We are looking for a highly skilled Senior RF Engineer to lead the design and development of next-generation imaging radars operating up to 81 GHz.
The ideal candidate has strong expertise in RF board design and high-frequency simulations, with a proven track record in delivering robust RF solutions for advanced RF systems
What will your job look like:
Lead the design and development of RF circuits and PCBs for mmWave applications up to 81 GHz.
Assist in the antenna design and integration
Conduct full-wave and circuit-level RF simulations (HFSS, ADS etc.) to validate design performance.
Optimize high-speed PCB layouts for minimal loss, crosstalk, and parasitics at mmWave frequencies.
Define and execute test plans, including lab measurements, characterization, and validation of RF systems.
Collaborate cross-functionally with hardware, digital, mechanical, and system engineering teams.
Document design methodologies, test results, and provide technical reports for internal and external customers.
Requirements: B.Sc. or M.Sc. in Electrical Engineering, RF/Microwave Engineering, or a related field.
8+ years of experience in RF design, with at least 3 years working in mmWave (60100 GHz) domain.
Strong experience with RF PCB design tools (Cadence Allegro/OrCAD).
Proficiency with electromagnetic simulation tools (HFSS).
Hands-on lab experience with VNA, spectrum analyzer, signal generators, and probe station measurements at mmWave frequencies.
Deep knowledge of antenna theory and design, including beamforming and phased array systems.
Solid understanding of RF link budget, impedance matching, and transmission line theory.
Experience in high-volume product development is a plus (automotive radar, satellite, or similar applications).
Excellent problem-solving, communication, and leadership skills.
Experience with 81 GHz radar or communication systems - Advantage
Knowledge of system-level architecture for phased arrays and MIMO systems - Advantage
Familiarity with thermal and mechanical constraints in high-frequency designs - Advantage
Background in RF packaging and integration (flip-chip, waveguide, transitions, etc') - Advantage.
This position is open to all candidates.