Required Senior SOC Quality and Reliability Engineer, Cloud
You will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, you will work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. You will be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
As a part of this role, you will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams within the larger organization.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge/latch-up (ESD/LU), biased highly accelerated stress test (b/HAST), etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical quality and reliability models (including early life failure (ELF), time-dependent dielectric breakdown (TDDB), and negative bias temperature instability (NBTI)) to predict device failure mechanisms and lifetime behaviors.
דרישות:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field, or equivalent practical experience.
10 years of experience in IC silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing.
Experience working with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JSL.
Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques.
Proven track record with silicon reliability on process nodes and advanced packaging technologies.
Deep knowledge of Design-for-Reliability (DfR) rules and implementation techn המשרה מיועדת לנשים ולגברים כאחד.