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As a Senior/Staff Design Verification Engineer, you will be a key architect of quality in our Israel R&D center. You won't just run tests-you will design comprehensive verification strategies for high-performance digital blocks, IPs, subsystems, and full-chip integration. You will work at the cutting edge of AI infrastructure connectivity where "good enough" isn't an option, owning end-to-end verification plans for our most challenging designs. If you thrive on solving complex verification challenges and want to ensure the quality of chips powering the world's largest AI clusters, this is your opportunity.

Key Responsibilities

Verification Environment Architecture & Development

Design and develop comprehensive ASIC verification environments across all levels-from unit-level and subsystems to full-chip integration
Build sophisticated SystemVerilog/UVM-based testbenches including protocol/traffic generators, monitors, checkers, and functional coverage models
Own end-to-end verification plans for highly complex digital blocks, defining the "how" and "what" to ensure 100% functional coverage
Quality Assurance & Debug Excellence

Drive the debug process and leverage advanced methodologies to find critical bugs before silicon
Develop and execute comprehensive test plans to verify functionality, performance, and corner cases
Ensure verification closure through rigorous coverage analysis and assertion-based verification
Cross-Functional Collaboration & Technical Leadership

Partner with design and system architects to solve intricate hardware verification challenges
Work alongside world-class teams where knowledge sharing and technical excellence are the standard
Contribute to verification methodology improvements and automation initiatives

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Automation and Signoff to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the backend execution environment and methodologies for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the physical implementation environment. Your primary mission is to develop, optimize, and support automated flows from RTL to manufacturable GDSII tape-out, ensuring a methodical and efficient work environment for the entire PD team.


Key Responsibilities


Develop and maintain automated flows for Synthesis, Place & Route (P&R), and Floor-planning to ensure seamless design transitions
Implement and manage robust environments for Static Timing Analysis (STA), Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write and maintain custom plug-ins and scripts (Tcl/Python) to extend vendor tool capabilities, tailoring them to specific process node constraints
Build automated "dashboards" and feedback loops to track and improve Power, Performance, and Area (PPA) metrics across design iterations
Own the design database structure and version control to ensure team alignment and data integrity
Collaborate directly with EDA vendors (Synopsys, Cadence, Siemens/Mentor) to troubleshoot flow issues and analyze tool results
Provide technical support to the broader PD team, helping them optimize individual blocks for power, performance, and timing

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Extraction to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.

Key Responsibilities

Develop, qualify, and maintain automated RC extraction flows for high-performance AI SoCs
Own the setup and validation of foundry technology files (e.g., StarRC/Quantus techfiles, TLU+, ITF) across various process corners
Perform correlation studies between different extraction tools and 3D field solvers (e.g., Raphael, QuickCap) to ensure modeling accuracy
Collaborate closely with the Signal Integrity (SI) and Power Integrity (PI) teams to provide accurate parasitic data for critical high-speed nets and power grids
Implement automated scripts (Tcl/Python) to streamline extraction regressions, data parsing, and PEX-to-STA (Static Timing Analysis) handoffs
Analyze the impact of layout effects (LDE) and parasitics on timing and power, providing feedback to the implementation team to optimize PPA
Interface with EDA vendors and foundries to resolve extraction tool bugs and methodology gaps related to advanced nodes (5nm/3nm)

we're seeking a highly skilled Physical Design Engineer specializing in EMIR & Power Integrity to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As a Physical Design Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will execute the Electro-Migration and IR Drop (EMIR) analysis and sign-off from block level to full-chip, working closely at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering. You will be responsible for validating power grid architectures to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Execute static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from the block level through to full-chip sign-off
Implement and maintain robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Work with Physical Design teams to implement optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Collaborate closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Perform root-cause analysis for voltage drop violations and EM risks, proposing and implementing layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with strict foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient

As a Staff Physical STA Expert , you will hold the keys to silicon success. You will be leading the STA activities end-to-end from Chip partition, Time budgeting through signoff of all the chips we develop. You will build and lead the STA team to run several chips signoffs in parallel. In addition, You will define the sign-off methodology for chips that power the worlds most advanced AI clusters. You will act as the central nervous system of the design process, bridging the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Take full ownership of the STA flow and sign-off methodologies. You will establish the rigorous criteria that ensure our products succeed in the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams. You will lead timing reviews and work closely with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints from the ground up, ensuring they are robust across multi-scenario environments
Tackle the challenges of cross-chip clock distribution networks and sophisticated margining techniques, ensuring robust silicon across all process corners
Have a passion for better workflows? Youll participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and in-house automation to make our sign-off process faster and smarter

we're seeking a visionary Formal Verification Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the formal verification strategy for chips that power the world's largest AI clusters.

As the Formal Verification Engineer, you will be a foundational member of our Israel R&D center. You wont just execute tasks; you will define the Formal verification strategy for chips that drive the worlds largest AI clusters. You will dive deep into the technical details, proving the correctness of complex designs and ensuring they flawlessly meet specifications.

Key Responsibilities

Own and develop formal verification environments from scratch through to sign-off
Apply formal verification methodologies and strategies to prove the correctness of intricate designs
Work closely with the Architecture, Design, and DV teams to identify verification needs and pinpoint design requirements
Create robust formal environments, analyze complex RTL designs, and apply advanced formal techniques to find corner-case bugs
Analyze verification results, identify failures, and collaborate directly with designers to resolve issues efficiently
Architect and develop generic, common formal functions and properties to be reused across multiple projects

seeking a skilled and motivated Data Scientist. This individual will play a pivotal role in identifying key data points for collection, developing strategies to accumulate data and deriving actionable insights an anomaly based on a solid foundation of relevant know-how. Also, will also be responsible for creating, testing, and deploying scripts and methods for data collection and analysis to support decision-making. The Engineer will collaborate with cross-functional teams to identify critical data sources to determine the most effective data collection strategies, will develop automated and scalable data collection pipelines, will ensure data quality, integrity, and consistency across all sources and may use AI techniques to refine the results toward failures predictions.

Define the AI core architecture that will shape the next generation of AI chips, leading the global competition in AI computing power. As a key contributor to the competitiveness of AI core architecture, we drive chip architecture innovation starting from algorithm evolution, building a full-stack closed-loop capability of "algorithm-architecture-circuit-system," and creating a globally leading, independently controllable AI accelerator core to support the Ascend AI ecosystem and the implementation of large model strategies.
Responsibilities:
Modeling of HW specification of new architecture and microarchitecture. Working closely with architect and microarchitecture on modeling the specification.

We are currently looking for a Performance Simulation Expert develop and evaluate next generation performance features as well as develop the future generation of our Compute system simulation infrastructure, models and analysis tools
Responsibilities:
Develop and analyze performance and power features in our cycle accurate pre-silicon model and improve the accuracy of the current Server system simulator
Design the architecture of the new generation system simulation platform that will be used to analyze performance of Server (Compute and AI) workloads and identify performance bottlenecks
Develop new technologies, methodologies and tools for simulation. Analysis and debug of applications and workload on Huawei servers
Propose and simulate optimizations and innovations on the HW and SW in order to improve server performance for given workloads
Distribute the simulation platform, train and support other teams in China and in Europe using the simulation platform, technology and methodology.

Looking for a CPU performance modeling architect to take responsibility over the performance aspects of new CPU instructions or modes of operation. The role includes but is not limited to:
Partners with lead SW and HW architects to co-invent optimal HW and SW solutions that come to address requirements. Influences the direction based on experiments and simulation data
Models CPU functionality, performance and/or power in pre-silicon simulators
Defines and runs performance experiments to aid feature definition. Such experiments can be performed on a pre-silicon simulation environment or in a real system or on a combination of both or even in combination with analytical models
Provides experimental/proof of concept for new features and implementation alternatives meeting performance constraints.
Analyzes the bottlenecks of current CPUs on workloads that reflect CPU future usages
Potentially (in the future), lead a team doing above activities
An adequately qualified candidate can also become the leader of definition for some features in addition to all the roles above.

Looking for a CPU Architect for codesign of HW/SW feature for our CPUs for cellphones and servers. The role includes but is not limited to:
Analysis of technical challenges and determination of whether to solve them by a combination of new HW and new SW or by only one of these
Invents corresponding HW features and SW solutions to address above challenges. Evaluates feasibility tradeoffs, explores, and defines new approaches and novel architectures for CPU. Develops the end-to-end architecture of new instructions (when applicable) in coordination with partners. Drives the inclusion of the feature in a CPU project working with micro-architects, designers and verification experts. (the HW/SW features are typically in the form of new instructions or of other Instruction Set constructs and belong to one of following domains: dense compute, general purpose accelerations, use case specific accelerations, system level instructions, Security related technologies, or instrumentation instructions.
Models CPU functionality, performance and power in simulators, analyzes the bottlenecks of current CPUs on workloads that reflect CPU future usage.
Provides experimental/proof of concept changes for proposing design alternatives meeting performance, power, area, and timing constraints.
Reviews and influences cross functional roadmaps.
Collaborates with SW and HW architects, design, verification, and validation engineers during the execution of the project. Finds mitigations for issues that arise during implementation of his/her features.

Looking for a CPU Architect with expertise in HW/SW codesign of dense computational logic (e.g., vector, matrix)
The role includes but is not limited to:
Analysis of technical challenges in relevant use cases and determination of whether to solve them by a combination of new HW and new SW or by only one of these
Analyzes the bottlenecks of current CPUs on workloads that reflect CPU future usage.
Invents corresponding HW features and SW solutions to address above challenges. Evaluates feasibility tradeoffs, explores, and defines new approaches and novel architectures for CPU. Develops the end-to-end architecture of new instructions in cooperation with partners. Drives the inclusion of the feature in a CPU project working with micro-architects, designers and verification experts.
(Preferably) models CPU functionality, performance and power in simulators.
Provides experimental/proof of concept changes for proposing design alternatives meeting performance, power, area, and timing constraints.
Reviews and influences cross functional roadmaps.
Collaborates with SW and HW architects, design, verification, and validation engineers during the execution of the project. Finds mitigations for issues that arise during implementation of his/her features.