משרות על המפה
 
בדיקת קורות חיים
VIP
הפוך ללקוח VIP
רגע, משהו חסר!
נשאר לך להשלים רק עוד פרט אחד:
 
שירות זה פתוח ללקוחות VIP בלבד
AllJObs VIP

חברות מובילות
כל החברות
כל המידע למציאת עבודה
כל מה שרציתם לדעת על מבחני המיון ולא העזתם לשאול
זומנתם למבחני מיון ואין לכם מושג לקראת מה אתם ה...
קרא עוד >
גישה חיובית לניהול קריירה
תכנון קריירה וגיבוש מטרות עוזר להגיע אל היעד - ...
קרא עוד >
כיצד להצליח בתפקיד ניהולי ראשון?
בין אם קודמתם בתוך הארגון שלכם או שהתקבלתם למשר...
קרא עוד >
לימודים
עומדים לרשותכם
מיין לפי: מיין לפי:
הכי חדש
הכי מתאים
הכי קרוב
טוען
סגור
לפי איזה ישוב תרצה שנמיין את התוצאות?
Geo Location Icon

לוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
03/08/2026
Location: Yokne`am
Job Type: Full Time
Are you ready to join a team that's continually reinventing itself with innovative technology? Our Networking unit is at the forefront of delivering End-to-End High-Speed Ethernet and InfiniBand Solutions. We are seeking a creative and independent Product Engineer to help us maintain our leadership in the market by pushing the boundaries of speed and bandwidth.

What You'll Be Doing:

Maintaining high-quality product deliveries to customers by performing data and failure analysis.

Improving product performance by solving complex problems with the Process, Mechanical, Hardware, Test, and Thermal teams.

Leading high-impact task forces and working groups to drive critical initiatives.

Crafting and enhancing factory test plans to improve coverage, time, cost, and yield.

Driving yield improvement and addressing the failure Pareto.

Managing Failure Analysis for field and production failures.

Collaborating with different teams, including Customer Support, Marketing, Engineering, Quality, and Reliability, to ensure flawless execution.
Requirements:
What We Need To See:

B.Sc. in Material Engineering, Chemical Engineering or equivalent.

At least 3+ years of proven experience.

Strong background in statistics and data analysis (JMP).

Good understanding of manufacturing line.

Basic knowledge in optics and microelectronics.

Excellent presentation and interpersonal skills.

Proven problem-solving and prioritization abilities.

Effective communication skills with complementary teams and functional groups.


Ways to stand out from the crowd:

Hands on experience working with AI tools.

Experience in PCB assembly processes.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8765784
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
03/08/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for a Chip Design Verification Engineer to develop the next generation of DFT technologies.

As a Chip Design Verification Engineer in the DFT team at NVIDIA, you will verify the design and implementation of our DFT technologies in various projects. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting Switches, Nic and SoC product lines. We are working closely with a wide range of aspects - chip design, backend, verification and production testing. We are working on the most advanced technologies and complex products. Our DFT solutions are unique, innovative, and we are continuously looking for new and creative solutions to meet the challenging goals.

What you'll be doing:

In this position, you will be responsible for verification of the DFT design, architecture and micro-architecture using sophisticated verification methodologies.

As a member of our DFT verification team, you'll understand the design & implementation, define the verification scope, develop the verification infrastructure (Testbenches, BFMs, Checkers, Monitors), execute test/coverage plans, and verify the correctness of the design.

Collaborate with architects, designers, emulation, production testing and silicon verification teams to accomplish your tasks.
Requirements:
BSc. in Electrical Engineering or Computer engineering, or equivalent experience.

3+ years of practical verification experience.

Experience in developing verification environments and random based verification for unit level and system level using verification tools (simulation tools, Verilog, debug tools like Simvision/Debussy).

Experience with Specman is a plus.

Good understanding of RTL design (Verilog).

Strong debugging, problem solving and analytical skills.

Excellent communication and social skills.

Ability to work in a geographically diverse team environment.

Self motivated, independent and target oriented.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8765760
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
03/08/2026
Location: Yokne`am
Job Type: Full Time
As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What you will be doing:

Leading development of cutting-edge microelectronics packaging of our Networking Business Units future products, evaluating our products for reliability and performance.

Review manufacturability readiness at each milestone.

Work with world leading vendors to develop highly challenging packaging solutions.

Leading the development of groundbreaking microelectronics packaging for our Networking Business Unit's future products.

Collaborating with world-leading vendors to develop highly ambitious packaging solutions.

Thriving in a dynamic and challenging environment.

Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.

Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.

Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
Requirements:
What we need to see:

BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.

2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.

Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

High awareness for quality, robustness, and manufacturability.

High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

Curious and creative problem solver, well organized and multi-tasker.


Ways to stand out of the crowd:

Hands-on FEA mechanical simulation experience - Advantage.

Team / Group / Project management - Advantage.

Experience with manufacturing environment and manufacturing statistics tools.

Background in engineering semiconductor manufacturing processes.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8765571
סגור
שירות זה פתוח ללקוחות VIP בלבד
משרות שנמחקו
ישנן -28 משרות בצפון אשר לא צויינה בעבורן עיר הצג אותן >