amplifiers, comparators, reference circuits, ADC/DAC, PLL, etc. It would be an advantage if you have:
* Strong knowledge of MOS, Bipolar transistors, and high-voltage IC processes (e.g., BCD, SOI).
* Experience with integrated power electronic circuits such as DC-DC converters, gate drivers, charge pumps, rectifiers, and LDOs.
* Experience in full-chip integration, including interfaces with digital and hardware.
* Familiarity with layout verification and extraction tools.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8629412
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Designer Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with Functional Design, Design for Testing (DFT), Architecture, and Packaging Engineers. Additionally, you will solve technical problems with micro-architecture and logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Define and drive the implementation of physical design methodologies.
Take ownership of one or more physical design partitions or top level.
Drive to the closure of timing and power consumption of the design.
Contribute to design methodology, libraries, and code review.
Define the physical design related rule sets for the functional design engineers.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering or equivalent practical experience.
4 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Masters degree in Electrical Engineering, or a related field.
Experience coding with System Verilog and scripting with Transaction Control Language (TCL).
Experience with Very Large Scale Integration (VLSI) design in SoC.
Experience with multiple-cycles of SoC in ASIC design.
Experience with layout verification and design rules.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8785714
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 2 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8783553
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22/07/2026
Location: Haifa
Job Type: Full Time
As a SI/PI Engineer on the Nitro team, you'll apply your Signal Integrity and Power Integrity expertise to next-generation cloud infrastructure hardware. You'll perform SI/PI analysis, simulation and validation on cutting-edge high-speed digital systems, contributing to products that directly impact our customers.

Key job responsibilities
- Simulate, correlate, and validate SI/PI aspects of PCB and system-level designs.
- Collaborate with Package design, SerDes and DRAM IP providers, firmware, and manufacturing teams.
- Analyze and optimize power delivery networks from card to system level.
- Support hardware bring-up, debug, and validation with hands-on lab work.
- Review and provide technical feedback with internal and external design teams.
- Contribute to design guidelines and best practices based on measurements and analysis.
Requirements:
Basic Qualifications
- Bachelor's degree in electrical engineering, computer engineering, or equivalent
- 8+ years of experience in Signal Integrity and hardware design or validation.
- Experience with one or more high-speed interfaces such as PCIe, Ethernet, DDR, SerDes, or similar.
- Experience with lab equipment and measurement experience with Oscilloscope or TDR/VNA.

Preferred Qualifications
- Experience with SI/PI 3D simulation tools.
- Understanding transmission line theory, impedance concepts, and S-parameters.
- Knowledge of PCB stackup design, material properties, and power delivery networks.
- Experience with hardware validation and production testing.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8749970
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
You will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis is expected. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Establish and direct the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge and latch-up (ESD/LU), and biased highly accelerated stress test (b/HAST)) and conduct in-depth failure analysis to resolve quality issues.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
4 years of experience in Integrated Circuit (IC) silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JMP Scripting Language (JSL).
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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8782483
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11/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a junior Embedded Software Engineer, to join us in building the next generation of networking products. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, fast-paced environment. Working for Annapurna Labs is thrilling and a constant learning experience. As an embedded SW development engineer, you will be responsible for developing features for Annapurna Labs next-generation hardware, to enable high network bandwidth and packets-per-seconds (PPS) performance, with consistently low latency. You will work to bring up a broad selection of instance types, optimized for various use cases, to suit each of our customers needs, such as varying combinations of CPU, memory, storage, and networking capabilities. As a SW development engineer, you will play a key role in shaping architecture definitions and SW system designs, and help to resolve complex customer issues. You will continuously evolve technically, while working to monitor AWS cloud health, maintain high quality standards, develop highly-optimized code, and provide exceptional customer satisfaction.

Key job responsibilities
We will be conducting a unique onboarding training program, where you will be studying the following with our technical experts and team leaders:
* Embedded systems basics.
* Annapurna technologies in EC2.
* Cloud compute development.
* Networking 101.
Requirements:
Basic Qualifications
- B.Sc. in Computer Science/Computer Engineering/Electrical Engineering or related field. Make sure to include a grade sheet with your CV in a single PDF.
- Knowledge of C programming language.

Preferred Qualifications
- Experience in embedded SW Development.
- Hands-on experience developing in a Linux environment
- Experience with HW/SW interfaces at both the board and chip level.
- Understanding of computer architecture.
- Personal characteristics: team player, highly motivated, willing to work in a dynamic and demanding environment, creative, and a fast learner.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8777022
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06/08/2026
Location: Yokne`am
Job Type: Full Time
Our Networking division is looking for an excellent System Validation Engineer! Our Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of markets including high-performance computing, enterprise, data centers, cloud computing, big data, and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry.

What you'll be doing:
Test Verification and Validation (both HW and SW).
Maintain products quality by improving test stability, coverage, design, and manufacturing process.
Execute tests in different scopes such: regression, performance degradation, functional, and security; report the progress of testing and provide summary reports of the activity.
Troubleshooting and streamlining/optimizing our testing procedures.
Support production matters.
Requirements:
What we need to see:
BSc in electrical/computer Engineering or a related field with 3+ years of experience.
Experience in hardware/software validation.
Programming experience in one or more programming languages: Perl, Python, C, C++
Strong automation/scripting skills
Coding experience, Understand the large Python project code and derive unit test.
A good knowledge of simulation flow and test automation development.
Strong problem-solving ability and experience in product engineering/failure analysis and debug/ HW or test design.
Excellent interpersonal and communication skills in English

Ways to stand out from the crowd:
Experience as a Verification Engineer.
Experience in high-speed electrical testing and Unit test
Background with production manufacturing flows.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8771686
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8783563
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09/08/2026
Location: Yokne`am
Job Type: Full Time
We are looking for a Mechanical Engineer to join our mechanical engineering department as a key player in the development of next generation Network products. This key position includes designing the product, close interaction with HW, PMC (Product management & configuration), NPI, Thermal, Layout, Quality and Supply chain groups.

Our Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors including high performance computing, enterprise, data centers, cloud computing and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry. Our product line is focused on delivering the most optimized Ethernet solutions for industries like Media and Entertainment as well as any other industry that can benefit from our DataStream and TCP/IP acceleration.


What you will be doing:

Drive multiple early design concepts while working in fast-paced product development cycles.

Independently lead product design from concept, through detailed design, and support it during Qualification, NPI and MP stages.

Join task forces to investigate and support production excursions, failure analysis and reliability issues.

Collaborate in research of groundbreaking technologies, materials, and processes with other groups to bring in creative ideas that solve ever growing needs.
Requirements:
What we need to see:

B.Sc. in Mechanical Engineering.

2+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Excellent knowledge & experience with 3D software for mechanical design (Inventor/Creo).

Knowledge with some of the following various production technologies: PCB design, Sheet metal, Electronic Liquid cooling, Metal die casting, Machining (Milling), Extrusion, Plastic injection molding.

Producing of manufacturing documentation (Drawing, Specs).

Computers & software: PDP (Advantage), Office.

Self-motivated with a sharp learning curve.

Ability to manage multiple tasks while being very well organized (know how to work in Multitasking mode and priorities the tasks).

Multi- disciplinary abilities.

Strong communication skills, English & Hebrew, written and verbal. strong Interpersonal relationship.

Team player. ability to work independently and as a member of a team as well.

High Service oriented.



Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.
This position is open to all candidates.
 
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06/08/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

You will be in charge of developing full-chip physical design methodologies, Physical Verification development and support through all the projects, Tapeout activities for implementation of networking chips and SOCs.

Work closely with Full Chip Layout owners and block owners, project managers to assure high quality and timely convergence.

Come up with unique and creative solutions to the state of the art FCL physical design problems that are needed for our chips.

We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.

Participating and developing flow and tool methodologies for fullchip, physical design verification across multiple projects.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering/Computer Engineering (or equivalent experience).

You should have at least 5+ years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodology, including DRC / LVS / ANT / ERC / DFM in advanced process nodes is necessary.

Proficiency using Python, Tcl, Shell, Make scripting.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre)

Self-motivation, attention to detail, and good interpersonal skills.


Ways to stand out from the crowd:

Experience with data collection and analysis

Experience in methodology definition / flow owner of Full-chip / Place and Route

Great teammate.

Ownership, self-learning skills, and ability to work autonomously.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8771649
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22/07/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
The Data Path HAL team is looking for an experienced Senior Embedded Software Engineer, to join us in building the next generation of networking products. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, fast-paced environment.

In this role you will be leading tasks involving peers from multiple disciplines, while enjoying every step of the journey.
You will have the opportunity to work on the heart of the network engine, at the worlds largest cloud provider, in a dynamic, open, fast-paced environment.
Requirements:
Basic Qualifications:
- 10+ years of experience with embedded SW development.
- Fluency coding in C.
- Experience with HW/SW interfaces at both the board and chip level.
- BSc degree in Electrical Engineering/ Computer Science/Computer Engineering.

Preferred Qualifications:
- Deep understanding of computer architecture.
- Experience with SoC development life cycle.
- Experience working in Linux environments.
- Personal characteristics: Team player, highly motivated and committed, passionate about SW development, a fast learner, and desire to work in a dynamic environment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8749523
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22/07/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Take part in the development of cutting-edge products within a disruptive system architecture. You will have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. AWS provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world. Annapurna Labs, as part of Amazon Web Services (AWS), is looking for talented engineers to help us develop a semiconductor platform based on a revolutionary architecture.

Looking for exceptional engineers to join the top-tier team that is developing the next generation semiconductor platform, based on a revolutionary architecture. Engineers will participate in design activities, working on the next generation of our products.

You are invited to take part in developing, integrating and deploying cutting-edge technologies, starting with identification and definition of project requirements, architecture, feature development, and collaboration with the different groups.
Your design will be integrated into the nitro SoC, on millions of servers worldwide. This is an opportunity to have a large-scale impact.
As a VLSI engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities
* Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.
Requirements:
Basic Qualifications
- Bachelor's degree in computer science or electrical engineering.
- 4+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).

Preferred Qualifications
- Background in protocols (AXI, CHI, DDR, Networking, PCIe).
- Knowledge of Network-on-Chip (NOC) architecture.
- Experience with coherent and non-coherent fabric design.
- Experience with the entire SoC cycle - Synthesis / STA / CDC / Lint.
- Experience with Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8749605
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תודה על שיתוף הפעולה
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05/08/2026
Location: Yokne`am
Job Type: Full Time
Do you consider yourself a Technical Leader? Want to get your hands on NVIDIA's groundbreaking Network technologies? Are you a person whos not afraid of challenges? We are looking for an excellent Senior Optics Firmware Design Engineer to develop the 1600GbE Data Centers and Networks of tomorrow. We develop the FW for every Transceiver and Optical device. Working with the industry leaders in Machine Learning Platforms, Data Centers, High Performance Computing, Storage Platforms and more!

Youll be joining the LinkX FW team who is a Leading Supplier of End-to-End Interconnect Solutions and that cares about who and what you are. We are a fast-growing company with positive energy that emanates from our team members' internal drive to develop, market, sell, and support ground breaking products and services. We are a strong believer in developing our employees and giving them the tools to succeed!

What you will be doing:

Develop our next-generation network products Firmware.

Developing cutting edge technology and systems with Optical Engines.

Take part in sophisticated networking Firmware features development for Cloud and Datacenter. Focusing on Physical Link-up process and optimizations.

Collaboration with leading Network companies which are our customers.
Requirements:
What we need to see:

B.Sc.\M.Sc. degree in Electrical Engineering or Computer Engineering.

5+ years of proven experience working with established brands.

Programming Knowledge in C and Python.

Knowledge about analog and digital electronics.

Positive mind, target-oriented and hardworking spirit.

The motivation to learn and constantly improve processes and tools.


Ways to stand out from the crowd:

Knowledge of real-time SW, RTOSs, Object-Oriented Programming, Scripting.

Knowledge of bus protocols like I2C, UART, SPI.

Experience with MCU low level, bring ups, test equipment (Scope, Logic ).

Good knowledge of standard specs (Ethernet, InfiniBand, CMIS, Physical Layers and Optics).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8769575
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דיווח על תוכן לא הולם או מפלה
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
11/08/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are looking for exceptional engineers to join the top-tier team developing the next generation semiconductor platform based on a revolutionary architecture. You will participate in design activities, working on the next generation of our products.

As a Chip Design Engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities:
* Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.
Requirements:
Basic Qualifications
- 4+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- BSc in Electrical Engineering/Computer Engineering/Computer Science.

Preferred Qualifications
- Background in protocols (AXI, CHI, DDR, Networking, PCIe).
- knowledge of Network-on-Chip (NOC) architecture.
- Experience with coherent and non-coherent fabric design.
- Experience with the entire SoC cycle - Synthesis / STA / CDC / Lint.
- Experience with Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8777008
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