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We have been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. Its a unique legacy of innovation thats fueled by great technologyand amazing people. Come join the team and see how you can make a lasting impact on the world. As an Optical Assembly Process Engineer, you become part of the company`s R&D team, and you will be working on the forefront of the communication technology, building the interconnection infrastructure for the Sophisticated Computing and Artificial Intelligence revolution.

What you'll be doing:

Participate in the process of bringing up a new technology from the R&D stage, to the engineering and bring-up then to the high volume manufacturing lines.

Characterizing and investigating of the compatibility of new adhesives, soldering material, packaging material, etc. , to the optical, interconnect products.

Running both quick and organized experiments related to materials, using dispensing and UV curing tools.

Running scanning electron microscope for many hours.

Help in the debug of failures using various methods inspection and characterization methods.

We are looking for a product marketing manager to identify, characterize, and validate new technology developments. The product marketing manager is integral to our Corporate CTO group (reporting to the VP of new technologies) and will interface with our corporate and divisional marketing teams.
Responsibilities:
Lead product management of new development activities from the pre-idea stage to a well-defined, justified, and feasible development project.
Analysis of industry situation, market trends, and customer challenges to identify potential new technological developments (working with the Corporate Marketing teams).
Define the requirements and value statement for new technological developments (working with the CTO new-tech team to balance technological capabilities and customer needs).
Validate potential new technological developments with customers and industry leaders.
Work with the marketing teams to provide ROI, justification, and market analysis for new directions.

We are looking for an IC Package Engineer. Our GPUs and SOCs are the world leaders in performance and efficiency, and we are continually innovating in creative and unique ways to improve our ability to deliver extraordinary solutions in a wide range of sectors. We are seeking Package Engineers who are passionate about what they do and are committed to making a difference in the world through their inventions.

Package engineer will join IC package development team in Yokneam, leading advanced IC packaging projects at the cutting edge of technology. In this position you will collaborate with the best technical and design teams, plan schedules, resolve costs and lead packaging, manufacturing, and electrical design issues. You will be working with worlds leading manufacturers.

What you'll be doing:

Leading development of cutting-edge microelectronics packaging of our Networking Business Units future products.

Work with world leading vendors to develop highly challenging packaging solutions.

Lead packaging and manufacturing related activities and projects, from R&D to production.

Work in a dynamic and challenging environment.

Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues.