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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Signal/Power Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities:
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Collaborate extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers, to define specifications and resolve integration challenges.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish robust design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Requirements:
Minimum qualifications:
PhD degree in Electrical Engineering, Computer Engineering, Physics, Materials Engineering, or Computer Science.
Relevant practical or internship experience, or personal project experience in hardware or electrical engineering.
Preferred qualifications:
Working knowledge of physical layer requirements for PCIe, Ethernet (IEEE 802.3).
Advanced proficiency in Python (NumPy, Pandas) for data analysis and instrument control.
Ability to correlate lab measurements with pre-silicon SI simulations (HSPICE, ADS, or Sigrity).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8843091
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Location: Rehovot
Job Type: Full Time
The Electronics Team is looking for an Electrical & Electronics tech Lead to support the development of next-generation metrology systems for semiconductor manufacturing. In this role, you will become an integral part of our R&D organization, contributing to the design, development, integration, and validation of advanced electrical and electronic systems used in ultra-high precision OCD metrology platforms.
Responsibilities
What will you be doing:
Design and develop analog, digital, mixed-signal, and electrical (AC/DC) subsystems for complex multidisciplinary products.
Design electronic boards and participate in schematic reviews, component selection, integration, validation, and production release activities.
Develop embedded firmware and engineering software tools for control, monitoring, automation, testing, and data acquisition applications.
Lead electrical integration activities from prototype phase through manufacturing transfer and product lifecycle support.
Prepare engineering documentation including specifications, schematics, wiring diagrams, test procedures, and design reports.
Participate in product specification reviews, architecture discussions, and multidisciplinary design reviews.
Collaborate with and lead external suppliers and manufacturers throughout development, qualification, and production activities.
Conduct hands-on laboratory testing, debugging, troubleshooting, root-cause investigations, and data analysis.
Lead technical development projects from initiation through successful delivery including supplier management.
Requirements:
B.Sc. in Electrical Engineering from a recognized academic institution.
At least 7 years of hands-on R&D experience in the development of electrical and electronic systems for multidisciplinary products.
Experience in analog and digital electronics design, development, integration, and troubleshooting.
Experience in electrical system design and integration, including AC and DC systems up to 220VAC.
Proven coding capabilities in C, C++, LabVIEW or Python, or equivalent engineering development environments.
Experience with embedded firmware development and debugging.
Knowledge of ECO, NCR, CAPA, and Failure Analysis processes.
Knowledge of electrical and electronic safety requirements and certification processes.
Demonstrated ability to leverage AI-based engineering tools to accelerate development, debugging, documentation, research, and problem solving.
Excellent verbal and written communication skills in Hebrew and English.
Advantages:
Experience in semiconductor equipment, medical devices, defense systems, printing systems, or other multidisciplinary high-tech industries.
Experience with FPGA development using VHDL or Verilog.
Familiarity with SEMI standards.
Experience working with systems that integrate optics, electronics, mechanics, and software.
Experience with sensors, cameras, motion-control systems, precision analog measurements, and data acquisition platforms.
Experience leading development activities involving global suppliers and contract manufacturers.
Experience leading technical projects from concept through implementation.
That special something you bring in:
Strong self-learning capabilities and ability to quickly master new technologies.
Ability to work independently and take ownership of complex technical challenges.
Strong troubleshooting and analytical problem-solving skills.
Team-player mindset with high motivation and accountability.
Problem solver, "can do" approach, never afraid of challenges.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8866742
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Location: Hod Hasharon
Job Type: Full Time
Required Senior HW architect
About the group:
We are a highly experienced architecture group specializing in switch processing, with deep expertise in both hardware and software architecture in the high-speed networking domain.
Our innovative packet processors power some of the most advanced data centers in the world and are designed into tier-1 vendor platforms. With state-of-the-art technology, a strong track record of industry recognition, and multiple award-winning achievements, we continuously push the boundaries of performance and scalability.
Our group is involved across the entire development lifecycle - from early research and architectural definition to silicon production - working on both research initiatives and production-grade products.
What will you be doing?
Lead research, evaluation, and architectural definition of next-generation chips - from requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet Switches.
Design the system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate closely with design, verification, and modeling teams to ensure architectural intent is fully realized.
Work cross-functionally with other architecture teams to shape cohesive system solutions.
Explore and evaluate new technologies and innovative approaches for future products.
Requirements:
:BSc / MSc / PhD in Electrical Engineering, Computer Engineering, or a related field.
7+ years of experience in VLSI / ASIC design, chip architecture, or micro-architecture of complex blocks.
Strong background in high-speed networking systems such as:
o Ethernet Switches
o NPUs
o NICs
o Traffic Managers
o Fabric Switches
o High-performance processors
Skills:
What Were Looking For
Excellent written and verbal communication skills in English.
Strong collaboration skills and the ability to work effectively across teams and disciplines.
Independent, self-driven, and capable of deep technical ownership.
Passion for innovation and cutting-edge technology.
Highly motivated with a proactive mindset.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8842877
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Verification SoC Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of an edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive cutting-edge distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead a team of chip verification engineers. Plan tasks, allocate people, hold verification design/code reviews, and drive verification execution.
Plan the verification of digital design blocks, including writing test plans, and other verification documents.
Work closely with Architecture, Software, Design, and Physical Design stakeholders to make technical decisions and represent project status throughout the development process.
Develop verification features and capabilities, and participate in RTL debug.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or a related field, or equivalent practical experience.
10 years of experience working with hardware verification languages (e.g., System Verilog/Specman), design verification methodologies (e.g., Universal Verification Methodology (UVM)) and chip design flow.
Experience in leading chip verification teams through the full lifecycle from concept to delivery.
Experience in creating chip or subsystem design verification strategies and plans.
Preferred qualifications:
15 years of experience in verification of complex SoC/ASIC.
10 years of experience managing verification teams.
Experience in chip design/verification of high performance AI/ML accelerators.
Experience with industry verification techniques, including complementary techniques such as formal verification, and emulation.
Experience in low power verification.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8843810
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Physical Design Lead, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Lead physical design of complex SoC to tape-out while working with multiple team members.
Evaluate and develop physical design methodologies and decide on the SoC flow.
Work with architects and logic designers to drive architectural feasibility studies, develop timing, power and area design goals, and explore RTL/design tradeoffs for physical design closure.
articipate in design reviews and track issue resolution, and engage in technical and schedule tradeoff discussions. Create execution plans for projects and manage team efforts from concept to working silicon in volume.
Understand architecture and design specifications with the larger team, and define physical design strategies and tactics to meet quality and schedule goals.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Science, or equivalent practical experience.
Experience in silicon implementation and chip integration.
Experience in ASIC development teams.
Experience in managing physical design teams working on digital designs that produce and deliver silicon.
Preferred qualifications:
Experience in extraction of design parameters and analyzing data trends.
Experience and breadth in engineering across physical design, top-level implementation, GDS tape-out.
Experience in top-level floor planning, block integration, static timing analysis, and sign-off.
Understanding of circuit design, device physics, and deep sub-micron technology.
Knowledge of delivery of high complexity silicon in technology process nodes.
Ability to lead cross-functional teams.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8847267
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
29/09/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent experience.
2+ years of relevant experience.
Proven experience in RTL2GDS flows and methodologies.
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
Great teammate.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8837147
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לפני 12 שעות
Location: Herzliya
Job Type: Full Time
We are seeking a highly skilled Emulation Engineer with extensive experience in the semiconductor industry to join our Chip Design team.

The ideal candidate will have a proven track record working with advanced emulation platforms, particularly Veloce, Palladium or Zebu.

Key Responsibilities:
Develop and maintain emulation models from RTL for complex SoC designs
Port RTL designs into emulation platform.
Debug hardware and software issues in pre-silicon environments.
Collaborate with frontend design, design verification, validation and software development teams to create comprehensive test strategies.
Set up and maintain emulation hardware infrastructure.
Develop workflows for efficient emulation processes.
Collaborate with emulator vendor field service engineers to resolve hardware issues.
Support users and debug issues.
Requirements:
Bachelor's or masters degree in electrical engineering, Computer Engineering, or related field.
5+ years of experience in emulation engineering within the semiconductor industry.
Extensive hands-on experience with Veloce, Palladium, Zebu, or equivalent emulation platforms.
Experienced in design or debug of complex SOC, ARM CPU, fabric and AXI and AHB busses, and interfaces (DDR, PCIe, USB etc.).
Strong understanding of RTL design, synthesis, and gate-level implementation
Proficiency in scripting languages such as Perl, Python, and Tcl.
Excellent problem-solving and debugging skills for complex hardware/software issues.
Familiarity with software debug tools and CPU/SoC architectures
Strong communication skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8879628
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19/10/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
Were looking for a talented Chipset System Engineer to join our innovative System Engineering group.
Responsibilities:
Participate in the development and production of radar sensors and chip-based (SoC) systems
Debug our Radar ASIC platforms, processors, and chip subsystems
Define subsystem requirements, technical specifications, interfaces, and development workflows for radar and chip-level systems.
Simulate and validate radar and chip system performance against defined requirements.
Solve complex multidisciplinary problems and drive debugging and system integration across chip and radar domains.
Support customer-facing product evaluations, from planning and execution through analysis and issue resolution.
Interface with multi-disciplinary product development team in support of design, integration and test of automotive radar and chip systems.
Requirements:
B.Sc in Electrical Engineering or related technical field
At least 3 years' experience as a System Engineer or Integration Engineer
Hands-on experience in Radar or other relevant fields like Sonar, Communications, or EW
Hands-on Matlab/ Python/ C experience
Readiness to work in a challenging startup environment
Entrepreneurial, self-directed and motivated.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8863737
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Location: Caesarea
Job Type: Full Time
Write and review micro-architecture specifications
Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements
Contribute to full chip integration, timing methodology, and analysis
Collaborate with verification engineers to resolve bugs and achieve coverage closure
Work with the physical design team to close timing and PnR issues
Support design methodology evolution and best practices
Perform debug, root-cause analysis, and post-silicon validation in the lab
Requirements:
B.Sc./M.Sc. in Electrical Engineering from a top university
RTL design experience
Familiarity with UVM and functional verification methodologies
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8837132
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 5 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8847274
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28/09/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for a passionate Senior Software Engineer to join our Chip Design CAD team. In this role, you will contribute and work at the interesting junction of electrical and software engineering, developing SW tools and solutions used to design the next generation of Smart Adapters, Switches and GPUs for advanced data centers across the world.


What you'll be doing:

Develop innovative SW solutions.

Take part in defining methodologies affecting design and verification engineers day-to-day work.

Improve existing tools, which are used in-house by electrical engineers for designing the next generation SoCs and Switches.

Collaborate with designers, verification specialists and architects to accomplish your tasks.
Requirements:
What we need to see:

Computer Science degree with excellent grades.

5+ years of practical experience.

Motivated, responsive, and keen on process improvement.

Strong analytical, debugging and problem-solving skills.

Strong programming skills, with familiarity using AI-powered development tools and workflows.


Ways to stand out from the crowd:

Experience in DA / CAD team.

Knowledge in FE/BE chip design or Dynamic verification.

Experience using AI-based IDEs, coding assistants, or agentic tools to improve development productivity.

Practical experience developing, configuring, or training AI agents to solve engineering problems.

Experience in a Linux environment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8835780
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Design Engineer, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHSIC Hardware Description Language (VHDL)), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience architecting networking ASICs from specification to production or equivalent experience.
Experience developing RTL for ASIC subsystems.
Experience in micro-architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience working with design networking: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience architecting networking switches, end points, and hardware offloads.
Experience working with software teams optimizing the hardware/software interface.
Experience in a procedural programming language (e.g., C++, Python, Go).
Knowledge of TCP, IP, Ethernet, PCIE and DRAM.
Familiarity with Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
This position is open to all candidates.
 
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28/09/2026
Location: More than one
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform advanced AI Static Timing Analysis (STA) for complex chiplet and full chip level.

AI use for timing optimization and data analysis in STA and PnR.

Running and build STA tools for anlyaze and debug timing.

Use traditional STA tools like Prime Time, review and debug timing paths, understand constraints, sdc generation, timing ecos generation.

Identify convergence risks and work closely with physical design, RTL and DFT teams, ensuring convergence throughout various project stages.

Responsible for a full timing closer and quality approval from pre-layout STA model through signoff.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering.

At least 5+ years of hands-on STA experience.

Experience in Prime Time and signoff methodologies.

A great teammate who thrives in a collaborative environment.

AI tools orientation or alternatively a desire to learn.


Ways to stand out from the crowd:

Agentic Frameworks.

AI prompting experience.

Experience in Linux environments.

TCL, Python, shell scripting abilities.

Experience with data collection and analysis.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Test Automation and Infrastructure Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high-volume manufacturing at wafer fabrications and Outsourced Semiconductor Assembly and Test (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next-generation of chips.
You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices, drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs
You will have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Responsibilities:
Provide tools, set the environment and create automation to silicon engineering (SiEng) teams, collaborate with Test, Product, quality and reliability (Q&R) and system-level test (SLT) teams.
Create smooth and effective ways to manage silicon engineering (SiEng) datastream to and from suppliers and internally, between different platforms, while optimizing formats and datalogs, convert per need.
Verify test solutions on pre-silicon models (simulation or emulation) and support Automated Test Equipment (ATE) test development setup and environment.
Develop test method for ATE platforms.
Provide pre and post silicon dashboards and indicators that will reflect the status, demonstrate progress and point on the gaps.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in test or product engineering, with experience in infrastructure and automation and people management experience.
Experience in pre-silicon validation, test content generation, ATE program development, big data handling and post-silicon enabling from New Product Introduction through high-volume manufacturing.
Experience with ASIC test methodologies (mbist, atpg, dft serdes, sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience in ATE hardware design and proliferation: loadboards/probecards, handler kits, sockets, and thermal control solutions.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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Location: Herzliya and Haifa
Job Type: Full Time
We're seeking a passionate and skilled Embedded Firmware Engineer to play a pivotal role in delivering the next generation of us. In this highly visible position, you'll be at the intersection of hardware and software, collaborating closely with logic designers to deeply understand system-level operations and performance requirements for hardware validation.

In this role, you will develop critical low-level embedded firmware specifically designed to validate hardware functionality, ensure conformance, and drive performance during the bring-up and testing phases of new silicon. This involves designing, developing, and integrating complex drivers, diagnostic tests, and infrastructure essential for SoC bring-up, post-silicon validation, and debugging activities. Ultimately, you'll lead hands-on firmware development, system-level validation, and problem-solving at the hardware-software interface in a dynamic, collaborative environment, with your work directly enabling the successful launch of future our products by ensuring our silicon meets the highest standards.
Requirements:
Minimum Qualifications
10+ years of experience in embedded firmware development within Real-Time (RT) or Embedded environments.
Strong proficiency in C, with a deep understanding of hardware-software interaction.
Hands-on expertise with Hardware-Software integrations, particularly for silicon validation and bring-up.
Exceptional debugging skills at the firmware and hardware level.
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or equivalent practical experience.

Preferred Qualifications
Experience with pre-silicon and post-silicon validation methodologies.
Familiarity with CPU architectures (e.g., ARM) and low-level system programming.
Direct experience with System-on-Chip (SoC) development or validation.
This position is open to all candidates.
 
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