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6 ימים
Location: Hod Hasharon
Job Type: Full Time and Hybrid work
Required Failure Analysis Engineer
Job Location:
Israel, Hod HaSharon (Hybrid)
Job Brief:
Drive fault isolation and root cause analysis of advanced semiconductor devices, with a focus on memory arrays and associated logic and peripheral circuitry.
Job Description:
Lead fault isolation and root cause analysis of memory and logic failures, including electrical, test, and yield failures, from initial failure signature through physical confirmation
Analyze failures at device, memory-cell, array, and circuit level, differentiating between design, test, device, process, and physical failure mechanisms
Correlate electrical characterization, memory-test and yield results, schematics, layout, and physical FA findings to identify and validate root cause
Develop and execute effective fault-isolation strategies, localizing failures down to the relevant cell, circuit, interconnect, or physical structure
Work closely with Design, Device, Test/Product, Process, Reliability, and Physical FA labs to solve complex failures and drive corrective actions
Improve FA methodologies, prepare and present engineering FA report on complex failure investigations.
Requirements:
Required Skills and Experience:
Sc. or M.Sc. in Electrical Engineering, Physics, Materials Engineering, or a related technical field
5+ years of relevant experience in semiconductor failure analysis, fault isolation, silicon debug, memory characterization, product engineering, or a related field
Strong experience in fault isolation and root cause analysis of semiconductor devices
Ability to analyze electrical, test, and yield failure signatures and correlate them with schematics, layout, circuit behavior, and physical findings
Strong analytical and problem-solving skills, with the ability to drive complex investigations across multiple engineering disciplines
Nice to have:
Understanding memory architecture and digital/analog circuitry
Experience with non-volatile memory or advanced memory technologies such as Flash, MRAM, PCM, ReRAM, or similar technologies
Experience with memory tests, ATE, electrical characterization, yield analysis, and memory fault analysis
Familiarity with advanced fault-isolation and physical FA techniques, such as EMMI, OBIRCH, LIVA/TIVA, laser-based techniques, nanoprobing, SEM, FIB, or TEM.
This position is open to all candidates.
 
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8872897
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Location: Caesarea
Job Type: Full Time
the company was founded by the team that invented one of the technologies at the heart of 5g. their next vision was to develop an iot sticker, a computing element that can power itself by harvesting radio frequency energy, bringing connectivity and intelligence to everyday products and packaging, things previously disconnect from the iot. this revolutionary mixture of cloud and semiconductor technology is being used by some of the worlds largest consumer, retail, food and pharmaceutical companies to change the way we make, distribute, sell, use and recycle products.
our investors include softbank, amazon, alibaba, verizon, ntt docomo, qualcomm and pepsico.
we are looking for a talented and experienced engineer to take part in the verification efforts for the companys core product. this position involves building and maintaining a complex verification environment, and defining and executing a TEST plan. in this role, you will be leading all aspects of verification and will have a critical impact on the company's r&d path.
responsibilities:
define and implement robust sv/uvm verification solutions, including TEST benches and methodologies, to drive efficient verification closure across block-level and full-chip designs, integrating mix-signals SOC simulation environment using verilog, matlab, hw/sw co-simulation and lab integration.
work closely with digital design, analog design, software, back-end, sw and system teams to understand the functional, power and performance goals of the product and ensure its quality.
Requirements:
electrical engineering b.sc., computer engineering or other relevant engineering department graduate with high scores, or equivalent experience.
2+ years in design verification, with strong sv/uvm proficiency (less experienced engineers with high university grades or vast knowledge in rtl design will also be considered)
self-motivated, ability to work, lead and drive tasks to completion.
great interpersonal skills.
understanding of digital asic design flows and SOC development methodologies. experience with SOC /full-chip verification, simulation/debug tools, and Unix / Linux environments, scripting languages ( Python, etc.) and version control.
advantages
knowledge in low power techniques and upf standard.
knowledge in mix signals socs.
experience with sw/hw co-development
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8876626
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Test Engineer Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and Outsourced Semiconductor Assembly and Tests (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You'll help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will need to have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Responsibilities
Develop and implement strategies for high volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, defective parts per million reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and return merchandise authorization handling.
Drive product leadership for silicon engineering organization from architectural definition to global availability.
Collaborate with cross-functional teams across the globe including ATE and SLT test engineering, quality and reliability, packaging, supplier management and operations to build, deploy, and maintain a high volume manufacturing screening solution.
Manage database integration and advanced usage for wafersort, final test, SLT and burn-in, test program integration, optimization, release to production, binning handling upon need, manufacturing flow definition and implementation, material handling during NPI, skew definition, process optimization with foundry.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in product engineering or test engineering.
3 years of experience in people management, developing employees.
Experience with product engineering, supply chain data analytics or diagnostics for manufacturing or New Product Introduction (NPI).
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, Memory Repair, diagnostic tools, yield improvement.
Experience with product engineering, supply chain data analytics and diagnostics for High Volume Manufacturing and NPI.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues, Statistical analysis (e.g., JMP), Yield Management Systems (e.g., Exensio, YieldExplorer, JMP), and Python for data analytics.
Understanding of skew lot definition, data collection, characterization, data analysis and report.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Jerusalem
Job Type: Full Time
As a member of our Physical Design group, you will take an integral part in bringing large scale SoCs to life, helping us deliver the next generation of our ground-breaking products.
You will own the physical design cycle at the partition/IP/Chip levels, including netlist to GDS implementation and verification.
Are you ready to join some of the world's leading engineers and work with state of the art design flows and process technology?
If you possess the knowledge and experience in any of the physical design domains and practices with track record of tape-outs in sub-micron technology, come join our group!

As a member of our Physical Design team in this highly visible role, you will directly own implementation and verification of design partition(s) / IPs (netlist to delivery of our final GDS) for a highly complex SoC utilizing state of the art process technology.
* Implementation - Block level PnR, floor-planning, clock, power planning and distribution.
* Verification and Analysis - Static Timing closure using commercial tools, Physical Verification as well as Electrical/Power Analysis (EM / IR-Drop / Xtalk / noise )
Requirements:
Minimum Qualifications
3+ years of experience in physical design of large-scale SoCs.
B.Sc / M.Sc Electric Engineering / Computer Engineering.
Extensive experience with one of the place & route tools (Synopsys / Cadence).
Scripting and Programming experience using either TCL or Python or Perl, or known Shell scripting languages.

Preferred Qualifications
Knowledge in Verilog - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8876859
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Location: Jerusalem
Job Type: Full Time
As a member of our Physical Design group, you will take an integral part in bringing large scale SoCs to life, helping us deliver the next generation of our ground-breaking products.
You will own the physical design cycle at the partition/IP/Chip levels, including netlist to GDS implementation and verification.
Are you ready to join some of the world's leading engineers and work with state of the art design flows and process technology?
If you possess the knowledge and experience in any of the physical design domains and practices with track record of tape-outs in sub-micron technology, come join our group!


As a member of our Physical Design team in this highly visible role, you will directly own implementation and verification of design partition(s) / IPs (netlist to delivery of our final GDS) for a highly complex SoC utilizing state of the art process technology.
* Implementation - Block level PnR, floor-planning, clock, power planning and distribution.
* Verification and Analysis - Static Timing closure using commercial tools, Physical Verification as well as Electrical/Power Analysis (EM / IR-Drop / Xtalk / noise ).
Requirements:
Minimum Qualifications
3+ years of experience in physical design of large-scale SoCs.
B.Sc / M.Sc Electric Engineering / Computer Engineering.
Extensive experience with one of the place & route tools (Synopsys / Cadence).
Scripting and Programming experience using either TCL or Python or Perl, or known Shell scripting languages.

Preferred Qualifications
Knowledge in Verilog - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8876890
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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.
Be responsible and go-to person for any IR related issues.
Requirements:
Basic Qualifications
Bachelor's or Master's degree in Electrical Engineering or a related technical field.
10+ years of hands-on experience in EMIR/Power Integrity analysis for high-performance SoCs or high-speed connectivity products.
Strong proficiency in industry-standard EMIR tools (Ansys RedHawk/RedHawk-SC, or Cadence Voltus).
Deep understanding of EM/IR challenges in advanced FinFET nodes (7nm, 5nm, 3nm).
Deep understanding of Place & Route flows, power grid synthesis, extraction (RC), and standard cell architecture.
Ability to define and own EMIR methodologies.
Capability to identify issues early in the project lifecycle (preferably with experience in sub-N5 TSMC technologies).
Deep understanding of EM and trade-offs between signal EM and power grid (PG) EM.
Thermal analysis, self-heat and Statistical EM proficiency.

Preferred Experience
Familiarity with thermal analysis tools and their interaction with electrical performance.
Experience working with sign-off criteria and margins for high-volume production chips.
Good understanding of timing and P&R.
Good understanding of packaging, top metal layers, MIM capacitor usage, and power distribution.
Understanding of ESD (including full CDM closure) and latch-up.
Strong Reliability knowledge.
Ability to write TCL scripts for STA and Fusion Compiler (FC).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8832094
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23/09/2026
Location: Haifa
Job Type: Full Time
We are looking for a Seinor Logic Design Engineer to join the ride as we spearhead the next revolution in electronics!.

Our Logic Design team builds the on-chip monitoring IP at the heart of the product - digital blocks that ship inside some of the most advanced chips in the industry. Were growing the team and looking for a Logic Design Engineer to take ownership of that logic, working alongside circuit, verification, physical design, EDA, and AE engineers. A strong fit if you enjoy hard digital design problems in a collaborative, technically demanding environment.

Responsibilities
Define and implement digital logic micro-architecture - in plain English, diagrams, and SystemVerilog.
Verify design quality against industry standards using static analysis tools (Lint, CDC, RDC).
Work with Circuit Engineers to turn low-level circuit designs into the well-behaved, insightful agents at the core of the solution.
Work with Verification Engineers to simulate and debug the digital logic.
Work with Physical Design Engineers to ensure correct implementation of our special circuits.
Requirements:
Requirements:
B.Sc. or M.Sc. in Electrical or Computer Engineering.
5+ years as a VLSI front-end engineer (logic/ASIC/chip design) or in a similar domain.
Strong background in RTL design, handoff methodologies, and signoff tools (Lint, CDC, RDC).
Close familiarity with python, Git, Unix-like environment - an advantage.
Experience with low-power design techniques (clock gating, power domains, DVFS) - an advantage.
Knowledge of DFT design and flows - an advantage.

Personal skills:
Self-driven - takes a task from definition to signoff, pulling in whoever is needed along the way.
Detail-oriented, with a sharp eye for issues others miss.
A clear communicator who can convey technical tradeoffs to cross-functional teams.
Curious about new design techniques and methodologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8831015
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24/09/2026
Location: Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
3+ years of hands-on experience in Physical Design at semiconductor companies.
Proven expertise in the full RTL2GDS flow with deep hands-on experience in macro-level implementation, floorplanning, and complex routing.
Experience working with advanced process technologies (7nm and below).
Solid experience with signoff tools and flows including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Proficiency in TCL or Python scripting to drive EDA tool flows and automate repetitive tasks.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8832030
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04/10/2026
Job Type: Full Time
Are you ready to power the future? We're a global leader in smart energy technology, with over 3,000 employees, offices in 34 countries, and millions of installations worldwide. Our innovative solutions include solar inverters, battery Storage, backup systems, EV charging, and AI-based energy management. We're committed to making clean, green energy the primary power source for homes, businesses, and beyond. Key Responsibilities
* Take responsibility for the full product testing line, starting from PCBA and finishing with product functional TEST.
* Perform handson failure analysis of testing stations, including electronic boards, components, and systemlevel assemblies.
* Document findings, TEST results, and root cause hypotheses in a clear and structured manner.
* Perform station and other testing equipment repairs including PCBA level
* Provide repair and maintenance documentation to regular technicians.
* Collaborate with NPI and Q&R teams to resolve technical and FPY issues.
Country:
Israel
City:
Ziporit
Requirements:
* Practical Engineer or Engineer (Electronics/Electrical) strong hands-on skills.
* Skills with lab equipment (oscilloscope, DMM, LCR meter, power supply).
* Ability to read schematics and understand analog and digital circuit behavior.
* Very good technical English (reading and writing). Preferred Qualifications
* Background in power electronics - power converters, MOSFET/IGBT/SiC stages.
* Background in testing equipment
* Understanding of common electronic failure mechanisms
Location: Ziporit ind. Zone (Nof Hagalil)
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8840644
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Location: Haifa
Job Type: Full Time
Imagine what you could do here. At our company, new ideas have a way of becoming extraordinary products very quickly.
Do you want to bring passion and dedication to your job? There's no telling what you could accomplish at our company .Do you want to join us to help deliver the next groundbreaking our products?

The company SoC design team is looking for an experienced engineer to develop our compute SoCs power management system. Role expectations include working with partner Design teams, Physical design, verification, Platform Architecture and Software teams to define the power system micro architecture, implement the required HW and integrate it to a complex multi chip system.
Requirements:
Minimum Qualifications
3+ years of experience in digital design (preferably in SoC)
Familiar with advanced design practices (clock/voltage domain crossing, low power design and DFT) - Advantage
Familiar with various chip development tools (e.g. lint, synthesis, STA)
Familiar with verification methodologies
Strong Verilog/System Verilog skills
Experienced with scripting using common languages (e.g. Python, Perl, TCL)
Preferred Qualifications
BS.c/ MS.c in EE/ CE
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8865369
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Emulation Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Plan and execute the verification of digital design blocks by understanding specifications and working with design engineers to define key verification scenarios.
Develop, execute, and debug full-chip/system on a chip (SoC) tests on emulation platforms.
Collaborate with design engineers to debug tests and ensure functional correctness of design blocks.
Define and implement various coverage measures to capture stimulus and corner-case scenarios. Work with software and post-silicon validation teams to reproduce failures on emulation.
Drive coverage analysis to identify verification gaps and demonstrate progress towards tape-out. Explore new verification and emulation methodologies and implement them.
Requirements:
Minimum qualifications:
Bachelor's degree in Computer Science, Electrical Engineering, or equivalent practical experience.
8 years of experience with full-chip/SoC verification (e.g., test definition, creation, execution, and debug).
Experience developing full-chip/SoC tests using these environments/tools: ASM, C, C++, Perspec, Threadmill, OS, or drivers.
Experience with execution and RTL/firmware/software debug on hardware emulation (e.g., ZeBu Server, Palladium, Veloce) or FPGA (e.g., EP, HAPS, Protium).
Experience with design debug tools (e.g., Verdi, Verisium).
Experience with coding and scripting in C, C++, Perl, TCL, or Python.
Preferred qualifications:
Experience in embedded software and firmware (e.g., Linux drivers, firmware validation).
Experience with associated electronic design automation (EDA) tools, automation, and flow enhancements.
Experience with coding in Verilog/SystemVerilog for design.
Understanding of SoC architecture and interfaces (e.g., CPU, DDR, PCIe, interconnect, Ethernet, etc.).
Understanding of register transfer level (RTL) to emulation/field-programmable gate array (FPGA) flows including emulation test benches (e.g., transactors/accelerated verification intellectual properties (VIPs), hybrid, in-circuit emulation).
This position is open to all candidates.
 
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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
5+ years of digital design experience, including at least one full chip from spec to tapeout.
Strong proficiency in Verilog/SystemVerilog, RTL coding, and synthesis flows.
Hands-on experience with timing closure, CDC, lint, and low-power design techniques.
Solid understanding of high-speed serial interfaces (PCIe, Ethernet, or similar) and SoC integration.

Preferred Qualifications
MS or PhD in Electrical Engineering or Computer Engineering.
Experience with PCIe Gen5/Gen6, CXL, UALink, UCIe, or Ethernet MAC/PCS designs.
Familiarity with formal verification, emulation, or assertion-based methodologies.
Background in advanced process nodes (7nm, 5nm, or below).
Strong debug skills across pre-silicon and post-silicon environments.
This position is open to all candidates.
 
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8831923
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Location: Hod Hasharon and Haifa
Job Type: Full Time
Required Senior CPU Core Architect
Job Description
The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.
Requirements:
Solid understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems.
Ability to make trade-offs between power, performance and area appropriately to meet the requirements of the product.
Hand-on experience with high power-efficient CPU core successfully.
Understanding of CPU instruction set architecture and assembly language.
At least 20 years of experience in one of the leading CPU companies
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Familiarity with the ARM architecture and the micro-architecture for current ARM CPU cores.
Software development (C, assembly).
Experience modeling microprocessors using higher-level languages, like C/C++.
Excellent verbal and written communication skills.
QUALIFICATIONS
Co-operate and communicate well with the architecture team and other members of development team.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8842883
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18/10/2026
Location: Merkaz
Job Type: Full Time
abra R&D is seeking a Verification Engineer. We are looking for a skilled Verification Engineer to join a professional and dynamic team and take part in advanced, diverse technology projects in the fields of FPGA Verification, signal processing, controllers, and more. This role requires extensive experience in Verification, UVM methodology, SystemVerilog, FPGA / ASIC verification environments, RTL debugging, simulation tools, scripting, and working closely with FPGA development, system, architecture, and algorithm teams. Key Responsibilities:
* Develop verification environments using UVM methodology for FPGA verification across various projects.
* Work on verification projects involving signal processing, controllers, and additional advanced technologies.
* Define, architect, and develop verification environments from block-level to full-chip level.
* Work closely with FPGA development teams, system engineers, architecture teams, and algorithm engineers.
* Support RTL debugging from block level to system level.
Requirements:
* B.Sc. in Electrical Engineering, Electronics Engineering, or Computer Science - an advantage.
* 3+ years of experience in Verification, from Test Plan definition through Coverage - mandatory.
* Hands-on experience with UVM methodology and SystemVerilog - mandatory.
* Experience developing Verification environments for FPGA / ASIC at both block and full-chip levels - mandatory.
* Experience with RTL debugging from block level to system level - mandatory.
* Experience working with simulation tools; Questa Simulator is an advantage
* Experience writing scripts in Python, TCL, Bash / Csh - mandatory.
* Experience working in a Linux environment - mandatory.
* Experience working with FPGA, architecture, system, and algorithm teams.
* Very good technical English. Personality requirements:
* Strong analytical and problem-solving skills.
* Ability to work independently and as part of a team.
* Ability to work in a multidisciplinary environment. A full-time on-site position based in Holon, Israel.
This position is open to all candidates.
 
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8806999
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Location: Hod Hasharon
Job Type: Full Time
Required Research Intern: Next-generation Computer Architecture for Racks and SuperPods
Responsibilities:
The research focuses on designing next-generation rack and SuperPod architectures that combine elasticity through resource pooling with optimal performance enabled by holistic co-design across applications, parallel programming models, interconnect fabrics, and compute, memory, and switch chip architectures. On the communication side, the work architects scalable, high-bandwidth, and low-latency scale-up fabrics across multiple chips at rack and SuperPod scale. On the memory side, it explores richer protocol semantics beyond traditional load/store operations to reduce unnecessary data movement and rethinks memory hierarchies to expose large-scale capacity with near-local latency. On the compute side, it analyzes the requirements of General Compute and Generative AI workloads and their parallel programming models to fully leverage large-scale system resources.
Investigate and prototype new architectural features, including but not limited to:
o Tiered Memory: Explore advanced memory organizations, including hardware-managed caching, to enable software-transparent, fine-grained promotion and demotion of cache lines across the memory hierarchy.
o Prefetching/Speculation: Evaluate and design existing and next-generation hardware prefetching and speculation mechanisms to effectively hide local and remote memory latencies at rack and SuperPod scale.
o Near-Memory/Network Processing: Develop support for key primitives executed at the memory and network layers to minimize unnecessary data movement across sparse, dense, and pointer-based data structures.
o Workload-Centric Co-Design: Study optimal parallelization strategies at rack and SuperPod scale for both General Compute and Generative AI workloads, and design dedicated hardware support for widely used parallel programming primitives such as RPCs and collective communication.
Write reports and papers on the research results and present them.
Requirements:
MSc in Computer Science, Electrical Engineering, or related field.
Background in Computer Architecture and Computer Fabrics is a must.
Creativity and the ability to think outside the box to develop innovative technologies.
Research experience in at least one of the following areas:
o Computer Architecture: Modern cache hierarchies, cache coherence protocols, memory systems, hardware prefetchers, and the memory-side of the core microarchitecture.
o Scale-up Fabrics: NVLink, UALink, CXL, UPI, IF, or PCIe.
o Parallel programming models: Collective libraires (NCCL or RCCL) and RPCs (gRPC or Thift).
o Workload optimization: General Compute and Generative AI workload composition (internals) and parallelization expertise at the scale of the rack or SuperPoD in both cloud and HPC environments.
Excellent analytical, problem-solving, and system-level thinking skills.
Strong interpersonal skills, with a collaborative spirit and the ability to work independently.
This position is open to all candidates.
 
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