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We are looking for exceptional software engineers to help develop the next generation chips based on a revolutionary architecture.
In this job you will design and develop software for functional and performance validation.

Key job responsibilities:
In this role you will develop system level software, targeting chip architecture, functional correctness and performance, running on various platforms and validating chip functionality.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will need expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.

We are looking for a phenomenal engineer to join the chip simulation team for networking chips and GPUs. This simulation platform enables our engineers across firmware, SDK, and OS domains to develop and test their code without relying on physical hardware. If you're a creative, self-driven engineer passionate about systems-level design and eager to build technology that empowers internal teams, we want to hear from you.

What Youll Be Doing:

Develop and maintain simulation infrastructure components for different simulation teams (GPUs, switches, NVLink, Ethernet, PHY) of our high-performance networking chips.

Define, implement, and validate simulations of core infra features, improve performance, maintain multi processes and multi-threaded IPC mechanisms (sockets, queues etc.), define architecture and the building blocks of the simulation.

Own, extend and optimize all the CI/CD of the simulation team, starting from servers installation to adding and maintaining various Jenkins jobs that help developer and improve their life.

Collaborate with chip architects, firmware developers, and hardware design teams to accurately simulate complex behaviour in software.

Support internal users by debugging simulation flows and collaborating on bug resolution.

Take part in future-facing innovation by enabling simulation for next-generation devices and features.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving team behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHSIC Hardware Description Language (VHDL)), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

We are seeking a Digital Electrical Design Engineer with extensive experience in board-level digital design, high-speed interfaces, and embedded systems. In this role, youll be a technical lighthouse within our Hardware R&D team-guiding complex, high-speed digital designs from concept through production. Youll collaborate closely with firmware engineers, system architects, and other cross-functional teams spread across multiple global sites. While prior quantum or cryogenic experience isnt required, an interest in learning about these cutting-edge fields is a plus.
Key Responsibilities:
Digital Board-Level Design: Architect, design, and implement advanced digital solutions involving FPGAs, microcontrollers, and high-speed communication interfaces (multi-GHz range).
High-Speed Signal Integrity: Develop and validate clocking solutions up to the tens of GHz range and handle GT lines to ensure robust, reliable performance.
End-to-End Development: Own the entire hardware lifecycle-from concept and schematic design in Altium to layout review, testing, and production release.
Design for Manufacturing & Test (DFM/DFT): Integrate manufacturing and testing considerations into your designs, collaborating with supply chain and production teams to ensure scalability and cost-effectiveness.
Technical Collaboration: Work closely with firmware engineers, system architects, and cross-site R&D teams to ensure seamless hardware-firmware integration.
Remote Coordination: Engage in significant remote collaboration with minimal travel, leveraging Agile and Kanban methodologies for project execution.
Subject Matter Expert: Serve as a go-to resource for digital design best practices, helping to maintain high engineering standards across the organization.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will help build SoCs by driving quality and reliability processes from the Integrated Circuit (IC) perspective. Working with various cross-functional teams, you will develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute test plans. Within the larger organization, you will collaborate with global hardware quality and reliability, silicon design, validation, and engineering teams. You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis.
The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define and lead qualification hardware and test developments in front of internal teams and external vendors.
Define and execute Silicon and package qualification activities (e.g., HTOL, ELFR, ESD/LU, b/HAST, THB, etc.).
Extract, manipulate, and analyze large volumes of data from Silicon and package qualification programs (e.g., HTOL, ELFR, ESD, LU, UHAST, TCT, etc.), High Volume MFG, and field returns to identify failure mechanisms, reliability trends, and opportunities for yield, quality, and reliability improvement.
Own cross-functional investigation of IC quality and reliability issues to identify root causes and develop solutions (e.g., RMA Triage, Analytics, Failure Analysis, etc.).
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI, HCI, Time zero failures, etc.) to predict silicon device failure mechanisms, degradation patterns, and lifetime behaviors.

We are looking for a Senior ASIC Physical Design Engineer to join our dynamic team, Join the ride as we spearhead the next revolution in electronics!
What Youll Do
Own and continuously improve our smooth product backend integration methodology, flows, and best practices using Cadence and Synopsys tools.
Develop, maintain, and scale automation and infrastructure (TCL / Python) to improve quality, predictability, and turnaround time.
Collaborate closely with multiple teams to ensure smooth handoffs and high-quality product.
Support field teams on complex technical issues when needed.
Responsibilities
Implementation of ASIC units using advanced flows
Developing BackEnd methodology using Cadence and Synopsys tools
Build and develop scripts for physical design implementation
Support Field team with customer issues.

Join the PHY system team, a pivotal part of our development. Our team focuses on the PHY and system aspects of our devices, including PHY firmware, calibrations, system definitions, operations, and post-silicon validation.

Key responsibilities include:

Working with the latest silicon technologies and processes to build large-scale, complex devices at the forefront of feasibility.
Contributing to the development of PHY firmware and system calibrations.
Participating in system definitions, operations, and post-silicon validation activities.

What Youll Do:

Youll be part of the group driving next-generation network devices within a startup-like atmosphere inside a well-established, leading corporation.

Our unique design center integrates all silicon hardware and software development disciplines under one roof. We are revolutionizing the industry by building a new internet for the 5G era, with a unified, programmable silicon architecture that will underpin Cisco's future routing products. Our devices are designed for adaptability across service providers and web-scale markets, delivering high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility.

The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

What youll be doing:
Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units at NVIDIA (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.
Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.
Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the block-level design document (e.g., interface protocol, block diagram, transaction flow, pipeline, etc.).
Perform Register-Transfer Level (RTL) coding (coding and debug in Verilog, SystemVerilog), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power closure activities.
Participate in test plan and coverage analysis of the block and SoC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

Were looking for a highly experienced and motivated VLSI Manager to lead the development of our next-generation ASIC-from initial concept to final production. In this pivotal leadership role, you will own the full ASIC lifecycle, drive execution across global teams, and partner with cross-functional stakeholders to deliver cutting-edge silicon that shapes the future of autonomous vehicles.
What Youll Do
Own and lead the end-to-end ASIC development process
Serve as the central point of contact for all ASIC-related activities across Product, Firmware, Computer Vision, Hardware, and R&D stakeholders
Drive the ASIC program work plan, ensuring alignment and coordination across global teams and multiple workstreams
Define and enforce VLSI development methodologies, design flows, and quality standards
Evaluate, select, and integrate both digital and analog IPs required for the ASIC
Manage relationships and deliverables with external VLSI partners and service providers
Ensure high-quality execution, risk management, and delivery across all project phases.

The CPU core Architect representative will be a member of the processor core architecture team. He will be responsible of the technical communication between the team in Israel and the team in China. He will be presenting and explaining Microarchitecture features developed by architects in Israel, collecting requirements, answering question. He will be responsible to hold deign reviews with the team in China. He will also be proposing new Micro architecture features based on his own ideas. take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products. The CPU core architect representative would be relocating to China for an extended period after getting familiar with the team in Israel.

we are looking for a senior pcb design layout engineer to join our hardware engineering team at the autonomous vehicle platform department as a key player in the development of next-generation ecu (electrical control unit) for autonomous vehicles. what will your job look like?
working closely with hardware and mechanical design engineers, you'll perform pcb layout our ecus and other products.
complete development of cad layout from footprint definition, detailed component placement, constraints management, with a concept of topology and signal and power integrity.
be responsible for the design releases required generation of artwork files, odb++, fab drawings, ict report, and electronic pcb documentation.
your designs will need to follow ipc class 3, signal and power integrity constraints, emi/rfi control and automotive regulations.