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Power the Future with us! SolarEdge (NASDAQ: SEDG), is a global leader in high-performance smart energy technology, with over 3000 employees, offices in 33 countries, and millions of products installed in over 133 countries. Our diverse product offering comprises intelligent solar inverters, battery storage, backup systems, EV charging, and complete home energy management ecosystems. By leveraging world-class engineering capabilities and with a relentless focus on innovation, we strive to create a world where clean, green energy from the sun is the primary source of power for our homes, businesses, and just about everywhere we thrive.
Joining the Analog ASIC group means more than designing components – it’s your chance to shape and influence the entire system through system-level innovation and end-to-end ownership, from specification to real-world implementation. Our Analog ASIC group leads chip development at the core of SolarEdge products. We collaborate closely with system, software, and hardware teams to ensure complete optimization across the entire process. We are seeking a passionate, Senior Analog Engineer to join our team. In this role, you will be responsible for designing and developing complex analog and mixed-signal ICs for SolarEdge’s cutting-edge products in the renewable energy sector. What will you be doing:
* Architecture planning using behavioral models for simulation of analog and mixed-signal circuits.
* Design, implement and verify circuits & systems to meet product requirements including schematic entry, simulation, layout and supervision.
* Verification of analog and mixed-signal sub-systems and the entire design using transistor-level.
* Validation of design by laboratory measurement.
* Support product engineering to meet manufacturing and production needs.


Country:
Israel

City:
Herzliya

we are looking for best-in-class chip design engineers to join our outstanding networking silicon engineering team, developing the industry's best high speed communication devices, delivering the highest throughput and lowest latency! come and take a significant part in designing and verifying our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.
what you will be doing:
join beer-sheva/tel-aviv group, working on design in developing riscv core for network accelerators.
design of chip blocks/entities according to specifications under challenging constraints and with high orientation to power, area and performance.
daily work will involve design and might involve any or all aspects of chip development including design and micro-architecture.
work closely with firmware, software and other groups around the globe.
work mode: hybrid home-office.

As the Physical Design Chip Top Expert you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SoC Top level for chips that drive the worlds largest AI clusters. As PD Top Level Lead, you will own all PD disciplines of the Chip and own the T.O GDS that meet the chip signoff Criteria (Timing, LVS, EMIR, DRC, PV etc. ) ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

SoC Top level Ownership and oversee the Chip convergence.
Take full ownership of Top Level physical implementation, including floor planning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Work Closely with Package team on Bump map to Ballout taking into consideration all Signal integrity aspects

in this role, youll work to shape the future of ai/ml hardware acceleration. you will have an opportunity to drive tpu (tensor processing unit) technology that powers our most demanding ai/ml applications. youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our tpu. you'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on tpu architecture and its integration within ai/ml-driven systems.
our silicon team is driving the future of cloud data center computing. as a system on chip input output ( SOC io) architect, you will help define a new generation of our products. you will have pivotal responsibilities and serve as the organization mobile industry processor interface (mipi) focal point.the ai and infrastructure team is redefining whats possible. we empower our customers with breakthrough capabilities and insights by delivering ai and infrastructure at unparalleled scale, efficiency, reliability and velocity. our customers include, cloud customers, and billions of our users worldwide. we're the driving team behind our groundbreaking innovations, empowering the development of our ai models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. from software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our tpus, vertex ai for our cloud, global networking, data center operations, systems research, and much more.
responsibilities
evaluate different silicon solutions for executing mipi and other io peripheries: off-the-shelf components, vendor co-developments and custom designs.
drive vendor execution in various engagements: standard component, build to specification, and co-developments.
collaborate closely with software, design, verification, physical design, packaging, and silicon validation stakeholders to ensure that designs are complete, correct, and performant.
create high performance hardware/software interfaces.
collaborate in developing a new SOC.

we are now looking for a chip design engineer to join our switch silicon team for verification / design roles. as a chip design engineer at our networking business unit, you'll join a group of passionate engineers to design, implement and verify the next generation state-of-the-art switch silicon chips. in this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!
what you'll be doing:
work in a combined design and verification team which develops some of the switch silicon core units.
micro-architecture for rtl and simulation environment planning for units and modules.
design/verify rtl units/blocks according to arch. specifications under challenging constraints with high orientation to power, area, and performance.
build reference models, verify, and simulate chip blocks/entities according to specifications.
rtl synthesis, timing, supporting verification, and silicon post to activities.
work closely with multiple teams within organizations such as architecture, full chip micro-architecture, be, and fw.

We are now looking for a Senior Chip Design RTL Design Engineer for the Switch Silicon group.

As a Chip Design Engineer at NVIDIA's Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state of the art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What you'll be doing:

Work in a combined design and verification team which develops some of the switch silicon core units.

Plan and Design RTL units / blocks according to Arch & Micro arch specifications under challenging constraints with high orientation to power, area, and performance.

Build reference models, verify and simulate chip blocks/entities according to specifications.

Work closely with multiple teams within organizations such as Architecture, Micro- Architecture, and FW.

we are now looking for a motivated chip architect to use your creativity to work on the connectx network adapter with the highly inventive and knowledgeable team.
what you'll be doing:
define the network adapter chip architecture end to end from the market requirements through design and all product life cycles (post/pre-silicon, on deployments). work with related industry standards & customers on deploying your tech.
collaborate with teams across teams (physical design, logic design, system software, firmware, applications)
work on proof of concepts and advance development projects.
perform research and analysis for current and future architectures.
craft product design specifications.
serve as a focal point within the organization and distribute the knowledge that you acquire.

we are looking for an experienced engineer with a strong background in asic design to join our chip design methodologies team based in tel aviv and yokneam. this team is responsible for establishing asic design methodologies, developing shared code, providing design guidance, and driving the adoption of new technologies. it plays a key role in ensuring chip design teams operate efficiently and adhere to best practices. this role offers an exciting opportunity to think innovatively and make a significant impact within a dynamic, technology-focused organization.
what you'll be doing:
develop ground-breaking methodologies and innovations to create flawless experience in chip design development
utilize, develop and assimilate ai-based tools and flows
collaborate with chip design stakeholders and peers across the teams to understand existing problems and form the best solutions and methodologies
get in touch with eda vendors to learn about cutting-edge tools/technology and apply them into our development process
develop training sessions and guide designers with best design practices
develop shared design code and solutions to be widely used by the chip design team

we are looking for best-in-class chip design engineers to join our outstanding networking silicon engineering team, developing the industry's best high speed communication devices, delivering the highest throughput and lowest latency! come and take a significant part in designing and verifying our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.
what you will be doing:
join tel-aviv/beer-sheva group, working on verification in the field of encryption accelerators.
verification of chip blocks/entities according to specifications under challenging constraints and with high orientation to power, area and performance.
daily work will involve verification and might involve any or all aspects of chip development including micro-architecture.
work closely with firmware and other groups around the globe.
work mode: hybrid home-office.

we are looking for best-in-class chip design engineers to join our outstanding networking silicon engineering team, developing the industry's best high speed communication devices, delivering the highest throughput and lowest latency! come and take a significant part in designing and verifying our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.
what you will be doing:
join beer-sheva/tel-aviv group, working on design in the field of encryption accelerators.
design of chip blocks/entities according to specifications under challenging constraints and with high orientation to power, area and performance.
daily work will involve design and might involve any or all aspects of chip development including design and micro-architecture.
work closely with firmware and other groups around the globe.
work mode: hybrid home-office

looking for outstanding chip design Verification engineers to join our networking silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!
come and take a significant part in designing and verifying our ground-breaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.
what you will be doing:
work in a combined design and verification team which develops core units within the networking silicon.
build reference models, verify and simulate chip blocks/entities according to specifications and performance requirements.
work closely with multiple teams within organizations such as architecture, micro- architecture, full-chip, fw and post-silicon validation.
your daily work will involve all aspects of design verification: planning, coding, coverage and integration

The Signal-Integrity & Packaging (SIP) team manages the external electrical interfaces of Annapurna Lab's chip devices, focusing on signal integrity, power integrity, and electrical usage.
The team collaborates with the BackEnd team to integrate interfaces into the die, designs package layouts for BGA substrates, and conducts signal and power integrity simulations. The team partners with the system team to develop optimal pin-out and PCB breakout schemes, performs electrical characterization of interfaces, and develops software tools for debug and diagnostics.

As a SIP team member, the scope of your work will be focused on Package substrate layout, with a blend of Signal & Power integrity extractions and simulations, as well as also influencing the DIE I/O structures.

Key job responsibilities:
Design and Layout of large and complex package substrates.
Understanding package substrate technologies and layout design rules.
Proficiency in Signal and Power Integrity considerations.
Layout test studies of Die bump-out structures and Package substrate breakout.
Layout test studies of Package pin-out arrangements and PCB board implementation.
Continuously improve the package design work, by coming up with initiatives that drive efficiency, and in turn help improve quality/cost/schedule of the package layout work.

The position is for an entry level, and we will teach and mentor all aspects of the role. No prior hands-on experience in the above list is required.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

perform physical layout for mixed-signal functions like pll's, high speed i/o circuits, serdes, general i/o's, esd structures designs in state-of-the-art sub-micron cmos finfet technologies using cadence tools
you will work with asic and mixed-signal engineers to customize designs for integration in vlsi products.
job duties will include floor planning, custom layout and verifying against design rules and schematics, em/ir analysis

we are looking for a chip design micro architect for the networking silicon group.as a chip micro architect at our company networking business unit, you will join a group of passionate engineers to implement the next generation state-of-the-art bluefield dpu SOC and/or connectx nic that deliver breakthrough networking, security, cloud, ai and Storage performance to the ai data centers. as a design micro architect, you will make a real impact in a dynamic, technology-focused ai company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!
what you'll be doing:
you will be part of a small and exclusive micro-architecture team and have the opportunity to make a real impact in designing the micro-architecture of the next generation state of the art network card hand in hand with the product architect making sure implementation meets the product goals.
work closely with architecture and design teams to thoroughly understand system requirements and identify micro-architecture solutions, while weighing trade-offs related to performance, area and power consumption
break high-level arch requirements into lower-level design building blocks. focal point for the design team, reviewing implementation and guiding the team.
find bottlenecks early in the development cycle using performance analysis and simulations
use your understanding of the entire chip and system to identify and debug pre and post silicon full-chip issues