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We are searching for an MSc Graduate continuing to a Ph.D studies to join combined work efforts at the advanced research group, at both Bar Ilan university lab and us in Yokneam site. This role offers an opportunity to be immersed in an environment focused on groundbreaking research and development in advanced materials and device simulations.

What you'll be doing:

Synthesis and fabrication of advanced materials, including characterization using techniques such as SEM, TEM, and Raman spectroscopy.

Performing device simulations and electrical measurements (DC and RF).

We are looking for a Manufacturing Technology Process Engineer someone who is excited to join a growing group of diverse individuals responsible for handling high-mixed manufacturing technologies challenges.

What youll be doing:

Work with SI, Thermal, Hardware engineering, IC development team to examine and understand road map requirements, understand the gaps. Collaborate with PCB, PCBA, materials vendors, R&D teams and management, drive capabilities to overlap with our NETWORKING needs.

DFX: Build and Sustain design guidelines for functionality, test ability, reliability, cost. Become an active member in industry Eng. forums, IPC, HDPUG, SMTA... Reflect our interest and affect Industry specs & agenda. Preform Industry Benchmarking.

Ongoing PCB/PCBA activities: New materials from Selection to Implementation. New manufacturing technologies study, proof of concepts and implementation on products. Provide ongoing technological and process improvements to meet quality, cost and production goals. Engage with production line work. Provide ongoing production support to ensure continuous production.

PCB, PCBA reliability modelling.

Drive CMs to excellence in aspects of manufacturing process, quality management and HVM mindset.

We are looking for a creative and independent Reliability Product owner. Our Networking unit has continuously reinvented itself over two decades. Our high-speed buses & network products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting End-to-End High-Speed Ethernet and InfiniBand Solutions We're looking to grow our company and build our teams with people who can join us at the forefront of technological advancement. We need a creative individual who will help transfer Network Silicon ICs products (Switch, NIC, SmartNic) from design engineering to mass production while ensuring meeting our milestones at high quality and reliability.

You will be exposed to various aspects of product qualification and will be responsible for integrating all future Network IC products reliability activities, from product risk assessment, failure mechanisms and reliability tests. You will define and prioritize the reliability milestones and drive the required activities to meet our compony goal. Your work will include multiple interfaces and phases from foundry through hardware, testing and quality & reliability Milestones requirements. If you are passionate about enabling of the highest quality Network products that will change the world, we want to hear from you!

What you'll be doing:

Prepare gap analyses and risk assessment based on Silicon and package product related features.

Prepare JEDEC based qualification plan for product reliability.

Interact with Hardware, Test Engineering, External vendor, NPI team to plan and lead all product aspects of reliability.

Apply trade-offs for material and schedule where necessary based on deep understanding of the product.

Problem solving leadership and re-planning as necessary.

Product parameters analysis and debug as necessary.

Monitor and supervise program progress to pre-defined milestones.

Want to take part in realizing the next generation of on-chip optical communication platforms for data centers? NVIDIA's Electro Optics group is looking for an experienced Electro Optic Engineer to join us in our captivating experimental lab efforts to develop, test and characterize Silicon Photonics based high-speed optical communication devices. The role involves development and implementation of electro optical experimental setups from the basic component level all the way to link-level high-speed characterizations and post-Silicon testing.

What you'll be doing:

Characterization of electro-optical components and subsystems in their development stage, including development of novel electro-optical characterization setups.

Be a part of a highly skilled and professional team, and work closely with experts in the field of Silicon Photonics.

Work with top of the art high-speed testing equipment (Scopes, PPG, AWG, BERT).

Define testing requirements for new sub-systems based on electrical and optical specifications.

Get involved in projects of R&D teams developing future capabilities.

We are looking for a Manufacturing Technology Process Engineer someone who is excited to join a growing group of diverse individuals responsible for handling high-mixed manufacturing technologies challenges.

We have continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI the next era of computing. We are a learning machine that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our lifes work, to amplify human creativity and intelligence. Make the choice to join us today.

What youll be doing:

Work with SI, Thermal, Hardware engineering, IC development team to examine and understand road map requirements, understand the gaps. Collaborate with PCB, PCBA, materials vendors, R&D teams and management, drive capabilities to overlap with our NETWORKING needs.

DFX: Build and Sustain design guidelines for functionality, test ability, reliability, cost. Become an active member in industry Eng. forums, IPC, HDPUG, SMTA... Reflect our interest and affect Industry specs & agenda. Preform Industry Benchmarking.

Ongoing PCB/PCBA activities: New materials from Selection to Implementation. New manufacturing technologies study, proof of concepts and implementation on products. Provide ongoing technological and process improvements to meet quality, cost and production goals. Engage with production line work. Provide ongoing production support to ensure continuous production.

PCB, PCBA reliability modelling.

Drive CMs to excellence in aspects of manufacturing process, quality management and HVM mindset.

Our Networking IC Product Engineering team is looking for a Post Si Characterization and Validation engineer, to take part of Network ASIC, SOC and SiPh ICs characterization efforts of speed, logic, memory, power and analog circuits both using ATE and system level testing. We are in need of hardworking and motivated engineers. Do you have passion for data analysis, post-Si hand on work and problem solving? We will be happy to have you on our team!

What you'll be doing:

The position includes taking ownership of characterization of IC performance and power parameters, developing new characterization and analysis capabilities, enabling the qualification of new and improvement of future products. You will define and build the required tests, perform the analysis and present the results and conclusions to a wide forum including leading designers and high level executives.

Take important part in definition of requirements for post-SI validation, as well as IC power and performance characterization.

We offer an exciting work environment, with many new learning experiences and interactions with people from different aspects of the company. Our company employs some of the best engineers in the communication field from all across the world, working on innovative technology and developing new and daring projects.

We are searching for hardworking engineers, that will lead new projects starting from the product definition phase, until the mass-production phase, working closely with several other teams, including chip design, power architecture, and BE.