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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Test Generator Technical Lead, Hardware, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
You will have the opportunity to find the perfect blend of software design practices and hardware development complexity. As a Test Generator Technical Leader, you will lead the technical development and methodology of advanced pseudo-random test generators and verification tools for our custom silicon (ASIC/SoC). You will work at the intersection of hardware and software, driving the strategy for stimuli generation, constraint-solving, and test automation to ensure the functional correctness of next-generation chips. Your strength is primarily in software coding with a good understanding of hardware, or if you are a hardware engineer with software proficiency, this balanced role will let you shine in both disciplines at the same time.Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead the technical design, architecture, and implementation of high-performance test generators and verification frameworks (e.g., using C++, Python, SystemVerilog, or Universal Verification Methodology (UVM).
Propose, design and implement software automation that directly addresses bottlenecks in today's ASIC and SoC Electronic Design Automation (EDA) flow, specifically targeting pseudo-random stimuli generation and constraint-solving methodology.
Collaborate directly with the hardware team on projects to prototype and then deploy scalable test generator tools to make a positive impact on our chip hardware development process.
Participate in, or lead design reviews with peers and stakeholders to decide amongst available technologies for advanced verification.
Triage product or system issues and debug/track/resolve by analyzing the sources of issues and the impact on hardware, simulation performance, or service operations and quality.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with software development in one or more programming languages with experience in data structures and algorithms.
Experience in hardware verification, building developer tools, or developing test generators/exercisers for ASICs and SoCs.
Experience testing, maintaining, or launching software/hardware products.
Experience with software design and architecture, including leading technical projects.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or Computer Science, with an emphasis on computer architecture.
Experience with high-performance, systems, and debugging.
Experience with Hardware Verification languages and methodologies (e.g., SystemVerilog, UVM).
Experience in chip design and related EDA tools and flows (e.g., VCS, Xcelium, debugging complex hardware-software interactions).
Deep understanding of object-oriented programming, constraint solvers, and software design architecture.
Software skills and design practices, with the ability to bridge the gap between software engineering and hardware verification disciplines.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Technical Program Manager, Chip DevOps and Methodology
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
As a Technical Program Manager for Chip DevOps, you will orchestrate the delivery of the foundational engineering environment and drive the execution of a unified silicon design methodology across our engineering organization. You will own the lifecycle of programs that scale our Electronic Design Automation (EDA) toolchains, optimize massive cloud compute grids, and establish standardized, automated workflows.
This is a highly cross-functional role requiring a unique blend of modern cloud infrastructure expertise, semiconductor workflow awareness, and agile program management. You will partner closely with Design, Verification, CAD, and Infrastructure teams to eliminate fragmented workflows, implement standardized methodologies, and ensure a seamless, high-performance environment to build next-generation chips.
Our Cloud accelerates every organizations ability to digitally transform its business and industry. We deliver enterprise-grade solutions that leverage our cutting-edge technology, and tools that help developers build more sustainably. Customers in more than 200 countries and territories turn to our Cloud as their trusted partner to enable growth and solve their most critical business problems.
Responsibilities
Manage programs the definition, standardization, and company-wide adoption of a unified design and verification methodology. Drive alignment on consistent coding standards, automated checks, PDK management, and IP reuse protocols.
Define, manage, and deliver complex infrastructure and CAD roadmaps, ensuring projects are completed on time, within budget, and with minimal disruption to design timelines.
Manage programs the deployment, licensing, and scaling of EDA tools (e.g., Synopsys, Cadence, Siemens) across hybrid or fully cloud-based environments, ensuring tool flows strictly adhere to the unified methodology.
Lead initiatives to optimize compute infrastructure (high-performance computing clusters, storage, and cloud instances) to handle massive simulation, synthesis, and physical design workloads.
Drive the strategy and implementation of automated workflows, continuous integration, and continuous verification (CI/CD) pipelines.
Requirements:
Minimum qualifications:
Bachelor's degree in a technical field, or equivalent practical experience.
8 years of experience as a technical program manager or engineering lead.
Experience driving or supporting unified design/verification methodologies (e.g., standardized UVM frameworks, unified linting/CDC rules, automated regression tracking).
Experience with the front-to-back silicon design lifecycle (e.g., RTL design, verification, synthesis, STA, place and route, tape-out).
Experience with cloud platforms optimized for High-Performance Computing (HPC), grid computing (e.g., LSF, Slurm), and massive storage architectures.
Experience managing infrastructure and centralized configuration profiles for EDA tool suites.

Preferred qualifications:
Bachelors or Masters degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline.
Experience managing complex vendor relationships (EDA vendors, cloud providers) and forecasting infrastructure compute budgets.
Familiarity with modern infrastructure-as-code (IaC) and automation tools (e.g., Terraform, Ansible, Jenkins, Gitlab CI) adapted for hardware workflows.
Proficiency in managing infrastructure and CAD roadmaps using Agile, Scrum, or Kanban frameworks tailored for hardware timelines.
Exceptional ability to translate complex technical infrastructure and methodology needs into clear business/program outcomes for executives and vice versa.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Verification Vision Lead, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, youll work to shape the future of an edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive cutting-edge distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead the verification of an edge AI IP, to be used in our edge-AI products.
Lead a team of chip verification engineers. Plan tasks, allocate people, hold verification design/code reviews, and drive verification execution.
Plan the verification of digital design blocks, including writing test plans, and other verification documents.
Code development of verification features and capabilities, and participate in RTL debug.
Work closely with Architecture, Software, Design, and Physical Design stakeholders to make technical decisions and represent project status throughout the development process.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or a related field, or equivalent practical experience.
10 years of experience working with hardware verification languages (e.g., System Verilog/Specman), design verification methodologies (e.g., UVM) and chip design flow.
Experience in leading chip verification teams through the full lifecycle from concept to delivery.
Experience in creating chip or subsystem design verification strategies and plans.
Preferred qualifications:
15 years of experience in verification of complex SoC/ASIC.
10 years of experience managing verification teams.
Experience in chip design/verification of high performance AI/ML accelerators.
Experience with industry verification techniques, including complementary techniques such as formal verification, and emulation.
Experience in low power verification.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8717585
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Location: Hod Hasharon
Job Type: Full Time
we are looking for a HW Architect team leader.
As HW Architect Team Leader, you will combine deep technical leadership with people leadership. You will shape next-generation networking silicon while building and mentoring a strong architecture team.
What Youll Be Doing:
Lead, manage, and mentor a team of HW architects, fostering technical excellence and innovation.
Drive research, evaluation, and architectural definition of next-generation SoCs - from product requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet and NIC switches.
Lead system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate cross-functionally with design, verification, modeling, software, and other architecture teams to ensure end-to-end system alignment.
Identify and evaluate new technologies, methodologies, and architectural approaches for future products.
Provide technical direction, make key architectural trade-offs, and ensure execution excellence
Requirements:
BSc / MSc / PhD in Electrical Engineering, Computer Engineering, or a related field.
10+ years of experience in VLSI / ASIC design, chip architecture, or micro-architecture of complex blocks.
Proven experience leading or managing a small team of designers, verification engineers, or HW architects.
Ability to take an idea into implementation.
Strong background in high-speed networking systems, such as:
o Ethernet Switches
o NPUs
o NICs
o Traffic Managers
o Fabric Switches
o High-performance processors
Skills
What Were Looking For
Strong technical leadership with the ability to drive architectural vision.
Excellent written and verbal communication skills in English.
Outstanding collaboration and teamwork skills across disciplines and organizational levels.
Independent, self-driven, and comfortable taking full ownership of complex challenges.
Passion for innovation and cutting-edge networking technologies.
Highly motivated with a proactive, can-do mindset.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8708818
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Test Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high-volume manufacturing at wafer fabrications and Outsourced Semiconductor Assembly and Tests (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next-generation of chips. You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will need to have a strong understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Develop and implement high-volume manufacturing strategies for SoC products, optimizing ATE/SLT test coverage, reduce Defective parts per million (DPPM) and test costs, and manage product data integration.
Accelerate mass production via test program releases, data analytics, lot disposition, test time reduction, yield improvement, and return merchandise authorization (RMA) handling.
Partner with cross-functional teams (Test, Quality, Packaging, Operations) to deploy and maintain high-volume manufacturing (HVM) screening solutions.
Manage database integration for wafersort, final test, SLT, and burn-in, while overseeing test program integration, production release, binning, manufacturing flow definition, NPI material handling, and foundry process optimization.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in product engineering or test engineering.
1 year of experience in people management, developing employees.
Experience with product engineering, supply chain data analytics or diagnostics for manufacturing or New Product Introduction (NPI).
Preferred qualifications:
Experience with industry standards, design tools, and design for testing (DFT) best practices, including at-speed transition delay fault (TDF), automatic test pattern generation (ATPG), memory built-in self-test (MBIST), memory repair, diagnostic tools, and yield improvement.
Experience with product engineering, supply chain data analytics and diagnostics for High Volume Manufacturing and NPI.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues, Statistical analysis (e.g., JMP), Yield Management Systems (e.g., Exensio, YieldExplorer, JMP), and Python for data analytics.
Understanding of skew lot definition, data collection, characterization, data analysis and report.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Beit Haemek
Job Type: Full Time
We are looking for a Senior Electronics Practical Engineer to join our R&D team and play a key role in bringing our BeeHome robotic hive systems from development to mass production.
This is a highly hands-on role, working closely with mechanical, software, NPI, QA, and operations teams on integration, debugging, and production readiness of complex electromechanical systems.
🌍 were on a mission to save the world - one bee at a time.
With bee populations in global decline, we develop cutting-edge solutions at the intersection of robotics, AI, and environmental science to protect pollinators and preserve biodiversity.
Were a team of engineers, scientists, and innovators using technology for good - shaping the future of sustainable agriculture.
If youre looking to lead meaningful technology with real-world impact, wed love to have you on board.
What You'll Do:
Integrate electronic systems into robotic machines, including embedded boards, motion, communication, and power systems
Debug and troubleshoot analog and digital boards at component and system levels
Design, document, and support cable harnesses for production (schematics, pinouts, routing, labeling)
Lead design transfer to manufacturing, including BOMs, documentation, and ongoing production support
Design and build test setups, fixtures, and validation tools for development and production
Support existing board designs and new product revisions
Work closely with subcontractors, manufacturers, and assembly partners
Perform root-cause analysis on production and field failures and drive corrective actions
Collaborate with R&D, mechanical, software, QA, and operations teams throughout the product lifecycle
Requirements:
Certified Electronics Practical Engineer (Diploma)
7+ years of hands-on experience in practical electronics engineering roles
Strong experience in hands-on debugging and proving (POD) of analog and digital circuits
Proven experience integrating electronics into complex multidisciplinary systems (robotics, automation, industrial equipment, etc.)
Experience with cable and harness design for production environments
Familiarity with manufacturing processes, DFM (Design for Manufacturability) and DFT (Design for Testability)
Ability to read and modify electrical schematics and layouts
Practical, problem-solving mindset with strong troubleshooting skills
Experience supporting products in mass production and field deployments
Comfortable working in a fast-moving, ambiguous startup environment
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8744462
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25/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a DFT Engineer at our company, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.
Key Responsibilities
DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices
Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field
4+ years of hands-on experience in DFT roles at semiconductor companies
Experience in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG
Good understanding of logic design, verification, debug, and Static Timing Analysis (STA)
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation
Preferred Qualifications
Master's degree in Electrical Engineering or related field
Experience with industry-standard EDA tools from Synopsys (TestMAX) or Siemens (Tessent)
Experience in chip bring-up and mass production activities
Background in advanced process technologies (7nm and below)
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities
DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies
Lead DFT planning, specification, and quality tracking across the project lifecycle
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout
Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels
Own end-to-end DFT activities from specification through silicon bring-up and production support
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements
Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or related technical field (Masters preferred)
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs
Proven experience in leading DFT activities across full chip development cycles
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent)
Solid experience with DFT verification methodologies and coverage analysis
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development
Preferred Qualifications
Experience with advanced process nodes (7nm and below)
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar)
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems
Knowledge of silicon bring-up, production test flows, and yield optimization
Familiarity with STA, low-power design, and CDC as it relates to DFT integration
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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21/06/2026
Location: Yokne'Am Illit
Job Type: Full Time
> Design and development of complex anlog & digital boards for Motion Control applications > Participate in the architecture design of future applications and products > Support existing designs, implement changes and reliability improvement enhancements, test and validate new designs Primary Duties and Responsibilities > Design and develop complex boards > Define Requirements, engineering specs and Validation documents > Select major components, lead layout and placement using contractors > Perform Bring-Up tasks, validate design, support transition to manufacturing, support the boards in their life cycle
Requirements:
> B.Sc. in Electrical Engineering > At Least 4 years of proven experience in board design > 2–3 years of hands-on experience in FPGA design and development > Proven experience in VHDL coding > Good knowledge of analog and digital electronics > Excellent level of System Engineering – ability to dissect and analyze high level requirements into digital and analog boards’ architecture and requirements > Excellent knowledge of relevant CAD tools – OrCAD, Allegro > Experience with motion and control systems - advantage
Personal skills: > Excellent interpersonal skills > Ability to work in a team of engineers in multi-disciplinary environment > Innovative and creative in solving complex problems > Fluent in English, both writing and speaking
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8639946
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24/06/2026
Location: Merkaz
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.
As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.
Key Responsibilities
Emulation Flow Execution & Implementation
Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation
Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration
Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related technical field
3+ years of hands-on experience in Emulation at semiconductor companies
Deep expertise in emulation flows for large-scale chips using industry-standard emulators (Zebu, Palladium, or Veloce)
Strong background in SystemVerilog for developing, testing, and debugging complex SoC designs
Experience developing and maintaining execution flows for building, running, and debugging emulation models
"Can-do" approach with ability to own technical blocks and drive them to completion independently
Preferred Qualifications
Master's degree in Electrical Engineering, Computer Engineering, or related field
Familiarity with EDA tools for Lint, Clock Domain Crossing (CDC), simulation, and synthesis
Proficiency in scripting languages such as Python or TCL for automation and flow enhancement
Experience with standard debug environments (e.g., Verdi)
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink)
Background in hardware-software co-verification methodologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8709069
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24/06/2026
Location: Merkaz
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.
Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.
Requirements:
Basic Qualifications
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
Preferred Experience
Experience developing and validating constraints using industry-standard tools like Timing Constraints Manager (Synopsys) or TimeVision (Ausdia)
Proven track record of executing STA on complex Macro-level designs and supporting Full-Chip timing integration
Strong background in scripting (Tcl, Python, Perl) and automation to enhance timing closure efficiency.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8709013
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24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip
Collaborate closely with Physical Design team to insure a full power integrity
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM)
Understand root-cause analysis for voltage drop violations and EM risks.
Requirements:
Basic Qualifications
Bachelor's or Master's degree in Electrical Engineering or a related technical field
7+ years of hands-on experience in EMIR/Power Integrity analysis for high-performance SoCs or high-speed connectivity products
Strong proficiency in industry-standard EMIR tools (Ansys RedHawk/RedHawk-SC, or Cadence Voltus)
Deep understanding of EM/IR challenges in advanced FinFET nodes (7nm, 5nm, 3nm)
Deep understanding of Place & Route flows, power grid synthesis, extraction (RC), and standard cell architecture
Deep understanding of EM and trade-offs between signal EM and power grid (PG) EM
Preferred Experience
Familiarity with thermal analysis tools and their interaction with electrical performance
Experience working with sign-off criteria and margins for high-volume production chips
Good understanding of timing and P&R
Basic understanding of packaging, top metal layers, MIM capacitor usage, and power distribution
Ability to write TCL scripts for STA and Fusion Compiler (FC).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8709000
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8709142
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.
Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.
Requirements:
Bachelor's degree in Computer Science, Electrical Engineering, or a related technical field
8+ years of experience in ASIC development and 3+ years in Program or Product Management or Technical/Engineering management
Proven leadership skills, with the ability to manage projects from technical details to the big picture
Experience in managing ASIC design flow, RTL, synthesis, functional verification, and physical layout
Experience in pre-silicon testing (Emulation, FPGA) and post-silicon validation is preferred
Excel in interpersonal communication, relationship building, and collaboration within cross-functional teams
Excellent organizational and leadership skills, and are capable of multitasking in a fast-paced environment
Preferred Qualifications
Familiarity with Networking technologies and concepts
Excellent strategic planning and communication skills, with a self-motivated focus on execution.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8708953
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
23/07/2026
Location: Ness Ziona
Job Type: Full Time
abra is seeking for an Hardware Team Lead specializing. This role requires design and development of electronic boards for industrial applications, hardware development, simulations and testing, and close collaboration with system engineers, software developers, procurement, and manufacturing teams. In addition, the position involves PCB layout and schematic design from concept to production. This is a full-time position, Sunday–Thursday, located in Ness Ziona.
Requirements:
* Academic degree in Electrical Engineering – mandatory
* At least 4 years of experience in electronic board design – mandatory
* Managerial experience leading 2 or more employees – mandatory
* Experience in analog circuit design – mandatory
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8683008
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